© 2013 Rockwell Collins All rights reserved. Accelerating Industrial Application of Additive Manufacturing for Printed Electronics December 3, 2013 Curt Anderson, Ph.D., Rockwell Collins James Finn, International TechneGroup Inc.

© 2013 Rockwell Collins All rights reserved. Contributing Organizations 2

© 2013 Rockwell Collins All rights reserved. Introduction Printed Electronics (PE) is poised to become game changing Additive Manufacturing (AM) solution PE can augment or replace existing manufacturing steps –Reduced cost –Increased flexibility –Unique designs –Reduce waste Recent technology advancements enhance PE –Materials (Nano particle) –Print tools –Process tools

© 2013 Rockwell Collins All rights reserved. Definition of Terms Additive Manufacturing (AM) Mechanical or Passive Components 3D Construct of a Single Material Mechanical Requirements Define Function Examples: Turbine Blade, Lever, Spring, etc. Active Components 3D Construct of Multiple Materials Combination of Mechanical and Materials Interactions Define the Function Examples: Electronic Circuit, Solar Cell, Fuel Cell, etc.

© 2013 Rockwell Collins All rights reserved. Definition of Terms Printed Electronics (PE) Low Profile (2D), Planar Substrate, High Volume Gravure, Offset, Flexographic R2R on flexible substrates Examples: LED lighting, Solar Cells, Displays, etc. Low Profile (2D), Planar Substrate, Medium Volume Screen, Ink Jet, Needle Dispense Examples: Surface Mount, Touch panels, Underfill, etc. High Profile (3D), Non Planar Substrates, Low Volume Aerosol Jet®, DispenseJet, Needle/Orifice Dispense Examples: Conformal Circuits, Antennas, etc. Aerosol Jet® (AJ)

© 2013 Rockwell Collins All rights reserved. Why AM/PE? Cost SWaP Capabilities Customization Uniqueness Rapid Prototype Ernst, J. (2011). High Volume Production of All-Printed Rewritable Memory. SemiCon West. SemiCon

© 2013 Rockwell Collins All rights reserved. Printed Electronics Market IDTechEx. (2011). Retrieved September 7, 2011, from IDTechEx:

© 2013 Rockwell Collins All rights reserved. Early Defense Applications Antennas Interconnects Embedded Passives Complex Circuitry Plourde, R. (2011, February 10). Aerosol Jet Deposition Technology & Applications. Albuquerque, New Mexico, USA: Optomec

© 2013 Rockwell Collins All rights reserved. PE Circuit Including Standard Components 9

© 2013 Rockwell Collins All rights reserved. Definition of Problem Complex designs use CAD tools Translation of CAD to machine print tools is weak or non-existent –Current translation technology is designed for subtractive tools PE translation is complex due to electrical, material and mechanical interactions –Example: printed resistor (what controls the design/translation?) Multiple print tools not supported Standards (file format/rules) don’t exist

© 2013 Rockwell Collins All rights reserved. Future State Vision Design PE using CAD systems Automatic translation of CAD data to AM tools PE manufactured in-line using various tools Supported by Industry (Easy to learn/transfer) Hypothetical R2R manufacturing of near field communication sensors Uwe Partsch, S. M. (2011, September 13). Materials and Applications for Aerosol Jet Printed Functional Layers. Dresden, Germany: Optomec

© 2013 Rockwell Collins All rights reserved. CAD Translation Process Vision

© 2013 Rockwell Collins All rights reserved. Ink Jet Versus Aerosol Jet ® 13

© 2013 Rockwell Collins All rights reserved. Script Editor Sandbox

© 2013 Rockwell Collins All rights reserved. Design Rules PE design rules are different Available electronic CAD systems follow PCB design rules

© 2013 Rockwell Collins All rights reserved. Demonstration of a Printed Crossover 16

© 2013 Rockwell Collins All rights reserved. Multiple Materials Translate multiple types of materials from CAD design Sequencing –Layering (i.e., similar to 3D printers) –Material dependent (sequence to specific print tool) Materials properties effects –Sintering temperature, solvent composition, drying time –Affected by print speed, co-solvents, pressure –Targeted electrical properties Frisbie, C. D. (2012, May). New Materials for Printed Polymer Electronics. Minneapolis, MN, USA: University of Minnesota Printed Transistors

© 2013 Rockwell Collins All rights reserved. Example: Conductive Materials Properties Wide range of conductivity Resultant conductivity –Affected by dispense or print method –Affected by post print processing Vendor variation Lot to lot variation Intellectual property constraints 18 Source: NanoMas Technologies, Inc

© 2013 Rockwell Collins All rights reserved. Filling Algorithms and Symbol Library Fill patterns impact the electrical performance of a printed component. Symbol library used to advance the CAD translation to machine code Panhalkar, et al., “A Novel Additive Manufacturing File Format For Printed Electronics”, Proceedings of the ASME 2013 International Mechanical Engineering Congress & Exposition, IMECE2013, Nov , 2013, San Diego, CA USA

© 2013 Rockwell Collins All rights reserved. Motion Control Programming Available CAD motion control languages have subtractive manufacturing concepts. PE require additive manufacturing concepts Standard File Format as an intermediate data neutral prior to machine code generation

© 2013 Rockwell Collins All rights reserved. Adaptive Pattern Matching Printing surface can warp, twist, stretch (+/-) and bend with part-to-part rotation. Optical pattern recognition and adaptive on- the-fly print adjustments Design RotationStretch (+)Skew

© 2013 Rockwell Collins All rights reserved. Sustainability (Subtractive Versus Additive) 22 Direct write reduces the number of process steps Less waste –Uses high percentage of material –Removal of steps that generate large amounts of waste (developing/etching/plating) Less toxicity in waste –Plating waste –Etchants

© 2013 Rockwell Collins All rights reserved. Other Considerations Technology Transfer –Course work –PEOS (on-line, open source) Training Centers

© 2013 Rockwell Collins All rights reserved. Summary A team was formed to accelerate the additive manufacturing of printed electronics A future state vision was created Translation of CAD to machine code was identified as a major deficiency in the current technology state The team is proposing and executing research to advance the CAD to machine code translation technology 24

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