3D MEMS Accelerometers for Building Applications

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Presentation transcript:

3D MEMS Accelerometers for Building Applications Mikaël Colin – MEMScAP S.A. 1st MEMSCON Event – Bucharest October 7th, 2010 1st MEMSCON Event 07/10/10, Bucharest Company

1st MEMSCON Event - 07 October 10, Bucharest Acceleration RF ID tag Accelerometer end-user specifications Parameter Value Unit Acceleration 0.01-2 g Frequency 0.1-10 Hz Duration 15 s Size constraint - mm3 Operating temperature -20 to +50 °C Operating Humidity 0 to 100 %RH Vibrations (15g) 1000 Shocks 2000 Battery lifetime 2 years 3D MEMS accelerometer MEMS = Micro ElectroMechanical System 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

Accelerometers transduction mechanisms Vibration Beam Accelerometer (VBA) Resonance frequency is dependent on the applied force Driven oscillator at resonance frequency (closed loop) High end applications Spring Mass System Acceleration force causes a proof mass displacement Displacement measurement system Direct or indirect measurement Indirect measurement methods: Piezoelectric effect Piezoresistive effect Capacitive sensing 1st MEMSCON Event 07/10/10, Bucharest Company

Transduction principles Piezoelectric effect Piezoresistive effect Capacitive sensing 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

1st MEMSCON Event - 07 October 10, Bucharest MEMS Technologies Bulk micromachining Surface micromachining Hybrid integration 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

Concept of 3D accelerometer Mounting of 3 1D accelerometers 3-axis sensitive mechanical structure 3 independent structures on the same die 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

1st MEMSCON Event - 07 October 10, Bucharest Selected concept 3 independent capacitive micromachined sensors on a single die ~ 4mm ~ 11mm Out of the wafer plane sensitivity In plane sensitivity 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

1st MEMSCON Event - 07 October 10, Bucharest Fabrication Wafer level packaging concept 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

1st MEMSCON Event - 07 October 10, Bucharest ASIC+MEMS Assembly Hybrid integration in a ceramic carrier MEMS ASIC Read-out 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France

1st MEMSCON Event - 07 October 10, Bucharest Thank you for your attention 1st MEMSCON Event - 07 October 10, Bucharest MEMScAP, France