Ch 10 MOSFETs and MOS Digital Circuits

Slides:



Advertisements
Similar presentations
Lecture Metal-Oxide-Semiconductor (MOS) Field-Effect Transistors (FET) MOSFET Introduction 1.
Advertisements

Goals Investigate circuits that bias transistors into different operating regions. Two Supplies Biasing Four Resistor Biasing Two Resistor Biasing Biasing.
Topics Electrical properties of static combinational gates:
Transistors (MOSFETs)
ELECTRICAL ENGINEERING: PRINCIPLES AND APPLICATIONS, Fourth Edition, by Allan R. Hambley, ©2008 Pearson Education, Inc. Lecture 28 Field-Effect Transistors.
Metal-Oxide-Semiconductor Fields Effect Transistors (MOSFETs) From Prof. J. Hopwood.
Ch 11 Bipolar Transistors and Digital Circuits
CMOS Family.
Chapter 6 The Field Effect Transistor
Department of EECS University of California, Berkeley EECS 105 Fall 2003, Lecture 12 Lecture 12: MOS Transistor Models Prof. Niknejad.
ISLAMIC UNIVERSITY OF GAZA Faculty of Engineering Computer Engineering Department EELE3321: Digital Electronics Course Asst. Prof. Mohammed Alhanjouri.
Microelectronic Circuits, Sixth Edition Sedra/Smith Copyright © 2010 by Oxford University Press, Inc. C H A P T E R 13 CMOS Digital Logic Circuits.
S. RossEECS 40 Spring 2003 Lecture 22 Inside the CMOS inverter, no I D current flows through transistors when input is logic 1 or logic 0, because the.
Voltage Transfer Characteristic for TTL
ECES 352 Winter 2007Ch 11 Bipolar Digital Pt. 21 Simplified Transistor - Transistor Logic (TTL) *Transistor - Transistor Logic (TTL) *Simplified form of.
Lecture #26 Gate delays, MOS logic
10/8/2004EE 42 fall 2004 lecture 171 Lecture #17 MOS transistors MIDTERM coming up a week from Monday (October 18 th ) Next Week: Review, examples, circuits.
11/5/2004EE 42 fall 2004 lecture 281 Lecture #28 PMOS LAST TIME: NMOS Electrical Model – NMOS physical structure: W and L and d ox, TODAY: PMOS –Physical.
ECES 352 Winter 2007Ch 11 Bipolar Digital Pt. 31 Transistor - Transistor Logic (TTL) iRiR i C3 vivi vovo *TTL basics of operation à Similar to that of.
EE40 Lec 20 MOS Circuits Reading: Chap. 12 of Hambley
Lecture 21 Today we will Revisit the CMOS inverter, concentrating on logic 0 and logic 1 inputs Come up with an easy model for MOS transistors involved.
Lecture #24 Gates to circuits
EE365 Adv. Digital Circuit Design Clarkson University Lecture #5
The metal-oxide field-effect transistor (MOSFET)
11/3/2004EE 42 fall 2004 lecture 271 Lecture #27 MOS LAST TIME: NMOS Electrical Model – Describing the I-V Characteristics – Evaluating the effective resistance.
ECD 442 Power Electronics1 Power MOSFETs Two Types –Depletion Type Channel region is already diffused between the Drain and Source Deplete, or “pinch-off”
Fig. 5.1 Physical structure of the enhancement-type NMOS transistor: (a) perspective view; (b) cross section. Typically L = 1 to 10 m, W = 2 to 500.
Week 8b OUTLINE Using pn-diodes to isolate transistors in an IC
Chap. 5 Field-effect transistors (FET) Importance for LSI/VLSI –Low fabrication cost –Small size –Low power consumption Applications –Microprocessors –Memories.
3.3 CMOS Logic 1. CMOS Logic Levels NextReturn Logic levels for typical CMOS Logic circuits. Logic 1 (HIGH) Logic 0 (LOW) Undefined Logic level 5.0V 3.5V.
1 Lecture 4: Transistor Summary/Inverter Analysis Subthreshold MOSFET currents IEEE Spectrum, 7/99, p. 26.
Dr. Nasim Zafar Electronics 1 - EEE 231 Fall Semester – 2012 COMSATS Institute of Information Technology Virtual campus Islamabad.
