No-Fault Development: Building Rock Solid Solutions with Industrial Computers Keith Williamson Manager Technical Marketing CompactPCI Product Organization Motorola Computer Group

Agenda Why go standards-based for telco? The PICMG family of platforms Intrinsic HA features HA networking standards HA systems management standards The future of PICMG

Why Standards-based Industrial Computers? Ubiquitous Form Factor Ruggedized Wider Range of Payload Scalability Interoperability Long Product Life Improved Costs and Time to Market Safety / EMC / EMI / Environmental Universal Networking and Storage Common System Management Multi-member and Cross Industry Participation Architected for High Availability! Industry standards impact a variety of aspects within the design and development of industrial computing equipment. Original Equipment Manufacturers (OEMs), Service Providers and hardware, software and silicon suppliers have all recognized the need for industry standards. Ubiquitous Form Factor: A common form factor allows for vendor flexibility across platforms and boards. It allows for the interoperability and interexchange of equipment. A customer is not locked to a proprietary design, be it their own or a vendor’s. Wider Range of Payload : A wider range of payload options is available through industry standards. A customer can now choose between a variety of vendor’s hardware/software/silicon to meet their capacity, functionality, schedule and cost requirements. Long Product Life: Industry standards equate to long product life. Since standards typically outlast actual product life cycles, a customer has the advantage of extending the life cycle of their particular product and application. Also, vendors are more likely to continue the support of standards based products. Improved Costs and Time to Market: Industry standards improves the availability of needed product which translates to improved cost and time to market. Standards also improve the competitiveness of products resulting in improved costs and schedules. Interoperability: A key to any network component is interoperability. Industry standards allow communication and non-interference to exist between integral components within a network architecture. Clear Upgrade Path: Embedded in most industry standards is a clear upgrade path. This allows a allows a customer to choose a particular standards approach with confidence that their future capacity and functional requirements will be addressed through a smooth transition to future standards. An example is PICMG’s evolution plans from CompactPCI to AdvancedTCA. Safety / EMC / EMI / Environmental: A critical component to any product design is adherence to safety, EMC, EMI and environmental standards. Products must behave as designed within their designated operating environments which includes temperature, humidity, EMC and vibration. Products must also be able to survive the transport environment as defined by standards. These products should not pose any safety hazards or electromagnetic interference on other components within the environment. Universal Networking and Storage: Closely related to interoperability, networking and storage protocols defined by standards allows for universal switching, routing and storage methodologies across network components. Sophisticated applications such as security and QoS can be supported across a variety of network components. Common System Management: Users and service providers prefer a common system management infrastructure and interface across their network components. Industry standards allows for this common infrastructure. Design cycle time for system management interfaces is greatly reduced. Multi-member and Cross Industry Participation: A solid benefit of industry standards is the contributions from a consortium of users and suppliers within and across industries. Even though the creation of standards can be contentious, the results usually bring out the best and most practical requirements that benefit the majority of participants.

Standards for Industrial Computers SAFETY/EMC/EMI FCC CE ENVIRONMENTAL NEBS - GR-GS-CORE ETSI – IEC / ETS / UL MECHANICAL / ELECTRICAL / FORM FACTOR IEEE VITA PICMG NETWORKING Layer 2/3 IP VLAN DiffServ IPv6 STORAGE RAID SCSI FibreChannel SYSTEM MANAGEMENT OPENIPMI SNMP SAF This slide depicts examples of addressed standards for next generation platforms; in this case, the MXP Packet Transport Platform. The slide is meant to represent the variety of standards that are considered for the development and design of a next generation platform and its respective payload. Environmental standards cover temperature, relative humidity, office vibration, transportation vibration, earthquake, drop, altitude, acoustic noise, heat dissipation, fire resistance and materials, illumination and airborne contaminants. Manufacturers will either claim that their products ore “designed to meet” NEBS and ETSI, or certification testing will be be completed for a reference configuration to claim compliancy. IEEE and VITA specify a variety of mechanical and electrical requirements. PICMG refers to VITA/IEEE requirements along with additional form factor specifications. Beyond design and development standards are the quality related standards that impact the entire development and manufacturing process. These standards are usually driven by the quality organization with a company. NEBS – Network Equipment Building System ETSI – European Telecommunications Standards Institute IEEE – Institute of Electrical and Electronics Engineers VITA - VITA was accredited as an ANSI (American National Standards Institute) standards development organization (SDO) in June of 1993. In 2001, the VSO was recognized as a Industry Technical Agreement (ITA) submitter by the IEC.

