Lecture on Integrated Circuits (ICs)

History 19th Century - Solid-State Rectifiers 1907 - Application of Crystal Detector in Radio Sets 1947 - BJT Constructed by Bardeen and Brattain 1959 – Integrated Circuit Constructed by Kilby Complexity grows by Moore’s Law In 1965, Gordon Moore predicted that the number of transistors that can be integrated on a die would double every 18 to 14 months .

Moore’s Law in Microprocessors 4004 8008 8080 8085 8086 286 386 486 Pentium® proc P6 0.001 0.01 0.1 1 10 100 1000 1970 1980 1990 2000 2010 Transistors (MT) 2X growth in 1.96 years!

DRAM Chip Capacity 4X growth every 3 years! human memory book encyclopedia book 0.18-0.25 m 0.35-0.4 m 0.5-0.6 m 0.7-0.8 m 1.0-1.2 m 1.6-2.4 m page

Resolution of Features of ICs Chip technology described by the dimensions of line width and typical transistor size. Today, the chip resolution is around 50 nano meters, or 0.05 micron.

IC Design and Manufacturing Process Intellectual Properties Circuit Design by Tools Mask Design Back-End Manufacturing Front-End Manufacturing Bonding Packaging Test equipment Process Auto Lithography Etch/Doping Diffusion Deposition Packages Wafers

IC Design Tasks Synthesis Architecture Design Design Planning Test Power Physical Synthesis IP Architecture Design Design Planning Design Database Verification IP Assertions and Testbenches Languages Timing and Signal Integrity Physical Implementation Verification Extraction Physical Verification Mixed Signal / Analog Mask Synthesis / OPC

Silicon Crystal – Better than Gold Quartz, or Silica, consists of Silicon Dioxide Sand contains many tiny grains of quartz Silicon can be artificially produced by combining silica and carbon in electric furnace Practical integrated circuits can only be fabricated from single-crystal material

Crystal Growth Solid seed crystal is rotated and slowly extracted from a pool of molten Si Requires careful control to give crystals desired purity and dimensions

Ingot

Getting Wafers from Ingot Sliced by diamond-tipped saw into thin wafers Etch wafers in chemical to remove any unwanted Smooth surface http://www.xensei.com/users/adex/prodtech/silicon_wafer.html

Photolithography Photolithography is a technique that is used to define the shape of micro-machined structures on a wafer.

Lithography Machine

Make “mask” defining electrical circuitry. Coat wafer with “photoresist” (sensitive to UV light) where the mask is not present. UV light reduction lens Wafer

Start Stop

Oxidation of Silicon (SiO2) Thick (­ 1µm) oxides are used as insulation

Etching: Process where unwanted areas of films are removed by either dissolving them in a wet chemical solution. Wanted areas are protected by resist. Doping: Process where certain material is implanted into substrate.

Clean Room First used for surgery room to avoid bacteria contamination Adopted in semiconductor industry in 1950 Smaller device needs higher grade clean room Less particle, more expensive to build Class 10: less than 10 particles with diameter larger than 0.5 mm per cubic foot Class 1: less than 1 such particles per cubic foot. 0.18 mm device require higher than Class 1 grade clean room.

Effect of Particles Particle on Mask Film Substrate

Cleanroom Structure Makeup Air Makeup Air Fans Equipment Area HEPA Filter Class 1000 Class 1000 Process Tool Process Tool Class 1 Process Area Return Air Raised Floor with Grid Panels Pump, RF and etc.

Wafer with Circuit Fabricated

Bonding Pad Configurations Peripheral Bonding Pads Area Array Bonding Pads Pads Range from 125 m x 125 m down to 25 m x 25 m

Package Types Ball Grid Array (BGA) Dual In Line Package (DIP) Single In Line Package (SIP) Zig Zag In Line Package (ZIP) Small Outline Transistor (SOY) Quad Flat Pack a(DIP) Pin Grid Array (PGA)

Ball Grid Array Solder

Gold Wire Bonding

Ball Grid Array (BGA) Package Assembled IC Ball Grid Array (BGA) Package

Using ICs on Circuit Board Surface mount Tombstone Dead-bug Via hole mount

Wave Soldering PCB IC

What’s Next?

Who Work in IC Industry? Mechanical engineers Chemical engineers Electrical engineers Systems engineers Civil engineers Physicists Chemists Material Scientists Mathematicians Well, lawyers, finance majors, etc. too.

Good Luck and God Bless!!