Enabling Technologies for the Mass Storage Industry Dr Enabling Technologies for the Mass Storage Industry Dr. David Tuckerman, CTO dtuckerman@tessera.com

Enabling Technologies for Data Storage Semiconductor evolving to ever-smaller devices Feature size going down, currently 65 nm Die Thickness below 100 micron Reduced voltages and power needs Advanced Packaging keeps finished ICs small Chip Scale Packaging, final footprint is die-size Ball Grid Arrays attach directly to PCB without leads Stacked and Folded Packages “Systems in a Package” Designs Different functions combined at die level One chip does the work of many die Complete function in a single package (GPS, cellular, imaging)

Tessera Enabling Technologies µZ™-Ball Stack Package Single Die µBGA®-W Package Multi-Die µZ™ Folded Package µZ™ Fold-Over and Stack Package µBGA® Package

FLASH µZ™ Ball Stack FLASH Die Substrate Wire Bond and Encapsulation ~2mm Wire Bond and Encapsulation

µZ™ - Ball Stack Package The µZ Ball Stack package is a multi-chip solution that is capable of increasing memory capacity up to 8x for DRAM, SRAM and for Flash applications. Tessera’s technology provides near-100% yield by allowing each die to be individually tested prior to stacking. Ball Stack uses the existing µBGA® assembly infrastructure, ensuring low cost. Stacking of DDR-SDRAM chips in memory modules for increased memory density in space restricted applications. Flash Stacking applications include high density solid state drives, solid state mission recorder and memory cards. 2-Stack DRAM 4-Stack Flash 4-Stack DRAM 8-Stack DRAM

Small Device Applications Cellular Phones Intel pioneered stacked memory in hand-held devices Features added while shrinking overall phone dimensions New features require more memory Federal mandate requires GPS receivers on new cellular phones PC and Server Memory Blade servers and laptops are severely space constrained Die stacking allows 8X the device count in same footprint Fewer leads, simpler PCB Military and Aerospace “Land Warrior” requires ultra small “wearable” computer Devices must work in hostile environments (high G, vacuum) High reliability, low power, “survivability” are key issues

Packaging technology for system-level miniaturization Computing/Gaming Systems Wireless/Consumer Electronics Enabling Tomorrow’s Feature-Rich Products

Typical Applications Military & Space Harsh environment Solid State Mass Storage 90GB 275GB Up to 32 GB Flash. Advanced protection in conditions of extremely high shock, vibration, temperature, and altitude. MONSSTR: MOdular Non-volatile Solid STate Recorder RMS-SS Solid-State Removable Memory System Network Solid State Disks Records all types of airborne data, including data from reconnaissance sensors Up to 25 GB Solid State Mission Data Recorder (SSMDR) 2.048GB - 688GB

Solid State Drive Application THIS PRESENTATION being delivered via FSSD in a Dell Laptop 20 GByte in 2.5” HDD form factor 24 stacks of 7 die, using 1 Gbit Flash devices Instant on, no spin-up time Very low power, needs no air for head flight or cooling Extremely robust, works in space … under water too. Parallel controller achieves >30 MByte/sec transfer rate Same speed as a conventional HDD Custom controller addresses 8 die in parallel Roadmap shows 192 GByte using current technology 4 Gbit Flash devices, 24 stacks of 8, Dual Nand die 2.5” HDD form factor, 9.5mm high

3D Packaging: 21 GB Solid State Drive System designed to leverage stacked packaging Low-profile (9.5 mm) 2.5” flash solid state drive (F-SSD) drop-in replacement for conventional hard disk drive custom FPGA controller required to handle high capacity SDRAM, processor included NAND flash stacks: 7 ICs/site 12 sites / side 2 sides 24 sites 168 devices Miniaturization of Flash storage capability – achieved with Tessera’s stacked packaging – allows drop-in solid state replacement for conventional hard disk drive.

Dual NAND FLASH Options 3.92mm

Dual Die in 2.5” Solid State Drive Drive Height Max Pkg Height Capacity (1Gb Die) (2Gb Die) (4Gb Die) # of Stacked Packages 9.5 mm 3.92 mm 48GB 96GB 192GB 8 8.5 mm 2.94 mm 36GB 72GB 144GB 6 8.0 mm 2.45 mm 30GB 60GB 120GB 5 5.0 mm 0.98 mm 12GB 24GB 2 Dual NAND flash stacks: 16 ICs/site (8 high package stack) 12 sites / side 2 sides 24 sites, 384 devices

PCB area savings Size Reductions Translate to Higher Density 21.0 GB in a 2.5” Flash Solid State Drive (FSSD) Area of 168 TSOP array is 415.9 cm2, equivalent area for 24 µZTM stacks (7 die each) is 50.4 cm2 Space consumed by stacks is 12% of TSOP, space savings is 88% ! Size Reductions Translate to Higher Density

Summary and Conclusions Semiconductor Packaging a key element for solid state memory products Higher frequencies need shortest possible connections “System in a Package” simplifies PCB, improves reliability Memory demand growth requires die stacking Today’s “nice to have” will be tomorrow’s “must have” features DDR-2 requires Chip Scale Packaging, so will DDR-3 More products must be tolerant of hostile environments Additional space savings from Integrated passives More products will depend on miniature and/or hand-held form factors Military devices carried by personnel and ordnance Business needs for tracking people, equipment, products (RFID) Consumer goods, increasing use of wired/wireless networks