OSE Company Presentation Orient Semiconductor Electronics, Ltd.

OSE Business Overview Established in 1971 and listed on the Taiwan Stock Exchange in 1994 Positions as an electronics manufacturing service provider Provides a wide range of IC packaging and testing as well as contract manufacturing services Offers customer-focused production and logistics solutions to achieve time-to-market and time-to-volume

OSE Semiconductor Group – Products & Services IC Package Design Process Development Material Management Wafer Probing Wafer Grinding IC Packaging Services PDIP/PLCC/SO/SSOP/TSOP/ TSSOP/QFP/LQFP/TQFP/MLP PBGA/EBGA/TEBGA/LFBGA FTFBGA/MCM/FC IC Test Program Development IC Testing Services Logic/Memory RF/Mixed Signal Distribution Support IC Packaging & Testing Services

OSE Finished Products Group – Products & Services Circuit Layout DFM/DFT Review Prototype IC Packaging Design Part Selection Material Procurement Material Management PCB Assembly Back-plane Assembly Final Systems Build In-Circuit Test Functional Test Reliability Test Distribution Support Repair & Upgrade Electronics Manufacturing Services

OSE Global Manufacturing Facilities FacilitySpaceEquipment OSE Kaohsiung, Taiwan 1,280K sq. ft. W/B * 1,560 SMT * 28 OSE Philippines Laguna, Calamba 554K sq. ft. W/B * 200 OSE USA * San Jose, CA 83K sq. ft. W/B * 120 Sparqtron Corp. Fremont, CA 35K sq. ft. SMT * 4 *OSE USA formerly called IPAC

OSE Semiconductor Group site strategy Orient Semiconductor Electronics, Ltd. Semiconductor Group OSE USA OSE PhilippinesOSE Taiwan Sales & marketing Packaging technology development for quick build requirement Quick turn and Low volume service Marketing contact from qual lot at OSEU and mass production at OSET/OSEP Focus on high volume; low pin count and low cost packaging Packaging technology research & development center Focus on high pin count ; value added packaging and mass production Transfer low pin count packaging to OSEP

OSE Global Sales & Support Offices RegionLocation TaiwanTaipei Hsinchu Kaohsiung AsiaTokyo, Japan Manila, Philippines Singapore North AmericaSan Jose, CA Los Angeles, CA Phoenix, AZ Boston, MA EuropeLondon, UK

OSE Statistics on Human Resources (Worldwide) 5617/1783//7400/4353/1114

OSE Percentage of Sales By Region Remark : Data shown based on FY 2000 both IC & FP

OSE Percentage of Sales By Market Segment

OSE 1995 – 2000 Sales Revenue Remark : Data shown OSET IC packaging & Finished product sales revenue; OSEP & OSEU not included.

OSE Research & Development Capabilities Custom package & module design Substrate layout design for SCM, MCM, LFBGA, and FCBGA Material and process development Thermal and electrical analysis Mechanical simulation Mold flow simulation Quick mold chase and T/F tooling for prototype Package technology development