Agenda Why go standards-based for telco? The PICMG family of platforms Intrinsic HA features HA networking standards HA systems management standards The future of PICMG

What is PICMG? CompactPCI  PCI Industrial Computer Manufacturers Group founded in 1994 and headquartered in Wakefield, MA. PICMG is a consortium, with over 600 members “who collaboratively develop open specifications for high performance telecommunications and industrial computing applications” PICMG is the standards body that, to date, manages two standards: PCI-ISA Passive Backplane – PICMG 1.x CompactPCI (6U Eurocard Form Factor) – PICMG 2.x PICMG has begun development of a new series of standards, AdvancedTCA™ -- PICMG 3.x From www.picmg.com (9/0/03) What is PICMG PICMG (PCI Industrial Computer Manufacturers Group) is a consortium of over 600 companies who collaboratively develop open specifications for high performance telecommunications and industrial computing applications. The members of the consortium have a long history of developing leading edge products for these industries. PICMG specifications include CompactPCI® for Eurocard, rackmount applications and PCI/ISA for passive backplane, standard format cards. Our Mission Founded in 1994, PICMG's original mission was to extend the PCI standard, as approved by the PCI Special Interest Group (PCI SIG), for computer systems such as PCI/ISA, PCI/EISA and the PCI/3U or 6U Eurocard form factor known as CompactPCI. PICMG continues to develop important extensions and improvements to CompactPCI. Recently, PICMG announced it was beginning development of a new series of specifications, called AdvancedTCA™, for next-generation telecommunications equipment, with a new form factor and based on switched fabric architectures. Our Purpose PICMG's purpose is to offer equipment vendors common specifications, thereby increasing availability and reducing costs and time to market. The PCI specifications provide a clear upgrade path for OEMs wishing to migrate to new designs. PCI-ISA: Peripheral Component Interconnect – Industry Standard Architecture Eurocard: “A series of mechanical board form factor sizes for rack-based systems as used used in VME, Multibus II and other applications defined by IEEE and IEC.” Visit http://www.picmg.com/ for membership information or to order specifications for members and non-members.

A Family of PICMG Specifications 1994 2002 2003 2004 2005 CompactPCI  (Industrial Control) (Military Aerospace) (Telecom) Specific to Telecom Market CompactTCA ™ CompactPCI started about 9 years ago. It was intended to serve multiple markets including Industrial, Military, and Telecom. Since then, there have been many additional standards added under the CPCI umbrella – to the extent now that we no longer have any room on our front-plates to carry all the necessary glyphs! This leads to confusion, and in the end, problems with interoperability. AdvancedTCA is the first open specification dedicated to the telecom market space. It was intended to serve specifically that one market and is intended to be useful for many years. New “form factors” only come along every 8 - 10 years. CompactTCA is a new effort underway to take the portion of CompactPCI that applies to telecom and create a more unified, consistent specification. This will increase interoperability and reduce integration times. This is still work in progress – expected to be ready by the end of 2004.

Agenda Why go standards-based for telco? The PICMG family of platforms Intrinsic HA features HA networking standards HA systems management standards The future of PICMG

Mechanical/Electrical/Form-factor Intrinsic HA Features Mechanical/Electrical/Form-factor PICMG 2.0 R3.0 - CompactPCI Core Specification Provide systems that are electrically compatible with PCI systems CompactPCI Features, per PICMG 2.0, include: 33 and 66Mhz PCI performance 32- and 64-bit data transfers 8 CompactPCI slots per bus segment at 33 MHz 5 CompactPCI slots per bus segment at 66MHz Industry standard software support 3U small form factor (100 mm by 160 mm) 6U form factor (233.35 mm by 160 mm) IEEE Eurocard packaging Wide variety of available I/O System Management Bus PICMG 2.0 R3.0 was ratified October 1, 1999. CompactPCI extends PCI into industry systems. MCG’s CPX and MXP family platforms adhere to PICMG 2.0, except that MXP products do not use the CompactPCI bus defined by this specification.

