Pioneers in Non-contact Measurement

MTI Instruments, Inc.  Founded in now a public company listed on NASDAQ  Designs, manufactures and markets non-contact measurement instruments and systems for manufacturing and laboratory applications

We apply our technical expertise in electronics, optics and software to meet the precision measurement needs of end-users and OEMs  Key attributes of our products: Non-contact High resolution Custom probe sizesHigh frequency response AccurateReliable  Global sales, service and support network  Total customer commitment Company Profile

MTI Instruments, Inc. PBS Group  Portable engine balancing systems for the aircraft industry General Instruments Group  Measurement probes and electronics for laboratory and industrial applications Semiconductor Products Group  Measurement systems designed specifically for the semiconductor industry

Core Technologies MTI Instruments employs three unique sensing technologies to meet the diverse measurement needs of our customers  Accumeasure  - Capacitance Displacement Thickness Micro-positioning  Microtrak  - Laser triangulation Robotic Control Flatness Dimensional Measurement  Fotonic  - Fiber Optic Vibration Positioning Modal Analysis

Semiconductor Products Group MTI Instruments offers a complete line of semiconductor metrology systems to meet the stringent requirements of the industry  Proforma™ Manual wafer thickness measurement  Proforma™ 300GR - Manual thickness and resistivity in single compact design  Proforma™ 200 SA - Semi-Automated wafer surface mapping  Proforma™ AutoScan Fully automated wafer mapping system

PROFORMA  Wafer Thickness Measurement Systems  Based on MTI’s proprietary Push-Pull  capacitance technology  Ideal for both semiconducting and semi-insulating materials  Manual, semi-automated and fully-automated models for laboratory and manufacturing process applications

Push-Pull Probes  Single Sensing Face  Constant current supply, linear voltage change based on air gap  Electrical grounding of target required  Dual Sensing Element  No electrical grounding of target required  Ideal for highly resistive materials

Semiconductor Applications Wafer Specifications  Material: Semiconducting and Semi-Insulating  Diameter: mm.  Surface: As-Cut, Lapped, Etched, Polished, Patterned  Flat/Notch: All SEMI standard Flat(s) or Notch  Conductivity: P or N type  Mounting: Bare Wafer, Sapphire/Quartz, Tape Process Monitoring  Slicing: Blade and wire guide degradation monitoring  Lap/etch and Polishing Removal Rates  Backgrinding  Final Inspection

PROFORMA  300  Manual, non-contact wafer thickness gage  Thickness, TTV, continuous and 5-point measurement  Measures diverse materials without re-calibration  Output data to any PC  Portable, easy to set up and operate—ideal for SPC

Menu-driven for fast, easy setup Teflon wafer stage for easy non-abrasive positioning High-resolution LCD display Adjustable stage for precise leveling On-board microprocessor for accurate, repeatable measurement Proprietary Push-Pull™ probe technology PROFORMA  300 Key Features

PROFORMA  200 SA  Semi automated operation  Windows ® based control interface  Measures thickness, bow, warp, global and site flatness, TTV  Complete wafer surface mapping  Multiple chucks for all wafer sizes  Economical alternative to fully automated system

PROFORMA  AUTOSCAN 200  Fully automated wafer measurement system for semiconducting and semi- insulating materials  Thickness, TTV, bow, warp, resistivity, site and global flatness  Outstanding accuracy and repeatability  Integrated, modular design

 Standard Windows NT user interface for easy set-up.  Choose from standard or user-programmable wafer scan patterns to mach your measurement needs. PROFORMA  AUTOSCAN 200

 Precise site flatness measurements are obtained through programmable wafer and site geometries. PROFORMA  AUTOSCAN 200

 Automated, full surface scanning allows for 3-dimensional imaging of wafer profile. PROFORMA  AUTOSCAN 200

PROFORMA  AUTOSCAN 200 System Features  Completely automated wafer handling and surface scanning  Measures all wafer materials --Si, Ge, GaAs, InP  Full 1000 um thickness measurement range without re- calibration  Measures wafers from mm. in diameter;  100 wafer/hour throughput  Universal robot end effector  Automatic detection of wafer diameter  Laser cassette scanning detects crossovers, empty slots, broken wafers

PROFORMA  AUTOSCAN 200 System Features (continued)  SEMI compliant modular design  Integrated control system  Ethernet network interface  Customized data reporting  Enclosed environment for Class 10 compatibility  Optional laser OCR mark reading and resistivity modules

The new standard for measuring semiconducting and semi-insulating wafers