MIO-2261 Sales kit MI/O-Ultra (Pico-ITX SBC) Intel ATOM N2600/N2800 Embedded Stackable Board Computer PM Victor.Huang Victor.huang@advantech.com.tw May, 30, 2012

MIO-2261 Compelling Features Intel® Atom N2600/N2800 Pico-ITX SBC with 18/24-bit LVDS/ VGA/ LAN/Half-size Mini-PCIe/ 2COM/ 1 mSATA/ 4 USB2.0/MIOe Intel N2600/N2800+ NM10, DDR3 1066 SO-DIMM N2600 1.66G / N2800 1.86G DC Dual Core Processor with All Fan-less Design Smallest SBC w/ 100x72mm size (same as 2.5” HDD) with MIOe extension flexibility Low Power Consumption (Kit TDP: 5~8W) DirectX 9, MPEG2 (H/W acceleration) H.264/ VC1/ WMV9 (H/W Decode/Acceleration) 12V DC Power input ,Support DC power hot plug 15KV Air ESD protection COM port design TVS design for power ESD/EFT protection 1GbE-Intel LAN/ HD Audio 2 COM/ 4 USB2.0/ 1 mSATA/ 8-bit GPIO/ SMBus/I2C/ MIOe Extension / Half-size Mini PCIe Power connector Support SUSI Access Supports Embedded Software API and Utility WinCE7.0, XP, XPE, Win7,WES7,QNX,Vxwork Support Lockable DC Jack 2018/Q4 Longevity

MIO-2261 spec

MIO-2261 Block Diagram

Board Layout-Top VGA Power button /HDD LED /Power LED HD Audio (Line-in, Line-out) 18/24-bit LVDS 2x RS-232 DDR3 SO-DIMM Socket

Board Layout-Bottom MIOe VGA 2xUSB2.0 1 GbE LAN 12V DC input SATA LCD Power Selection /Auto Power On MIOe (SMbus, 2 x USB2.0, 2 x PCIe, line-out, LPC, 5Vsb/12Vsb) mSATA Inverter 2xUSB2.0 GPIO Half-size Mini PCIe SMBus

MIO-2261 MIOe supported interface Considering most demands from customer and future chipset trends (~2013Y new platforms) Interface Number MIO-2261 Supports Functions can be Display port 1 Yes HDMI, LVDS, DVI, CRT or eDP display interface… GP PCIE 4 (2 x PCIex1) Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion… USB 3.0 USB 2.0 2 N/A Super speed storage, capture card, HD Webcam & display interface… LPC Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O… HD Audio (Line-Out) Line out, keep flexibility with selected amplifier… SMBus Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication… Power Control 3 Reserved VCC +12VSB 2A for MIOe module +5VSB 3A for CPU board and MIOe module totally GND

Order Information Packing List Embedded OS/API

Coast Line (Rear IO) Model Rear I/O Photo MIO-2261N-S6A1E MIO-2261N-S8A1E LAN + 2USB + VGA MIO-2261 (by request) LAN+ 2USB + VGA + DC Power Jack

Thermal Solution Standard Thermal Solution Optional Thermal Solution Model MIO-2261N-S6A1E / MIO-2261N-S8A1E Photo Description CPU Heatsink Dimension: 99.5(L)* 70.5(W)*15.7(H)mm Total height including CPU board + heatsink is 33.48(H)mm Standard Thermal Solution Optional Thermal Solution Heat Spreader Dimension: 99.5(L)* 70.5(W)*11.2(H)mm Total height including CPU board + heat spreader is 29(H)mm

MIO-2261 Advanced Technology Intel Atom Cedar Trail Ultra Low Power Solution Ultra Low Power Consumption, all comes with Dual Core processors: N2600 1.66G Dual Core: TDP of Intel bundle kit is 5 Watts N2800 1.86G Dual Core: TDP of Intel bundle kit is 8 Watts Fan-less Design: All Fan-less low profile heatsink design Multiple Display Support & H/W Decode Dual independent display : VGA + 18/24-bit LVDS Support additional 48-bit LVDS, HDMI , or DisplayPort through MIOe eDP Graphic Engine and H/W Decode: DirectX 9 and OpenGL3.0 support Hardware decode H/W acceleration: MPEG2 H/W Decode/Acceleration: H.264/ VC1/ WMV9 DC Power Hot Plug Protection Design Good to protect board in case direct power in and damage the board and system. COM Port 15KV ESD Protection Design TVS (Transient Voltage Suppressor)design for power ESD/EFT protection

Design for Ruggedize Solution --- Advantech MIO-2261 MIO-2261 is designed with 100% Solid Capacitors (固態電容) Higher tolerance for high frequencies & high temperature With better MTBF compared with Electrolytic Capacitors No more exploding capacitors More reliable solution if using Solid capacitors than Electrolytic capacitors High ESD Protection for RS-232 I/O Pins to ±15kV IEC61000-4-2 Air Gap Discharge: ±15kV IEC61000-4-2 Contact Discharge : ±8kV Human Body Model: ±15 kV Rugged Design on Selected Components Wide temperature design and test criteria: Power/ Clock generator/ Sequence PCB Type: TG-150 as PCB type, much reliable in high temperature environments.

