Renesas Electronics America Inc. © 2010 Renesas Electronics America Inc. All rights reserved. ID A18C: Walking the Low-power/High- performance Tightrope in Portable or Battery-operated Equipment Mike Clodfelter Product Marketing Manager, 16bit K0R MCUs 12 & 13 October 2010 Version: 1.0

2 © 2010 Renesas Electronics America Inc. All rights reserved. Mike Clodfelter Product Marketing Manager for Renesas Electronics 16bit K0R Ultra-low Power MCUs Specialist in MCUs for the medical/healthcare, and Low-Power, portable/Battery-operated Application markets PREVIOUS EXPERIENCE: Joined NEC Electronics America in 1985 as a senior FAE, with an emphasis on MCUs, LCD drive and VF displays, for white goods and Industrial control/consumer markets. Staff FAE from , adding market segments such as cable modem, digital AV, telecom equipment and automotive modules to responsibilities. Prior to NEC Electronics America, design engineer at Motorola Communications Group Member of the IEEE professional association BSEE from Rose-Hulman Institute of Technology

3 © 2010 Renesas Electronics America Inc. All rights reserved. Renesas Technology and Solution Portfolio Microcontrollers & Microprocessors #1 Market share worldwide * Analog and Power Devices #1 Market share in low-voltage MOSFET** Solutions for Innovation ASIC, ASSP & Memory Advanced and proven technologies * MCU: 31% revenue basis from Gartner "Semiconductor Applications Worldwide Annual Market Share: Database" 25 March 2010 **Power MOSFET: 17.1% on unit basis from Marketing Eye 2009 (17.1% on unit basis).

4 © 2010 Renesas Electronics America Inc. All rights reserved. 4 Renesas Technology and Solution Portfolio Microcontrollers & Microprocessors #1 Market share worldwide * Analog and Power Devices #1 Market share in low-voltage MOSFET** ASIC, ASSP & Memory Advanced and proven technologies * MCU: 31% revenue basis from Gartner "Semiconductor Applications Worldwide Annual Market Share: Database" 25 March 2010 **Power MOSFET: 17.1% on unit basis from Marketing Eye 2009 (17.1% on unit basis). Solutions for Innovation

5 © 2010 Renesas Electronics America Inc. All rights reserved. 5 Microcontroller and Microprocessor Line-up Superscalar, MMU, Multimedia  Up to 1200 DMIPS, 45, 65 & 90nm process  Video and audio processing on Linux  Server, Industrial & Automotive  Up to 500 DMIPS, 150 & 90nm process  600uA/MHz, 1.5 uA standby  Medical, Automotive & Industrial  Legacy Cores  Next-generation migration to RX High Performance CPU, FPU, DSC Embedded Security  Up to 10 DMIPS, 130nm process  350 uA/MHz, 1uA standby  Capacitive touch  Up to 25 DMIPS, 150nm process  190 uA/MHz, 0.3uA standby  Application-specific integration  Up to 25 DMIPS, 180, 90nm process  1mA/MHz, 100uA standby  Crypto engine, Hardware security  Up to 165 DMIPS, 90nm process  500uA/MHz, 2.5 uA standby  Ethernet, CAN, USB, Motor Control, TFT Display High Performance CPU, Low Power Ultra Low Power General Purpose

6 © 2010 Renesas Electronics America Inc. All rights reserved. 6 Microcontroller and Microprocessor Line-up Superscalar, MMU, Multimedia  Up to 1200 DMIPS, 45, 65 & 90nm process  Video and audio processing on Linux  Server, Industrial & Automotive  Up to 500 DMIPS, 150 & 90nm process  600uA/MHz, 1.5 uA standby  Medical, Automotive & Industrial  Legacy Cores  Next-generation migration to RX High Performance CPU, FPU, DSC Embedded Security  Up to 10 DMIPS, 130nm process  350 uA/MHz, 1uA standby  Capacitive touch  Up to 25 DMIPS, 150nm process  190 uA/MHz, 0.3uA standby  Application-specific integration  Up to 25 DMIPS, 180, 90nm process  1mA/MHz, 100uA standby  Crypto engine, Hardware security  Up to 165 DMIPS, 90nm process  500uA/MHz, 2.5 uA standby  Ethernet, CAN, USB, Motor Control, TFT Display High Performance CPU, Low Power Ultra Low Power General Purpose 78K ULTRA LOW POWER! Easy to program Low Cost Great IDE The Cube is Suite!

