SOI Pixel Detector : Present Status & Future Plans Super Belle Collb. Mtg Dec. 11, 2008 Yasuo Arai (KEK) 1 [SOI Pixel Collaboration] KEK : Y. Unno, S. Terada, Y. Ikegami, T. Tsuboyama, T. Kohriki, K. Tauchi, Y. Ikemoto, T. Miyoshi, Y. Arai U. of Tsukuba : K. Hara, H. Miyake, M. Kouchiyama, T. Sega Osaka U. : K. Hanagaki, M. Hirose JAXA/ISAS : H, Ikeda, D. Kobayashi, T. Wada, H. Nagata Tohoku U. : H. Yamamoto, Y. Takubo, T. Nagamine, Y. Horii, Y. Sato, Kyoto U. : T. Tsuru Riken/JASRI ： T. Hatsui, T. Kudo, R. Ichimiya, A. Taketani U. of Hawaii : G. Varner, J. Kennedy, M. Cooney, H. Hoedlmoser, E. Martin LBNL : P. Denes, M. Battaglia, C. Vu, D. Contarato, P. Giubilato, L. Glesener FNAL : R. Yarema, R. Lipton, G. Deptuch, M. Trimpl OKI Elec. Ind. Co. Ltd. : M. Ohno, K. Fukuda, J. Ida, H. Hayashi, Y. Kawai, M. Okihara, H. Komatsubara, A. Ohtomo [SOI Pixel Collaboration] KEK : Y. Unno, S. Terada, Y. Ikegami, T. Tsuboyama, T. Kohriki, K. Tauchi, Y. Ikemoto, T. Miyoshi, Y. Arai U. of Tsukuba : K. Hara, H. Miyake, M. Kouchiyama, T. Sega Osaka U. : K. Hanagaki, M. Hirose JAXA/ISAS : H, Ikeda, D. Kobayashi, T. Wada, H. Nagata Tohoku U. : H. Yamamoto, Y. Takubo, T. Nagamine, Y. Horii, Y. Sato, Kyoto U. : T. Tsuru Riken/JASRI ： T. Hatsui, T. Kudo, R. Ichimiya, A. Taketani U. of Hawaii : G. Varner, J. Kennedy, M. Cooney, H. Hoedlmoser, E. Martin LBNL : P. Denes, M. Battaglia, C. Vu, D. Contarato, P. Giubilato, L. Glesener FNAL : R. Yarema, R. Lipton, G. Deptuch, M. Trimpl OKI Elec. Ind. Co. Ltd. : M. Ohno, K. Fukuda, J. Ida, H. Hayashi, Y. Kawai, M. Okihara, H. Komatsubara, A. Ohtomo

OUTLINE Introduction of SOI Pixel R&D SOI Pixel Test Results R&D Plans Summary 2

下部 Si をセンサーとして利用 Bonded wafer : High Resistivity (Sensor) + Low Resistivity (CMOS). Truly Monolithic Detector (-> High Density, Low material, Thin Device). Standard CMOS can be used (-> Complex functions in a pixel). No mechanical bonding (-> High yield, Low cost). Fully depleted sensor with small capacitance of the sense node (~10fF, High conversion gain, Low noise) Based on Industrial standard technology (-> Cost benefit and Scalability) No Latch Up, Rad Hard. Low Power Low to High Temp (4K-300C) operation... Features of SOI Pixel Detector 3

KEK SOIPIX Target & Brief History '05. 7: Start Collaboration with OKI Elec. Co. Ltd. '05.10: TEG submission to OKI SOI 0.15  m process. '06.12: 1 st 0.15 um MPW run hosted by KEK. (17 designs; KEK, Japanese Universities, LBNL, FNAL, U of Hawaii) '07.6: Process (and Fab.) is changed from 0.15  m to 0.2  m. '08.1: 1 st 0.2 um KEK MPW run is submitted. '09.1: 2 nd 0.2 um MPW run will be submitted. '09.6: 3 rd 0.2um MPW run is planned. '05. 7: Start Collaboration with OKI Elec. Co. Ltd. '05.10: TEG submission to OKI SOI 0.15  m process. '06.12: 1 st 0.15 um MPW run hosted by KEK. (17 designs; KEK, Japanese Universities, LBNL, FNAL, U of Hawaii) '07.6: Process (and Fab.) is changed from 0.15  m to 0.2  m. '08.1: 1 st 0.2 um KEK MPW run is submitted. '09.1: 2 nd 0.2 um MPW run will be submitted. '09.6: 3 rd 0.2um MPW run is planned. Starting as a generic R&D program of KEK Detector Technology project in Main purposes are to establish a SOI Pixel process and develop pixel detectors for many applications. 4