© Electronics Recall Last Lecture The MOSFET has only one current, I D Operation of MOSFET – NMOS and PMOS – For NMOS, V GS > V TN V DS sat = V GS – V.
12/10/2004EE 42 fall 2004 lecture 421 Lecture #42: Transistors, digital This week we will be reviewing the material learned during the course Today: review.
Lecture 21, Slide 1EECS40, Fall 2004Prof. White Lecture #21 OUTLINE –Sequential logic circuits –Fan-out –Propagation delay –CMOS power consumption Reading:
Transistor Characteristics EMT 251. Outline Introduction MOS Capacitor nMOS I-V Characteristics (ideal) pMOS I-V Characteristics (ideal)
The CMOS Inverter Slides adapted from:
Practical Aspects of Logic Gates COE 202 Digital Logic Design Dr. Aiman El-Maleh College of Computer Sciences and Engineering King Fahd University of Petroleum.
MOSFET As switches. Regions of Operation In analogue electronics, the MOSFETs are designed to operation in the pinch-off or saturation region. ▫They are.
Metal-Oxide- Semiconductor (MOS) Field-Effect Transistors (MOSFETs)
CSET 4650 Field Programmable Logic Devices
MOS Inverter: Static Characteristics
Metal-Oxide-Semiconductor Field Effect Transistors
Types of MOSFETs ECE 2204.
Field-Effect Transistors
ECE 342 Electronic Circuits 2. MOS Transistors
Gheorghe M. Ştefan
Mary Jane Irwin ( ) Modified by Dr. George Engel (SIUE)
1. Department of Electronics Engineering Sahand University of Technology NMOS inverter with an n-channel enhancement-mode mosfet with the gate connected.
Chapter 5: Field Effect Transistor
Chapter 07 Electronic Analysis of CMOS Logic Gates
ECE 340 ELECTRONICS I MOS APPLICATIONS AND BIASING.
Chapter 4 Logic Families.
Modern VLSI Design 2e: Chapter 3 Copyright  1998 Prentice Hall PTR Topics n Electrical properties of static combinational gates: –transfer characteristics;
Device Characterization ECE/ChE 4752: Microelectronics Processing Laboratory Gary S. May April 1, 2004.
Outline Introduction CMOS devices CMOS technology CMOS logic structures CMOS sequential circuits CMOS regular structures.
VLSI Design Lecture 5: Logic Gates Mohammad Arjomand CE Department Sharif Univ. of Tech. Adapted with modifications from Wayne Wolf’s lecture notes.
1 Chapter 5. Metal Oxide Silicon Field-Effect Transistors (MOSFETs)
EE210 Digital Electronics Class Lecture 7 May 22, 2008.
Digital Integrated Circuits A Design Perspective
11. 9/15 2 Figure A 2 M+N -bit memory chip organized as an array of 2 M rows  2 N columns. Memory SRAM organization organized as an array of 2.
EE210 Digital Electronics Class Lecture 6 May 08, 2008.
EE210 Digital Electronics Class Lecture 10 April 08, 2009
FPGA-Based System Design: Chapter 2 Copyright  2004 Prentice Hall PTR Topics n Logic gate delay. n Logic gate power consumption. n Driving large loads.
Budapest University of Technology and Economics Department of Electron Devices Microelectronics, BSc course MOS inverters
Solid-State Devices & Circuits
EE210 Digital Electronics Class Lecture 8 June 2, 2008.
Modern VLSI Design 3e: Chapter 3 Copyright  1998, 2002 Prentice Hall PTR Topics n Electrical properties of static combinational gates: –transfer characteristics;
CP 208 Digital Electronics Class Lecture 6 March 4, 2009.
7-1 Integrated Microsystems Lab. EE372 VLSI SYSTEM DESIGNE. Yoon MOS Inverter — All essential features of MOS logic gates DC and transient characteristics.
Presentation transcript:

