About Siotech Corporation Rely on the trustworthy quality and excellent technology. “Silicone base LED (Optical) Encapsulant” with high refractive index rate and excellent protection to strengthen key production link of LED Chip package for holding technical life necessary and closely follow up the pace of prosperity society to step into new century together.

product lines 제품종류계열명칭모델특성굴절율점도경도투과율 400nm/2nm(%) 실리콘 봉지제 SioMax Sio-5588 고굴절율 실리콘 봉지제 A70 ＞ 90% Sio-5533 고굴절율, 중경도 실리콘 봉지제 D40 ＞ 90% Sio-5599 고경도, 저점도 실리콘 봉지제 D70 ＞ 90% SioPlus Sio-6688 특수응용 : 입자가 큰 형광체 대응 실리콘 봉지제 A70 ＞ 90% Sio A70 ＞ 90% Sio D70 ＞ 90% Sio D30 ＞ 90% SioLiteSio-4411 저굴절율 및 저원가 실리콘 봉지제 A60 추가로 필요한 자료는 당사 문의 바람 SioLense Sio-1155 고굴절율, 고경도 실리콘 봉지제 D7588% Sio-1166 고굴절율, 고경도, 고점도 실리콘 봉지제 D7588% SioPoxy 추가로 필요한 자료는 당사 문의 바람.

Test items Transmittance Pot Life Substrate adhesion Heat / Humidity test (Level 3) Thermal shock test Sulfur Exposure test Lighting test Color after UV / Heat

Transmittance of 5588 Thickness 2mm 92% (450nm)

Pot Life Stored at 25 ℃

Substrate adhesion AgPPA Bonding Strength (MPa) SiO-5588 S社S社 D社D社

Heat / Humidity test (Level 3) Chip ： 3528 、 5050PLCC / Blue light Method ： 60 ℃ /60%RH/40hr → IR-Reflow(260 ℃ )*3cycles → Soak into the red ink 4 hours 。 5588 S社S社 D社D社 PS ： Follow-up to do lighting testing, are all pass. S社S社 D社D社

Thermal shock test Chip ： 3528 、 5050PLCC / Blue light Method ： -40 ℃ /15min ↔ 120 ℃ /15mins*500cycles → Soak into the red ink 4 hours 。 5588 PS ： Follow-up to do lighting testing, are all pass. S社S社 D社D社 S社S社 D社D社

Sulfur Exposure test Sulfur Sulfur vapor keep at 80 ℃ Chip attached to the cap inside S社S社 D社D社 0hr 12hr 24hr Reactive expression of sulfur. 4Ag+2H 2 S+O 2 →2H 2 O+ 2Ag 2 S(Black) Method, as shown below. Chip ： 5050PLCC

Lighting test Chip ： 3528PLCC(Blue) / 3%Phosphor / 60mA 25 ℃ 85 ℃ / 85%RH Time (hr) Relative Intensity (%) SiO-5588 S社S社 D社D社 Time (hr) Relative Intensity (%) SiO-5588 S社S社 D社D社

Color after UV / Heat 5588 S社S社 D社D社 initial QUV(313)*24hr 200 ℃ *24hr

Summary Code D社D社 S社S社 5588 Substrate adhesion X △○ Heat / Humidity test (Level 3) X △○ Thermal shock test X △○ Sulfur exposure test XX △ Lighting test ○○○ Color after (UV / Heat) ○ X ○