Intrinsic HA Features Environmental: Humidity, Temp, Earthquake, Noise, Fire Resistance, Vibration NEBS : GR-63-CORE IEC60068-2 ETS300 UL1950 ISO7779 Safety/EMC/EMI Safety: CSA C/US, VDE 0805 EMC/EMI: FCC Part 15, CE Mark PICMG 2.0 R3.0 was ratified October 1, 1999. CompactPCI extends PCI into industry systems. MCG’s CPX and MXP family platforms adhere to PICMG 2.0, except that MXP products do not use the CompactPCI bus defined by this specification.

Agenda Why go standards-based for telco? The PICMG family of platforms Intrinsic HA features HA networking standards HA systems management standards The future of PICMG

HA Networking PICMG 2.16 R1.0 – CompactPCI Packet Switching Backplane Specification 802.3ab 10/100/1000BT auto-negotiating 8 wire point to point links Star Network Topology Node Slots with two links per node on J3 Fabric Slots support 20 or 24 nodes Larger Payload Systems have redundant fabric slots PICMG 2.16 R1.0 was ratified on September 5, 2001. Along with PICMG 2.9, PICMG 2.16 distinguishes the MXP platform from MCG’s traditional CPX platforms. Embedded ethernet as provided through 2.16 significantly reduces external cabling and switching required for IP based applications. The MXP platform supports 10/100/1000BT transport through redundant fabric switches using a dual star topology.

HA Networking High Availability approaches: Use redundant switches IP and MAC addr failover for nodes Bonding Mode 1 for Linux nodes Switch vendor supplied link failover Link Aggregation (802.3ad) PICMG 2.16 R1.0 was ratified on September 5, 2001. Along with PICMG 2.9, PICMG 2.16 distinguishes the MXP platform from MCG’s traditional CPX platforms. Embedded ethernet as provided through 2.16 significantly reduces external cabling and switching required for IP based applications. The MXP platform supports 10/100/1000BT transport through redundant fabric switches using a dual star topology.

HA Networking PICMG 2.5 R1.0 – CompactPCI Computer Telephony Extends CompactPCI to support Computer Telephony applications. Included is a hot-swappable backplane based TDM bus (ECTF H.110) Supports 4096 64Kbps time slots (2048 bi-directional DS0s) PICMG 2.5 R1.0 was ratified on April 3. 1998. PICMG 2.5 allows for the inclusion of a TDM (H.110) bus within the CompactPCI architecture. The CPX and MXP families both have options for the PICMG 2.5 H.110 implementation. MCG expects circuit-switched applications to be around for some time; PICMG 2.5 allows for continued support of these applications and networks.

HA Networking GR-253-CORE SONET/SDH Automatic Protection Switching ATM over SONET/SDH Packet Over SONET/SDH I.630 ATM Protection Switching Bridge Selector Working Entity PICMG 2.5 R1.0 was ratified on April 3. 1998. PICMG 2.5 allows for the inclusion of a TDM (H.110) bus within the CompactPCI architecture. The CPX and MXP families both have options for the PICMG 2.5 H.110 implementation. MCG expects circuit-switched applications to be around for some time; PICMG 2.5 allows for continued support of these applications and networks. 1+1 Linear APS Protection Entity Protection Function

Agenda Why go standards-based for telco? The PICMG family of platforms Intrinsic HA features HA networking standards HA systems management standards The future of PICMG

HA Systems Management PICMG 2.1 R2.0 – CompactPCI Hot Swap Extends CompactPCI to hot swap applications Specifies the required features to allow silicon, board and system vendors to develop Hot Swap capability Assigns a framework of terminology and overall architecture for Hot Swap systems This is not a “detailed” specification for a Hot Swap Compact system Specific implementation for Hot Swap software routines is not defined PICMG 2.1 R2.0 was ratified January 17, 2001. Hot Swap is a key function for High Availability systems. CPX and MXP platforms and respective payload boards adhere to this specification.