Ch 10 MOSFETs and MOS Digital Circuits Examine MOSFET use in inverters Inverter = two transistors in series Input to gate of driver (at least) Second transistor acts as load Output off connection between transistors NMOS Inverters Enhancement driver, resistor load Enhancement driver and load Enhancement driver, depletion load CMOS Inverter N channel driver, P channel load Analyze to find inverter performance: * Voltage transfer characteristic * Noise margins * Power dissipation * Switching speed Load Driver Vo Vi Ch 10 MOS Digital – Pt. 1

MOSFETs and MOS Digital Circuits Inverters combined in series and parallel to form digital circuits such as AND’s, NAND’s, OR’s, NOR’s, flip- flops, etc. Understanding inverter operation is basic to understanding and describing digital circuit operation Also important in modifying their design to enhance their performance, e.g. speed, power dissipation, susceptibility to noise, and fan-out capability Ch 10 MOS Digital – Pt. 1

N-Channel Enhancement MOSFET Positive voltage on gate attracts electrons to surface to form “induced channel of electrons”. Channel forms path for electron flow between source and drain. Without channel, have back-to-back diodes in series between source and drain so negligibly small current Ch 10 MOS Digital – Pt. 1

N-Channel Enhancement MOSFET Basics of device operation VTh = threshold voltage No channel of electrons for vGS < VTh No current for vGS < VTh VTh > 0 for enhancement mode n-channel MOSFET iDS iDS Saturation mode operation (large VDS) Channel formation for vGS > VTh Increasing vGS Increasing vGS vDS vGS VTh Ch 10 MOS Digital – Pt. 1

N-Channel Enhancement MOSFET iDS vDS sat = v GS – VTh Constant vGS curve vDS Ch 10 MOS Digital – Pt. 1

N-Channel Enhancement MOSFET Cutoff region (vGS < VTh) Triode region (vDS < vDSsat) Triode-saturation boundary at vDS = vDSsat = vGS - VTh OR where vGS - vDS = VTh Saturation region (vDS > vDSsat) iDS vDS sat = v GS – VTh where vDS Ch 10 MOS Digital – Pt. 1

N-Channel Depletion MOSFET Basics of device operation VTh < 0 for depletion mode n-channel MOSFET VTh = threshold voltage Channel exists even when no bias is applied to the gate, i.e for vGS = 0. Drain current can flow for vGS = 0 and for any vGS > VTh. No channel of electrons for vGS < VTh No drain current for vGS < VTh N-type channel iDS Saturation mode operation vGS VTh Ch 10 MOS Digital – Pt. 1

N-Channel Depletion MOSFET iDS Cutoff region (vGS < VTh) Triode region (vDS < vDSsat) Triode-saturation boundary at vDS = vDSsat = vGS - VTh OR where vGS - vDS = VTh Saturation region (vDS > vDSsat) vDS sat = v GS – VTh vGS= 0 vDS Cutoff * Only difference from enhancement mode device is that the gate voltage may be negative. But vGS must still be larger than the threshold voltage for the device to be on! Ch 10 MOS Digital – Pt. 1

N-Channel Enhancement vs Depletion MOSFET Enhancement MOSFET (VTh > 0 ) Cutoff region (vGS < VTh) Triode region (vDS < vDSsat) Triode-saturation boundary at vDS = vDSsat = vGS - VThOR where vGS - vDS = VTh Saturation region (vDS > vDSsat) iDS vDS vGS < VTh Depletion MOSFET (VTh < 0 ) iDS vGS = 0 vDS Ch 10 MOS Digital – Pt. 1

NMOS Inverter (E-MOSFET + Resistor Load) Analyze to find inverter performance: voltage transfer characteristic, noise margins, power dissipation and switching speed Transistor characteristics (driver) + + vo vi _ _ Ch 10 MOS Digital – Pt. 1

NMOS Inverter - Load Line Device operation in inverter Load line comes from connections of transistor in the circuit For a given vGS, e.g. 3V (=VTh+2V), transistor’s operating point is where load line crosses vGS = 3V transistor characteristic. Transistor must operate on load line as gate voltage changes. At points A, the transistor is in cutoff mode (small vGS). Between points A and C (larger vGS), transistor is in saturation mode. Between points C and D (even larger vGS), transistor is in triode mode. + vo = v DS _ iDS VDD/RD =5V/2K =2.5 mA D Increasing vGS Load line . A C vDS VDD Ch 10 MOS Digital – Pt. 1