7 © 2010 Renesas Electronics America Inc. All rights reserved. Innovation Proliferation of Battery-Operated Equipment: Compact and Cordless

8 © 2010 Renesas Electronics America Inc. All rights reserved. Agenda Intro to Low-power Battery-operated Instruments 7 Low-power Design Considerations Renesas Electronics 16-bit Ultra-Low Power MCU Lineup Design Example

9 © 2010 Renesas Electronics America Inc. All rights reserved. Key Takeaways By the end of this session you will be able to: Identify Key Low Power System Design Considerations Identify Keys Ways to Conserve Power in Low Power Applications Recite Pitfalls in Portable/Battery-Operated Designs Identify Renesas MCUs having Optimum Performance at Ultra-low power with High integration

10 © 2010 Renesas Electronics America Inc. All rights reserved. Walking the Low-power/High-performance Tightrope in Portable or Battery-operated Equipment Low Power Consumption High Performance

11 © 2010 Renesas Electronics America Inc. All rights reserved. Portable, Battery-Operated Instruments Examples of General Portable Instruments Medical/Diagnostic Personal hygiene/Healthcare Industrial/Commercial Sensors Wireless Networking Device Smoke/CO Alarms Examples of Long-Life Instruments Utility Water/Gas Meters Pacemakers Tollway Transponders Performance Long Life

12 © 2010 Renesas Electronics America Inc. All rights reserved. System Power Challenges for Battery-operated Instruments Time System activity and current draw MCU wakes up with button press System initial- ization 2 Wait for blood test strip insertion 3 A/D conversion and calculate Glucose level 4 Display result 5 1 STOP/ Standby mode No further button activity, back to STOP/standby minutes depending on user’s activity Test strip >99% Time in STOP/Standby mode: very low-power & time-of-day clock Handheld Blood Glucose Meter

13 © 2010 Renesas Electronics America Inc. All rights reserved. Seriously: Keep Clock Freq. Low, Max. efficiency Gate Peripherals On/Off Reduce Current “Sneak” Paths Choose Batteries w/ Best Fit Keep Temp Range Low MCU w/ Internal Regulator How to maximize Battery life and Performance (High Level)

14 © 2010 Renesas Electronics America Inc. All rights reserved. MCU/CPU Operational Definitions CPU Operation/ Active Mode CPU Operation/ Active Mode CPU Halt/Idle Mode CPU Halt/Idle Mode CPU STOP/Standby 32KHZ/RTC Mode Instructions Executed, All Peripherals Available Instructions Execution Suspended, Main System Clock Running All Peripherals Available Instructions Execution STOP, Main System Clock STOP Few Peripherals Available CPU STOP/Standby Mode (No Clocks) Instructions Execution STOP, Main System Clock STOP 32KHZ/RTC STOP

15 © 2010 Renesas Electronics America Inc. All rights reserved. 7 Low-power Design Aspects to Consider The power:performance balance 1.Battery Attributes and Tradeoffs 2.Peripheral functions 3.CPU performance/Clocking Issues 4.Internal LDO voltage regulator 5.I/O Port Loading, Floating Input Danger 6.Low Power Displays - Segmented LCD 7.Temperature effects on standby current

16 © 2010 Renesas Electronics America Inc. All rights reserved. #1a – Battery Choice Issues (Intro): Load Capacity versus Lifetime Peak Current Draw Voltage Range Characteristics Self-Leakage versus Time/Temp Internal Series Resistance (ESR) Primary (Disposable) vs Secondary (rechargeable) Akaline/Cylindrical Lithium Coin Cells PCB-Mount AA AAA