HA Systems Management PICMG 2.9 R1.0 – CompactPCI System Management A standard method for managing CompactPCI Platforms Based on Intel’s IPMI architecture Significant third party hardware and software support improved device monitoring and diagnostic capabilities Distributed nature of IPMI management removes necessity for system management bus (CompactPCI) PICMG 2.9 R1.0 was ratified on February 2, 2000. Along with PICMG 2.16, PICMG 2.9 distinguishes the MXP platform from MCG’s traditional CPX platforms. MXP Intelligent Platform Management Interface (IPMI) is implemented with all slots within the platform being radially connected through Intelligent Platform Management Bus 0 (IPMB 0) to the Alarm Management Card (AMC). The AMC supports the Baseboard Management Controller (BMC) function as defined by PICMG 2.9. IPMI allows for the removal of the CompactPCI bus (per PICMG 2.0) and the reliance on bridging. This provides the basis for a purely distributed architecture that is not reliant on system host slots.

SAF Compliant Middleware HA Systems Management SAF Compliant Middleware SAF AIS: Interface between an HA application and the HA middleware Cluster Management Checkpoint Service Event Service Message Service Global Lock Service Availability Management SAF HPI: Interface between the HA middleware and the hardware Middleware interface to the IPMI subsystem HA Application SAF Middleware Platform H/W AIS HPI

Agenda Why go standards-based for telco? The PICMG family of platforms Intrinsic HA features HA networking standards HA systems management standards The future of PICMG

CompactTCA CompactTCA is ... Interoperability CompactTCA is ... A system specification CompactTCA is ... A single specification for combination of popular PICMG 2.x standards 6U CPCI form factor, connectors, power, cooling (PICMG 2.0) Hot Swap (PICMG 2.1) IPMI (PICMG 2.9) PSB (PICMG 2.16) Communication Architecture based on Ethernet/IP No PCI bus to be maintained S/W architecture based on network nodes Planned Optional Interconnects PICMG 2.5(H.110), 2.17(Starfabric) and 2.20(Mesh) This slide takes a look at the basic premise of CTCA in more detail. CTCA marks a general move towards the blade mode of operation.

cPCI vs ATCA 2002 2003 AdvancedTCATM (PICMG 3.0) Serial Mesh Fabric (3.4?) Ethernet Fabric (3.1) System Management Larger, more functional modules Higher Density, Power Central Office in a box PICMG 2.xx 2002 2003 PICMG 3.xx High Availability OS PICMG 2.xx Serial Mesh Fabric (2.20) Ethernet Fabric (2.16) System Management (2.9) Modular Resources General Purpose Processors Network Processors Packet Processors Digital Signal Processors

Quick Comparison CompactPCI® AdvancedTCATM 6U x 160 mm 0.8” pitch (20.32 mm) 57 in2 (368 cm2) 50 Watts In the discussions that led to 8U x 280, there were 3 important factors: The desire to achieve from 120 to 150 in2 of board space. The desire to keep the system size to 12U (so you get 3 in a 40U rack) The desire to remain within a 600mm rack depth The debate centered around the need for IO. The two proposals wer 6U x 340 and 8U x 280. The 6U x 340 didn’t leave enough space in the back of the board for any rear IO TM or cabling. The focus was is this spec a server spec with telco attributes, or a telco spec that accommodates servers. The telco camp won and the 8U x 280 form factor was chosen. 8U x 280 mm 1.2” pitch (30.48 mm 140 in2 (903 cm2) 150 Watts

CompactPCI - AdvancedTCATM 50W per board 150W per board 57 square in. 140 square in. 700Gb/s Fabric (2.20) (17 x 18 x 2.5Gb/s) 2.4Tb/s Fabric (15 x 16 x 10Gb/s) OC3 / OC48 OC192 / OC768 300mm and 450mm chassis 600mm chassis 500W – 1.5KW per shelf 1KW – 3KW per shelf

(Dual -48VDC Power Rails) PICMG 3.0 – Advanced TCATM 92 mm Tandem Fans 4 x 2 arrangement ~ 350 CFM simulated Telco Alarm Board 14 Slot Backplane in 19” Shelf 2 Switch Slots 12 Payload Slots 1.2” Board Pitch 150W – 200W per module 12U 533.4 mm (21”) -48 VCD Power Input (Dual -48VDC Power Rails) Air Inlet (open) 437 mm (17.2”) 420 mm (16.5”)

ATCA Media Gateway on-a-card Vertical Integration simplifies HA ATCA Media Gateway on-a-card Signal Procs Packet Procs Network Procs General Procs PICMG 2.xx Modules I O DSP NP GP F a b r i c