Reliable Power Design The power tolerance range is 12V +/-10% MIO-2261 is designed with Power Hot Plug protection IC design To avoid pulse current to damage the board when DC power hotplug directly MIO-2261 DC Power adapter

Performance benchmark (CPU Arithmetic Benchmark-ALU, FPU) + 16% + 104% + 96% 33.8% 96.2% 104.0% MIO-2261 (N2800 1.86GHz) MIO-2261 (N2600 1.66GHz) PCM-3362 (N450 1.6G) Sliverthrone XL (Z530 1.6G) Intel Tunnel (E660 1.3G)

Performance benchmark (Processor MultiMedia - Integer, Float Point) + 17% + 102% + 94% 0.337459 0.939579 1.026473 MIO-2261 (N2800 1.86GHz) MIO-2261 (N2600 1.66GHz) PCM-3362 (N450 1.6G) Sliverthrone XL (Z530 1.6G) Intel Tunnel (E660 1.3G)

Power consumption 10.32 Watts 9.6 Watts 9.12 Watts 7.68 Watts MIO-2260 (N455 1.66GHz) MIO-2261 (N2800 1.86GHz) MIO-2261 (N2600 1.66GHz)

Graphic Performance- 3DMark 2006 N455 to N2800 244% increase N455 to N2600 130% increase MIO-2261 (N2800 1.86GHz) MIO-2261 (N2600 1.66GHz) MIO-2260 (N455 1.66GHz)

Pico-ITX Competitor Comparison

MIO-Ultra Target Applications Home Automation HMI (Human Machine Interface) Ultra Low Power Demand Portable Device POS/ KIOSK Measurement Instrument Machine Automation Medical

New Form factor MI/O-Ultra Introduction

Why a New Form Factor – MI/O Extension - Takes New Position between SBC and COM Resource: Need redesign PCB to fulfill the SPEC requirement Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE. The SPEC on standard SBC can’t be fulfilled if need additional I/O change Less cabling: less problems and cost on assembling. Concentrated thermal design: make thermal design be easier in customer’s system integration. The customer needs a board easier for system integration The customer hopes to keep domain knowhow through easier way Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC. Time to Market Time to Profit Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time.

Positioning on Different Solutions MI/O Extension Single Board Computer Computer On Module Readiness 100% (I/O module only by demand) 60~80% (Need bundle carrier board ) Flexibility Middle Low High RD Resource Low ~ Middle (design I/O module if needed) (design carrier board) Pricing Develop Schedule Short ~ Middle Short Long Dimension 146*102mm 100*72mm Q7, ETX, COM-Express, COM-Ultra... Keep domain knowhow Yes (design I/O module) No Target customer Only lack few I/O interfaces Sensitive on pricing Tight development schedule With RD ability who can design I/O module. Need single board solution Need wide-range choices Time to Market Complicated SPEC demand With exists COM carrier board With senior RD ability who can design power sequence and I/O functions.

MI/O Extension Features

Product Line Positioning

MI/O-Ultra Market Position Smallest Size SBC with Maximum Flexibility Ultra Small Size (100x72mm) Flexibility from M/O Extension Competitive price with simple I/O Ultra Low Power (<8W) Easy for System Integration 20% size reduction of PC/104 Portable Device Small HMI/PPC Embedded Instrument In- vehicle Home Automation

MI/O Extension-Ultra (Pico-ITX) Heat Spreader Right angle connector Unified rear IO MIOe extension RAM Module Heat-generated parts Install Heat Spreader conduct heat to chassis cover for better thermal solution Install MIOe module Flexibility and unified multiple interfaces Easy system integration Ultra small from factor w/ 100x72mm size Heat-generated parts on TOP Rear IO and connector on BOT Unified rear IO with less cabling Optional heat spreader Flexibility from MIOe extension Secure core knowledge on MIOe modules MIOe extension design guide for reference Unified multiple interfaces Less design effort , Heat-generated parts on TOP Easy to make thermal solution Right angle connector Easy system integration and cabling Biz RMA rate

Comparison with other SBCs

Flexibility Possibilities MI/O Extension SBC+ MIOe Expansion Module = Vertical Applications MIOe Module A MI/O A MIOe Module B MI/O B MIOe Module C Your own MIOe design !