5 OKI 0.2  m FD-SOI Pixel Process Process 0.2  m Low-Leakage Fully-Depleted SOI CMOS (OKI) 1 Poly, 4 Metal layers, MIM Capacitor, DMOS option Core (I/O) Voltage = 1.8 (3.3) V SOI wafer Diameter: 200 mm , Top Si : Cz, ~18  -cm, p-type, ~40 nm thick Buried Oxide: 200 nm thick Handle wafer: Cz 、 700  -cm (n-type), 650  m thick BacksideThinned to 260  m, and sputtered with Al (200 nm). An example of a SOI Pixel cross section 5

KEK SOI MPW run (2008.1) 6

7 7 Integration Type Pixel (INTPIX) 20  m x 20  m pixel x 128 pixels 5 x 5 mm x 128 pixels 5 x 5 mm 2

Counting Type Pixel 10.4 mm□ 128 x 128 pix 10.4 mm□ 128 x 128 pix Charge Amp Dual Discri Counter Energy window and counting in each pixel.

9 CNTPIX2 Pixel 60x60 um 2 ~600 Transistors x 128 = 10,000,000 Trs p-n junctions Analog 16b Counter 9b Register DDL

10 Super Belle pixel : SBPIX1 Trigger Latency 48x48 pixels 5x5 mm 2 48x48 pixels 5x5 mm 2 Modified from the CNTPIX2

11 SOI Pixel Laser Images 0.64 mm x mm 128x128 INTPIX2 11

12 LBNL

X-ray Irradiation Test X-ray Tube X-ray SOI Pixel X-ray Generator : Rigaku FR-D Target : Cu (Cu K  ~8keV) Power : 30-35kV, 10-30mA (max 50kV,60mA) Intensity : ~

X-ray Test Chart 14 Position resolution (pixel size=20  m x 20  m) [lp/mm] INTPIX2 slit w=25  m 25  m Slit is well separated. 14

INTPIX2 Vdet=1.5V 800  s Integration Time Vdet=1.5V 800  s Integration Time

16 SBPIX1: X-ray Accumulated Image

[lp/mm] CNTPIX2 Position resolution (pixel size=60  m x 60  m) slit w=79.4  m Vdet=1.5V (~20  m depletion) 1.6 ms Integration Time (~36 photons/pixel) Vdet=1.5V (~20  m depletion) 1.6 ms Integration Time (~36 photons/pixel) 17

SEABAS test board INTPIX2 + Lens Ethernet 18

Max Readout Speed ~300 frames/sec (200 ns/pixel) 19

R&D Plans 20 Continue MPW runs : Number of the run will be increased twice/year. FY08 Submission : Feb FY09 Submission : June and December 2009 Continue MPW runs : Number of the run will be increased twice/year. FY08 Submission : Feb FY09 Submission : June and December 2009 Wafer Improvement : Double SOI wafer Process Improvement : Implant through SOI layer Implementation Improvement : 3D Integration Wafer Improvement : Double SOI wafer Process Improvement : Implant through SOI layer Implementation Improvement : 3D Integration +

SOI Wafer R&D Fix Potential under transistors Less cross talk between circuits and sensors Under evaluation at Japanese SOI wafer company. Fix Potential under transistors Less cross talk between circuits and sensors Under evaluation at Japanese SOI wafer company. SOI Wafer maker + OKI + KEK Introduce additional SOI Layer 21

SOI Process R&D n- p p+ p Suppress back gate effect. Reduce electric field around p+ sensor. Less electric field in BOX to improve radiation hardness Suppress back gate effect. Reduce electric field around p+ sensor. Less electric field in BOX to improve radiation hardness Implant through SOI layer OKI + KEK 22

SOI chips will be bonded by ZyCube. Under design for Jan. '09 submission. Will be bonded in Apr. '09. SOI chips will be bonded by ZyCube. Under design for Jan. '09 submission. Will be bonded in Apr. '09. ZyCube + OKI + KEK/LBNL 3D R&D Use  -bump bonding (5~10 um pitch) technique. 23

ZyCube + Tohoku Univ. 24

Summary The SOI pixel has many good features (monolithic, low material, high speed...) and a promising candidate for the future Super Belle pixel detector. Preliminary test chips are showing good response to light,  -rays, X-rays and charged particles. The number of the SOI MPW runs will be increased twice per year in We are doing several R&D ('Double SOI wafer', 'through SOI Implant', and '3D Integration' etc.) to get better performance in the SOI Pixel. There are still many items not to be tested. We welcome any people who have interests on the SOI pixel. The SOI pixel has many good features (monolithic, low material, high speed...) and a promising candidate for the future Super Belle pixel detector. Preliminary test chips are showing good response to light,  -rays, X-rays and charged particles. The number of the SOI MPW runs will be increased twice per year in We are doing several R&D ('Double SOI wafer', 'through SOI Implant', and '3D Integration' etc.) to get better performance in the SOI Pixel. There are still many items not to be tested. We welcome any people who have interests on the SOI pixel. 25