1 States report for readout system 1.PHENIX readout system overview 2.High speed data link 3.Digital pilot ASIC 4.Schedule Hiroyuki

2 Pseudo FEMPilot Module XC2VPxx New digital pilot ASIC 0.8Gbps => 1.6Gbps data link (Global Optical Link) Readout chip 4x bus GOL Digital pilot ASIC Tx Integrated de-serializer Detector 1.6Gbps optical link What we have to test PHENIX readout system

3 GOL high speed mode Ready Optical receiver Pseudo FEM Ready Optical link We will start to measure the error rate of GOL 1.6Gbps mode with this setup. GOL test board 14 Sep. Ready

4 High speed receiver for GOL VertexIIpro link cable Xilinx VertexIIpro can receive up to 3.12Gbps serial data stream. Now I am developing the protocol for GOL 1.6Gbps mode. Error LED Pseudo FEM Normal operation Error detected (test) States LED 3.12Gbps link test => OK

5 States of new pilot ASIC ASIC wafer fabrication was completed and is under dicing at French company. It may be delivered in any moment. ASIC test board design will be finished in few weeks. Packaging for ASIC chip is ready by FUJITSU. Just need chip! (Ask Hiroaki) All equipment for test setup are in our hand.

6 Chip packaging Chip will be packaged by Fujitsu IMT. We are ready to packaging and just waiting chip. Netlist (chip-package)Pin assign table

7 Test setup We will finish to design ASIC test board in this week. Test setup is ready except ASIC and test board (early Oct.). PPG50TOMPPG50TOM FIFO moduleASIC test board Pulse generator PC Data checking

8 Schedule Data link ASIC Pilot module Board fabrication ASIC board test board fabrication done Board developing System test Board design completion 10/79/7 9/14 Protocol design Long term test