Unified MIOe for MIO Extension SBC Interfaces are considered including most demands from customer and future chipset trends Interface Number Functions can be DisplayPort 1 HDMI, LVDS, DVI, CRT or eDP display interface… PCIe x 1 4 Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion… USB 3.0 USB 2.0 1 2 Super speed storage, capture card, HD Webcam & display interface… LPC Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O… HD Audio (Line-Out) Line out, keep flexibility with selected amplifier… SMBus Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication… VCC (Power) +12VSB +5VSB GND or

Compact Chassis Design MIO Positioning Easy System Integration Minimum Design Effort Secure Core Knowledge Compact Chassis Design Flexibility/ Vertical Market Cost Effective MIO

SUSIAccess Smart Access To Embedded Devices 31

1 2 3 Integrated Device Monitoring, Configuration & System Recovery Remote Configuration 3 SUSIAccess is a embedded cloud service, it is a embedded software as a service (SaaS) solution It integrates Device Monitoring, Configuration & System Recovery, three major functions. It enable our board customers the smart access to embedded devices. System Recovery

Core Features Centralized Device Monitoring Collects all embedded device data Displays data in a customized dashboard Auto notifies errors via warning popups and e-mail alerts Integrated Remote Configuration Remotely adjust embedded device settings Transfer files to a remote device for firmware or application updates Remote diagnostics via screen captures, hardware log analysis, and windows XP event log files One-Click System Recovery Back-up complete system and files any time Restore a system Smart back-up saves images to offsite FTP There are three core features of SUSIAccess, 1st: Centralized Device Monitoring, it can Collects all embedded device data and displays data in a customized dashboard, Auto notifies errors via warning popups and e-mail alerts 2nd. Integrated Remote Configuration, Remotely adjust embedded device settings and transfer files to a remote device for firmware or application updates . Or Remote diagnostics via screen captures, hardware log analysis, and windows XP event log files. 3rd. One-Click System Recovery, to Back-up complete system and files and restore a system at any time. The Smart back-up saves images to offsite FTP

Centralized Device Monitoring On CPU/SYS Temp, Fan Speed, Voltage & Modules Collects all embedded device data On CPU/SYS Temp, Fan Speed, Voltage & Modules life and wireless signaels

Integrated Remote Configuration For Power On/Off, Display, Volume & File Transfer Remotely adjust settings of embedded device for Power On/Off, Display, Volume & File Transfer

Advantech Peripheral Modules Solution 36

Peripheral Highlights PATA/SATA/USB Full Range Wide Temp. 30u Plating Fix Die Thermal Sensor 7 years Longevity High Brightness Various Interface SQFlash SQRAM Wireless Touch/Display

SQFlash – Smart & Quality Flash Module Leading Technology Fragment Writing – better endurance, performance GuaranteedFlush – robust mDDR cache Power Failure Protection OS Mutual – High random access Full Range Interface/Form Factor PATA, SATA, CF, CFast, USB, mPCIe, SD Wide Temp. modules for both SLC & MLC Flexible firmware and software customization Security features

SQRAM – Smart & Quality Memory Module Rugged Specification Fixed Die with Samsung memory chip Extra-thick 30u" gold-plated contact pins Stable operation in extreme temp. (-40° to 85ºC) Industrial grade capacitors ensure voltage stability Thermal Sensor & software package Sorting Mechanism 10G vibration Low temp. (-40 ℃) & high temp. (+85 ℃) burning Thermal shock stress test VDD, Frequency Margin test Power Cycling, application test

Embedded Wireless Module Industrial WiFi Module 7 years longevity Stable operation in extreme temp. ( -40° to 85ºC) Cisco CCX 4.0 certified Seamless roaming between respective APs Support Intel Active Management Technology 7.0 Industrial leading power consumption Multiple OS support Full Range Solution/ Interface/ Form Factor Frequency band: 2.4GHz and 5/2.4GHz Data Rates: 802.11n 1T1R, 2T2R and 3T3R Form Factor: Full-size and Half-size mini PCIe, mini PCI and USB Signal Protocol: PCIe, PCI and USB Solution type: WiFi module and WiFi + Bluetooth module

Industrial Display add-in Touch Solution Rugged Display Solution Full range of size support from 5.7” to 42” Wide operation temp from -20~ 70 degree C IP54 rating for water and dust proof (ITM series) Backlight MTBF support of 50K hours Touch enhancement 5 years longevity Widely Input flexibility Various interface for each application

Thank You Contact product manager for any further information Victor Thank You Contact product manager for any further information Victor.Huang@advantech.com.tw 42