Advanced Nanoelectronics Devices in European R&D Programmes Georg Kelm Nanoelectronics Components and Systems Information Society & Media Directorate-General.

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Advanced Nanoelectronics Devices in European R&D Programmes Georg Kelm Nanoelectronics Components and Systems Information Society & Media Directorate-General European Commission

Presentation Outline ICT FP7 Current situation Today’s opportunities: WP 2011-12 + FET And WP 2013? Something on the future 8th FP

What is the money spent on? (in 2011-12) Future & Emerging Technologies (FET) 1. Network and Service Infrastructures ICT for socio-economic challenges Basic ICT technologies & infrastructures ~10% ~9% ~11% International cooperation, Cooperation in an enlarged Europe, Pre-commercial Procurement 3. Component and Systems 4. Digital Content and Languages 2. Cognitive Systems and Robotics 5. ICT for Health, Ageing, Inclusion & Gov. ~26% ~6% ~17% ~7% 6. ICT for Lower-Carbon Economy ~12% 7. ICT for Manufac. & Enterprise 8. ICT for Learning & Cultural Resources ~4% +JTIs +AAL PPP 2 PPPs incl FI PPP ••• 3 3

FP7-CIP/ICT Budget Profile: 70% increase in period 2011-13 M€  2007 2008 2009 2010 2011 2012 2013 TOTAL PF7 ICT 1.189 1.217 1.227 1.241 1.382 1.582 1.760 9.597 CIP 58 52 105 113 120 135 149 732 Financial support FP7: master & shape research & development CIP: ensure wider uptake & better use of research + Regional and Structural Funds,…

ICT in FP7: Where do we stand? In 2011, the FP7 ICT Programme is in its fifth year of implementation Six main calls have been launched and evaluated Total EU funding of 3,9 B€ Total number of projects ~1200 Launch of two JTIs and AAL 3 Calls launched for 220 M€ WP 2011-12 done, WP 2013 (1.5 B€) still to be drafted

ICT in FP7: In Summary ICT in the FP supports collaborative R&D projects industry - academia from at least 3 Member or ASs Project size between 3M€ and 20 M€ of funding 4 to 20 partners per project Supports ~17000 researchers and engineers/year During 2007-10 ~ 5000 distinct organisations, ~14000 participations 1250 projects running (FP6 + FP7)

Presentation Outline ICT FP7 Current situation Today’s opportunities: WP 2011-12 + FET And WP 2013? Something on the future 8th FP

Nanoelectronics and Smart Systems ”Small, smaller, smarter” Lower cost, higher performance and more functionality performance Enabled by Smart design and Smart manufacturing of Smart Components and Systems Power consumption More than Moore: Diversification Analog/RF Passives HV Power Sensors Actuators Biochips 130nm Interacting with people and environment Non-digital SoC & SiP - 90nm 65nm Combining SoC and SiP: Higher Value Systems Moore’s Law: Miniaturization Baseline CMOS: CPU, Memory, Logic 45nm Information Processing Digital content SoC 32nm 22nm Beyond Moore

Objective 3.1: Very Advanced Nanoelectronics Components ICT Work Programme 2011-12 Objective 3.1: Very Advanced Nanoelectronics Components a) Beyond CMOS technology b) Circuit-technology solutions c) Nano-manufacturing and Joint Equipment Assessment d) Coordination and Support Actions Objective 3.2: Smart components and smart systems integration Smart components Smart (miniaturized) systems Micro-Nano Bio Systems (MNBS) Coordination and Support Actions Objective 3.1 Very advanced Nanoelectronics Components Beyond CMOS technology: Very advanced Si and non-Si switches, memories and interconnects (perf/scale/ee) Co-integration of non-Si, charge, spin, photon based devices on Si Carbon based electronic devices Novel materials for interconnects, nano-packaging, Beyond-CMOS (logic and memory) Understanding fundamental artefacts and limits: nano-scale thermal processes; computational material and device science Circuit-technology solutions Combined modelling, technology+ design work at circuit, device, material level for monolith and 3D integr of BeyondC+MtM on Si backbone Nano-manufacturing and Joint Equipment Assessment Mfg solutions integr/interfacing BeyondC+MtM with nanoC E&M solutions to manufacture and measure 1D + 3D Si Coordination and Support Actions CSA to develop strategies, attract young ones and link up globally to support IP creation and manufacture in Europe Objective 3.2 Smart components and smart systems integration Future smart components and smart systems Materials, technologies, processes, manufacturing techniques and design methods for: Innovative smart components (Systems on Chip or Systems in a Package) demonstrating very advanced performance (very high performance analogue, very high frequency, integrated passives); high voltage and high power operation or operating under special conditions (e.g. high temperature, high reliability, long lifetime). Miniaturized and integrated smart systems with advanced functionality and performance including nanoscale sensing systems. Autonomously operating, power efficient and networked smart systems. Robust systems, compatible and adaptive to environment and lifetime requirements. Micro-Nano Bio Systems (MNBS) highly integrated, safe, active and autonomous “smart” implants which provide real-time performance feedback and are able to tolerate interfering body signals; integrated systems for rapid, sensitive, specific and multi-parametric in vitro molecular analysis/detection and cellular manipulation based on biodegradable materials. Cost, manufacturing and real scenarios validation should be considered autonomous body sensor and actuator based systems for non- or minimally-invasive targeted early detection, diagnosis and therapy. Call 8 - MNBS 39M€ Call 8 60M€

