High Density Packaging User Group Counterfeit PCB Materials Update 03/11/15

© HDP User Group International, Inc. Problem Statement The initial working group has identified two threats: Safety aspect - A case was cited where solder mask failed and an electrical fire resulted. The counterfeit material was „ green, and looked normal“. Trust aspect – Where the whole board was counterfeit, or where circuitry was added to design to accomodate malicious third party intent Agreement – limit to Safety aspect for now © HDP User Group International, Inc.

Purpose Statement 1 The Counterfeit PCB Materials Project identifies and investigates two issues in the electronics industry: Safety as a function of counterfeit materials, and Trust involving anti-counterfeit, anti-tamper, chain of custody and access control. The output of this project is a white paper assessing the validity of claims concerning potential insecure practices in the PCB Materials industry, dispelling or validating known rumors and recommending any needed changes. Recommendations may include possible surveillance schemes or techniques and third party verification of material bill of materials or chemical composition.

Purpose Statement 2 This project will not investigate PCB fabrication security relating to circuit verification and possible Trust issues related to changes made to layout at the PCB level. That is beyond the scope of the current project and will be considered for a future white paper specifically focused on those issues.

Team Activity Update Team call with Underwriters Laboratories to understand their process for inspecting and certifying printed circuit boards Certification of board shops worldwide Flammability of masks and laminate Periodic sample/inspection for use of approved UL materials and processes

Team Activity Conference call with Underwriters Labs about UL problems and solutions to the Counterfeit Problem overall. Plan for further data gathering from sources, including Feb. at IPC Expo Potential participation in counterfeit events – CALCE Seminar June?

Team Activity Conversation with Bob Neves of MicroTek Changzhou Lab at Expo Counterfeit layers are made in China, and inserted between good outer layers Counterfeit solder mask is used in China MicroTek has defined process to detect these and does so routinely

Current Issues Safety - A non-recognized laminate is substuted for a recognized UL 94 V-0 grade, giving the potential for fire hazard. Safety – A non recognized solder mask is packaged in legitimate, UL marked containers and either knowingly, or unknowingly sold to a circuit board manufacturer. Potential fire hazard. Safety – UL inspectors only check labels of mask and laminate at fabs. No FTIR scan. © HDP User Group International, Inc.

Further Issues Observation for Cyber Physical Systems (CPS) Security occurances – the combination of software and hardware attack. Malicious. Involves anti-counterfeit, anti-tamper, chain of custody, and access control. Is it an electronics interconnection problem? Potential for Future Phase as determined by HDP membership vote. © HDP User Group International, Inc.

Further Issues Review of past work for “certification” of circuit board constructions. IPC effort to “purchase”? certification of PCB construction through - NADCAP (National Aerospace and Defense Contractors Accreditation Program) UL Embryonic IPC Certification effort now – built to IPC standards J001, A610, Intellectual property protection © HDP User Group International, Inc.

How can HDPug help the industry? The Counterfeit PCB Materials Team has proposed creation of a White Paper as a fact-finding mission. Find out if the Safety thrust is a significant threat to membership/general public and to what extent the threat exists. This will allow HDPug to bring these issues to the attention of the industry and to determine what steps to take next. © HDP User Group International, Inc.

Proposed Plan Forward Survey HDPug Membership Interest 2Q15 (after Members Meeting) UL Counterfeit Group information 2Q15 – further presentations Confirm methodology (FTIR - ATR) 3Q15 – Sample parts Contact IPC for interest in participation 3Q15 – Certification process We will write a white paper summary 2Q16

Project Participants to date SAIC/US Dept. of Defense NIST NMIC Intel Celestica UL Panasonic © HDP User Group International, Inc.