NMOS Inverter (E-MOSFET + Resistor Load) Voltage transfer characteristic Vo versus Vi Region I (A to B) 0 < Vi < VTh iD = 0 since transistor is off, i.e. in cutoff. + + vo vi _ _ vo iDS A B 5V I A to B . vDS vi VTh=1V 5V Ch 10 MOS Digital – Pt. 1

NMOS Inverter (E-MOSFET + Resistor Load) Region II (B to C) Vi > VTh and iD > 0 since transistor is on. iD is increasing as Vi = vGS increases Transistor is operating in saturation mode since vDS > vDSsat + + vo vi _ _ vo iDS vDSsat A B 5V I II C A to B C . vDS vi VTh =1V 5V Ch 10 MOS Digital – Pt. 1

NMOS Inverter (E-MOSFET + Resistor Load) Where is point C and what are the corresponding values of Vi and Vo? At C, transistor is operating at the edge of the saturation mode where + + vo vi _ _ iDS vo A B 5V C I II A to B . C 1.2V vDS vi VTh 2.2V 5V Ch 10 MOS Digital – Pt. 1

NMOS Inverter (E-MOSFET + Resistor Load) Region III (C to D) Vi > VTh and iD > 0 since transistor is still on. Transistor is operating in triode mode so + + vo vi _ _ iDS vo B A At D, vi = 5V and vo= 0.95V or 8.7V (not possible). 5V D I II III C A to B C . 1.2V D vDS 0.95V vi VTh 2.2V 5V Ch 10 MOS Digital – Pt. 1

Noise Margins for NMOS Inverter (E-MOSFET + Resistor Load) Noise margin for low state Measures degree of inverter sensitivity to noise for the low state, i.e. how large an input noise signal causes problems at output. Assumes identical inverter providing input signal Noise Margin = NML = VIL - VOL where VOL = output voltage when input set to VOH VIL = maximum input voltage recognized as a low input For this inverter design, NML is very low (0.05V) ! Can change by changing R or VTh or transistor’s K. high high low vo VOH = 5V NML= VIL - VOL = 1.0 V- 0.95 V = 0.05 V VOL= 0.95V vi 5V VIL=VTh = 1.0V Input signal size with noise that causes problems.. Vi =VOL = 0.95V Normal low input signal size without noise. Ch 10 MOS Digital – Pt. 1

Noise Margins for NMOS Inverter (E-MOSFET + Resistor Load) Noise margin for high state Measures degree of inverter sensitivity to noise for the high state, i.e. how large a negative input noise signal causes problems at the output. Assumes identical inverter providing input signal Noise Margin = NMH = VOH - VIH where VOH = output high voltage when input set to VOL VIH = minimum input voltage recognized as a high input Can change by changing R or VTh or transistor’s K. How do we find VIH? low low high vo VOH = 5V NMH = VOH - VIH Slope = -1 VOL= 0.95V 5V vi Input signal size with noise that causes problems. VIH Vi=VOH Normal high input signal size without noise. Ch 10 MOS Digital – Pt. 1

Noise Margins for NMOS Inverter (E-MOSFET + Resistor Load) Noise margin for high state Noise Margin = NMH = VOH - VIH where VOH = output high voltage when input set to VOL VIH = minimum input voltage recognized as a high input Can find VIH by using expression derived for region II This VIH is less than 2.2V where FET enters region III, so our guess that device at VIH is in region II is okay. low low high vo VOH = 5V NMH = VOH - VIH = 5 V- 1.83 V = 3.17 V Slope = -1 VOL= 0.95V C 2.2V 5V vi VIH Vi=VOH II III Ch 10 MOS Digital – Pt. 1

Noise Margins for NMOS Inverter (E-MOSFET + Resistor Load) Alternate analysis for Noise margin for high state Noise Margin = NMH = VOH - VIH Can find VIH by using expression derived for region III The noise margin for the high state NMH now becomes smaller. NMH = VOH – VIH = 5 V- 4.5 V = 0.5 V This is smaller than the previously determined value, but is still a factor of ten larger than that for the low state NML = 0.05 V. low low high vo VOH = 5V NMH = VOH - VIH = 5 V- 4.5 V = 0.5 V VO= 1.0 V VOL= 0.95V C 2.2V 5V vi VIH VOH II III Ch 10 MOS Digital – Pt. 1