Objective 3.1: Advanced Nanoelectronics Technology To stimulate interaction of system and technology to better explore European system competences. To address energy efficiency needs for mobile applications Nanoelectronics products as system enablers and solution providers for global challenges as aging society, global warming, growing population or sustainable manufacturing. To prepare for “beyond” traditional shrinking (ITRS roadmap) 35 nm Gate Length

Objective 3.1: Advanced Nanoelectronics Technology Future developments in Beyond CMOS and More than Moore as an extended-CMOS vision. No disconnection from the advanced silicon CMOS in order to keep impact of its results on the applications and markets. Needs of hybridizing silicon with molecular switches, ferromagnetic logic, spin devices and sensors in order to enable heterogeneous and morphic system architectures. Integrate-ability of novel technology with CMOS and their reliability become key factors. ITRS-ERD vision of the role of Beyond CMOS and More than Moore elements to form future extended CMOS platforms.

3.1 Very advanced nanoelectronic components a) Beyond CMOS technology - New switches and interconnects (scalability, performance and energy efficiency gains, operational reliability and RT operation); - Advanced system integration technology and new methods for computation; - Emerging memories targeting the concept of non-volatile universal memory; - Nano-photonic devices & interconnects integrated with nano- and Beyond-CMOS; - Carbon based electronic devices; -Novel materials for interconnects , nano-packaging, Beyond-CMOS (logic and memory); - Understanding fundamental artefacts and limits: nano-scale thermal processes; computational material and device science. Developed components and technologies need to fulfil the criteria of “systemability”,“integratability”, and – in the end – of “manufacturability”

Objective 3.1: c) Manufacturing and Equipment assessment Semiconductor Equipment for Wafer Bonding with Plasma Activation EV Group, CEA-LETI, Soitec Access to nano-manufacturing and to advanced technologies to be assured in Europe. Access to world wide equipment market for European suppliers, especially SMEs, need to be stimulated. Ruthenium Atomic Vapor Deposition Competitiveness in Nanoelectronic Device Generations AIXTRON, Fraunhofer IISB, Infineon Munich Low Energy and Dose Implant Test SEMILAB, Fraunhofer IISB, ST Microelectronics Crolles II, NXP Crolles R&D Metrology Using X-Ray Techniques Jordan Valley, CEA-LETI, STMicroelectronics Crolles II, NXP Crolles R&D 3D Integration of Bulk Si Wafers EV Group, CEA-LETI, STMicroelectronics Crolles II

3.1 Very advanced nanoelectronic components: design, engineering, technology and manufacturability Summary Call 8 Open: 26 July 2011 Close: 17 January 2012 (at 17:00 Brussels local time) Funding schemes: Beyond CMOS technology: STREPs Circuit-technology solutions: STREPs and at least 1 IP Nano-manufacturing and joint equipment assessment: STREPs and at least 1 IP Support measures: CSAs Indicative budget - 60 M€:

Two complementary funding schemes Future & Emerging Technologies – FET Supporting high-risk transformative research in ICT Two complementary funding schemes FET Open Bottom-up approach Open to any research idea FET Proactive Top-down approach Set of novel pre-defined themes Nano-electronics related topics with EU funding ~ 30M€/year: Molecular-scale systems, Tera-scale computing, Quantum-ICT, Bio-Chemistry-based and towards zero power ICT Budget ratio: 1/3 FET OPEN, 2/3 FET Proactive 15

