Nicholas Gomieo Seattle Pacific University Information Systems Management

Intel’s first product - Model 3101: Static Random Access Memory (SRAM) Model 1101: SRAM in metal- oxide semiconductor (MOS) technology Model 1103: Dynamic random Access Memory (DRAM)

 Model 3101 Static Random Access Memory (SRAM)  Advantages:  Twice as fast  Data storage (i.e. ROM and RAM)  Disadvantages  Expensive  6 transistors per cell  Slow operation  Model 1101 SRAM in metal-oxide semiconductor (MOS)  Advantages:  Self-registration  Easy to design and fabricate using “Silicon Gate”  Data storage (i.e. ROM and RAM)  Disadvantages  Not as fast as bipolar *Marks the beginning of a revolution for small businesses

 Model 1103: MOS dynamic random access memory (DRAM)  Advantages:  Built for speed, not durability – Moore’s Law  Ideal for military  Low cost, more efficient – Cost Effective Leadership *Helped Intel change the nature of the modern world by providing the most ubiquitous product in history, allowing them to maintain a competitive advantage and become the leading innovator in memory chip history.

 Good news for the semiconductor industry…..  Use MOS technology to create single chip with multiple functions…..

 Computer Processor Unit (CPU) on a single chip….. Multiple Functions Logic/Calculation Read only memory (ROM) Power control Random access memory (RAM) Input/Output Management

 Edward “Ted” Hoff  Masters in Electrical Engineering  Managed 3 person design team with Busicom on site at Intel  Brings in Stan Mazor to help with software architecture  General Purpose computer on a chip

 Leadership Issues  Company lay offs  Decrease in profitability  Competition Growth  4 month delay on computer chip project  Busicom team goes back to Japan  Hoff and Mazor draw away from memory chip project

What were some of the new markets that appeared throughout the 1960’s as Intel faced competition? THANK YOU!