Power Dissipation for NMOS Inverter (E-MOSFET + Resistor Load) Input low, output high. Transistor is off, iD = 0. Power dissipation PH = 0 Input high (5 V), output low (0.95 V). Average Static Power Dissipation P + + vo vi _ _ iDS vo A B 5V D I II III C A to B C . 1.2V D vDS 0.95V vi VTh 2.2V 5V Ch 10 MOS Digital – Pt. 1

Propagation Delays and Switching Times for NMOS Inverters Previously considered static characteristics of inverters, e.g. Voltage transfer characteristic. Switching performance is also of interest. Finite switching times are due to the capacitance load on the output and RC charging and discharging times. Capacitance load comes from: 1) gate capacitance of subsequent inverters to which the output is connected and 2) capacitance of interconnect wires to inputs of other gates. Propagation delays tPHL = output high to low tPLH = output low to high tP = (1/2)(tPHL+ tPLH) ) defines the speed of the inverter. + + vo vi _ _ vi t vo t Ch 10 MOS Digital – Pt. 1

Propagation Delays and Switching Times for NMOS Inverters Load Output goes from Low to High Drive transistor turns off Load resistor provides current to charge up C. tPLH = time to charge to the midpoint ½(VOH+VOL) = 1/2(5V + 0.95V) = 3.0V iR iC + C Driver + vo vi=VOL iD= 0 _ _ vo VDD 3V tPLH VOL= 0.95V t Ch 10 MOS Digital – Pt. 1

Propagation Delays and Switching Times for NMOS Inverters Load Output goes from High to Low Drive transistor turns on But load resistor continues to provide some current so tPHL = time to discharge from VOH = VDD to (VOH+VOL) = 1/2(5V + 0.95V) = 3.0V vi = VOH iR iC + C Driver + vo vi =VOH iD _ _ vo VDD 3V tPHL VOL= 0.95V t Ch 10 MOS Digital – Pt. 1

Propagation Delays Time for NMOS Inverters Load Output goes from Low to High Drive transistor turns off Load resistor provides current to charge up C. Output goes from High to Low Drive transistor turns on to discharge the capacitor but Load resistor continues to provide current. Average Propagation Time tPD iR iC + C Driver + vo vi=VOL iD= 0 _ _ vo vo VDD VDD 3V 3V VOL= 0.95V tPLH tPHL t VOL= 0.95V t Ch 10 MOS Digital – Pt. 1

Propagation Delay for NMOS Inverter Output goes from High (VOH = 5V) to Low (VOL = 0.95V) Driver transistor Q (starts from P  R  S  T) At outset, Q is off (P), and vDS1 = vo = VOH = 5V, vi < VTh Driver turns on (P to R) when vGS is switched to VOH = 5 V. Driver initially is in saturation mode, then eventually moves into triode as capacitor discharges and vo (= vDS) decreases Q moves along constant vGS characteristic (R  S  T). Ends at (T) in triode region, where vDS = vo = VOL = 0.95V. Load resistor continuously providing current opposing discharge of capacitor. Output goes from Low to High Drive transistor is off (vi = 0.95 V < VTh = 1.0 V Transistor moves from T  P as the output voltage vo rises to 5 V. Load iC iR Driver C iD Driver iDS R S vi = vGS = VOH =5 V T P vDS vo=VOL =0.95V vo =VOH = 5 V Ch 10 MOS Digital – Pt. 1

Power-Delay Product for NMOS Inverter (E-MOSFET + Resistor Load) Average Propagation Time tPD Average Power Dissipation P Power-Delay Product DP C * Resistor’s Undesirable Effects Wasted power for transistor on (output low) Resistor provides limited charging current Maximum iR = 2 mA, but iR decreases as vo rises. iR slows down discharge of C when output goes low. * Problems with this inverter: * Unequal noise margins! NML = 0.05 V, NMH = 3.17 V * Unequal transition times! τPHL = 4.5 nsec, τPLH = 14 nsec * Significant power dissipation! Can we improve on this inverter ? Ch 10 MOS Digital – Pt. 1