Objective ICT-2011.9.8: Minimising Energy Consumption of Computing to the Limit (FET Pro-active) Target Outcome: Foundations for radically new ICT technologies striving for the theoretical limits in energy consumption New elementary devices and inter-device-communication mechanisms Novel computing paradigms with radically improved energy efficiency (e.g. inspired by biology, post-Boolean logics, …) Software models and programming methodologies supporting the strive for the energetic limit (e. g. energy cost awareness,..) Proof of concept, indication of expected energy gain, appropriate energy metrics or benchmarks for verification Objective ICT-2011.9.8: FET Proactive: Minimising Energy Consumption of Computing to the Limit (MINECC) The energy consumption of computing technologies becomes more and more an obstacle to realizing new functionalities in, for instance, mobile or distributed applications, and limits performance. It also has an increasing impact on energy supply and environment. Since energy efficiency of today's technologies is orders of magnitude above the theoretical limits, disruptive solutions and radically new approaches are needed to close this gap. Target outcomes: Proposals should lay the foundations for radically new technologies for computation that strive for the theoretical limits in energy consumption while maintaining or even enhancing functionality and performance. At least one of the following outcomes should be addressed: New elementary devices and inter-device-communication mechanisms operating at the limits of minimum energy consumption. Novel computing paradigms with radically improved energy efficiency. Examples include approaches inspired by biology, post-Boolean logics and computing under uncertainty, randomness and unreliability as a result of low-energy device properties. Software models and programming methodologies supporting the strive for the energetic limit (e. g. energy cost awareness or exploiting the trade-off between energy and performance/precision). Proposals should aim for a proof of concept and investigate the viability of the approach. The expected energy gain should be indicated, and the proposal should foresee appropriate energy metrics or benchmarks for verification. Expected impact Understanding of theoretical limits of energy efficiency in computation (e.g. energy dissipation, thermodynamic and quantum physics limits) Foundations of computing technologies with negligible energy consumption Reduction of the environmental impact caused by the energy consumption of ICT. Funding schemes STREP Indicative budget distribution10 EUR 15 million Call FP7-ICT-2011-8

Objective ICT-2011.9.8: Minimising Energy Consumption of Computing to the Limit (MINECC) -Funding/Instruments: 15 MEuro for STREPs -Closing of Call 8 (tbc): 17 Jan 2012 -Contacts: Ralph.Stuebner (at) ec.europa.eu Francisco.Ibanez-Gallardo (at) ec.europa.eu

ICT-2011.9.9: Quantum Information and Communication Technologies (QICT) Target Outcomes Push forward the boundaries of our knowledge in the Quantum-ICT area by demonstrating Quantum simulators capable to operate on many-particle systems Hybrid systems linking different quantum bit realizations. Novel quantum devices exploiting entanglement and quantum coherence as a resource, such as quantum sensing, imaging, measurement and communication Enabling methods and technologies to support aforementioned outcomes Objective ICT-2011 9.9: FET Proactive: Quantum ICT (QICT) including ERA-NET-Plus The objective is to conceive theoretically and develop experimentally novel and powerful technological applications of quantum coherence and entanglement. In particular, projects should develop a conceptual platform for potentially disruptive technologies, advance their scope and breadth and speed up the process of bringing them from the lab to the real world. Target outcomes The results obtained should push forward the boundaries of our knowledge and ensure a constant progress in the quantum ICT area, in particular by Demonstration of quantum simulators capable to operate on quantum many-particle systems and to simulate technologically relevant systems (e.g., coupled systems in condensed matter, new materials and chemical compounds). Demonstration of hybrid systems linking different quantum bit realizations (e.g., by bridging atomic/molecular and optical systems with condensed matter systems). Possible devices include those that interconnect different qubit memories and quantum information carriers, and quantum repeaters. Novel quantum devices exploiting entanglement and quantum coherence as a resource, such as quantum sensing, imaging, measurement and communication. Enabling methods and technologies to support aforementioned outcomes (e.g., the control of coherent operations with many quantum bits in the experimental domain, or the search for new algorithms and protocols in the theoretical domain). A joint call for proposals on QICT, to be funded through an ERA-NET-Plus action between national and/or regional grant programmes. STREPs should address at least one of the research foci a)-d), IPs should address two or more. Expected impact Significant technological achievements with higher performance and superior energy efficiency such as entanglement assisted sensors and metrology Better understanding of the dynamics of complex systems and phenomena and design of novel artificial materials with tailored properties through quantum simulators and computers Extending the distance of secure quantum links through quantum repeaters Closer cooperation and greater alignment between the participating national/regional research programmes through an ERA-NET-Plus action Funding schemes a)-d): STREP, IP; e): ERA-NET-Plus Indicative budget distribution10 a)-d): EUR 15 million e): EUR 7 million (Any funds remaining following the selection of an ERA-NET-Plus action will be transferred to IP/STREP actions under this Objective) Call FP7-ICT-2011-9

Objective ICT-2011.9.9: Quantum Information and Communication Technologies (QICT) “How the combination of quantum mechanics and information theory offers new concepts and resources for computing and communications.” -Funding/Instruments: 15 MEuro, STREPs & IPs 7 MEuro, ERA-NET Plus -Closing of Call 9 (tbc): 17 April 2012 -Contact: Werner.Steinhoegl (at) ec.europa.eu David.Guedj (at) ec.europa.eu Objective ICT-2011 9.9: FET Proactive: Quantum ICT (QICT) including ERA-NET-Plus The objective is to conceive theoretically and develop experimentally novel and powerful technological applications of quantum coherence and entanglement. In particular, projects should develop a conceptual platform for potentially disruptive technologies, advance their scope and breadth and speed up the process of bringing them from the lab to the real world. Target outcomes The results obtained should push forward the boundaries of our knowledge and ensure a constant progress in the quantum ICT area, in particular by Demonstration of quantum simulators capable to operate on quantum many-particle systems and to simulate technologically relevant systems (e.g., coupled systems in condensed matter, new materials and chemical compounds). Demonstration of hybrid systems linking different quantum bit realizations (e.g., by bridging atomic/molecular and optical systems with condensed matter systems). Possible devices include those that interconnect different qubit memories and quantum information carriers, and quantum repeaters. Novel quantum devices exploiting entanglement and quantum coherence as a resource, such as quantum sensing, imaging, measurement and communication. Enabling methods and technologies to support aforementioned outcomes (e.g., the control of coherent operations with many quantum bits in the experimental domain, or the search for new algorithms and protocols in the theoretical domain). A joint call for proposals on QICT, to be funded through an ERA-NET-Plus action between national and/or regional grant programmes. STREPs should address at least one of the research foci a)-d), IPs should address two or more. Expected impact Significant technological achievements with higher performance and superior energy efficiency such as entanglement assisted sensors and metrology Better understanding of the dynamics of complex systems and phenomena and design of novel artificial materials with tailored properties through quantum simulators and computers Extending the distance of secure quantum links through quantum repeaters Closer cooperation and greater alignment between the participating national/regional research programmes through an ERA-NET-Plus action Funding schemes a)-d): STREP, IP; e): ERA-NET-Plus Indicative budget distribution10 a)-d): EUR 15 million e): EUR 7 million (Any funds remaining following the selection of an ERA-NET-Plus action will be transferred to IP/STREP actions under this Objective) Call FP7-ICT-2011-9

Prototype demonstration Work Programme 2011-12 Objectives 3.1 and 3.2 vs FET Idea FET Proof-of-Principle Proof-of-Concept Objective 3.1: Advanced Nanoelectronics Technology Objective 3.2: Smart components and Systems Prototype demonstration

Presentation Outline ICT FP7 Current situation Today’s opportunities: WP 2011-12 + FET And WP 2013? Something on the future 8th FP

Strengthen, focus & simplify What is next? 2010 2011 2012 2013 2014 ICT WP 2011-12 FP7 ICT WP 2013 Preparatory work 2011: Framework 8 Preparation 9 Feb Green Paper Feb-May Consultation based on Green Paper 10/6 Consultation ‘wrap-up’ event in Brussels June Proposal for next MAFF Dec Proposal (s) for FP8/CIP-II Light and fast EIPs FP8 Strengthen, focus & simplify KETs Externalisation MAFF 2014+

And in FP7 ICT WP 2013 ? Advanced devices – more focus – but on what? Stronger links Technology - Design Mfg approaches for BC and adv MtM integration Joint E&M assessments – focus on 450 mm? Bridging to FP8: Innovation elements (pilots, research infrastructure, …)

Focussed, Roadmap based e.g. Clean rooms, Innovation clusters Some first and preliminary thinking on FP 8 Draft Towards a Common R&I framework in the next MAFF “3 sets of challenges, 4 type of activities, (funding schemes)” Societal challenges Industrial leadership Excellence in science Focussed, Roadmap based Flexible, Open, agile Infrast and skills Testing, piloting e.g. EIPs e.g. PPPs e.g. FET flagships e.g. FET open ERC Light WP Any time Small size SMEs specific e.g. Living labs e.g. Clean rooms, Innovation clusters E-Infrastruct . CIP Pilots

Input from Summer School is very welcome Summary Two messages: Input from Summer School is very welcome Participate in Call 8 !!! 25

THANK YOU Georg.Kelm@ec.europa.eu Information Society and Media: http://ec.europa.eu/information_society http://cordis.europa.eu/fp7/ict/nanoelectronics/mission_en.html European research on the web: http://cordis.europa.eu http://www.eniac.eu