17 © 2010 Renesas Electronics America Inc. All rights reserved. Operating Hours Voltage (Constant Current Load) Constant Current #1b – Varying Battery Voltage Over Life Battery Physical Size/Capacity and Personality “Flat” battery life curve Akaline (>370 milliwatt hr/cc) Capacity: ~2500mA-HR AA Capacity: ~1200mA-HR AAA Use Low Battery Detect to Monitor Voltage! Voltage (Constant Current Load) Operating Hours Constant CV (IxV) Loads 100mW 250mW Lithium coin ( ~650 milliwatt hr/cc) Capacity: ~610mA-HR CR2450 CR2032 Capacity: ~220mA-HR “Sloping” battery life curve

18 © 2010 Renesas Electronics America Inc. All rights reserved. #1c - Battery life target calculations Time System Activity and current draw Display result Total current = 1mA-SEC + 9mA-SEC + 120mA-SEC + 90mA-SEC = 220 mA-SEC (average per reading) Target: 5 readings per day, 1100mA-SEC per day Assuming 1uA in standby, daily = (85,370 sec x 1ua) + (1100 mA-SEC) = 1185 mA-SEC Approximate life = (220mA-hr x 3600 sec/hr)/1185 mA-SEC/day = 668 days A/D conversion and calculate Glucose level System initial- ization Wait for blood test strip insertion No further button activity, back to STOP/standby MCU wakes up with button press STOP/ Standby mode Check to see if CR2032, 220mA-hr capacity meets application target time!

19 © 2010 Renesas Electronics America Inc. All rights reserved. #1d – Battery Self-Leakage Battery self-leakage is always acting 22C 45C Age (Years) Lithium Battery Self-discharge % of Initial Capacity + - R Leakage V open circuit +-+- Internal Leakage Increase Exponentially At Elevated Temps!

20 © 2010 Renesas Electronics America Inc. All rights reserved. #1e – Aging battery concerns At battery end-of-life, ESR (Equivalent Series Resistance) increases dramatically (10x-100x of initial) Consider using an MCU with low-battery detect! MCU R Load = 300 Ohms V load = 3.0V V load = 3.0V R ESR = 10 Ohms 3.1V 10mA load V drop = 0.1V MCU R Load = 300 Ohms V load = 1.8V R ESR = 100 Ohms 2.4V 6mA load V drop = 0.6V R ESR V open circuit MCU I Load = 10 mA V load = 1.4V R ESR = 100 Ohms 2.4V 10mA load V drop = 1.0V MCU in Danger of RESET! MCU WILL RESET! Case A: Case B: Case C:

21 © 2010 Renesas Electronics America Inc. All rights reserved. 3.1V 2.8V 2.5V 2.2V 1.9V 2.7V 2.2V 1.7V 1.5V 1.6V Low Voltage Detect Interrupt Flag Interrupt Service Routine Internal RESET Aging BatteryWeak BatteryDead Battery LV Detect = 2.9V LV Detect = 2.3V LV Detect = 1.9V Action Taken: Lower CPU Speed, Set LVD = 2.3V, Interrupt Mode Action Taken: Lower CPU Speed, Set LVD = 1.9V, Reset Mode, Show Low Batt. Symbol Action Taken: Lower CPU Speed, Set LVD = 1.9V, Reset Mode Time Battery Voltage #1f - Using Low Voltage Detect Circuit to Monitor Sagging Battery Voltage

22 © 2010 Renesas Electronics America Inc. All rights reserved. Question 1: What battery characteristic more than all else challenges a designer’s skill for making a robust low power MCU design? Answer: a. Temp range b. Battery Capacity c. Voltage range d. Equivalent Series Resistance e. Self-Leakage Question

23 © 2010 Renesas Electronics America Inc. All rights reserved. Analog, Transducer Signals Digital processing (CPU/ SW) Op-amps (Amplify, filter) Op-amps (Amplify, filter) Digitize (12-bit ADC) Digitize (12-bit ADC) Convert To analog (DAC) Convert To analog (DAC) LCD controller/ driver with boost LCD controller/ driver with boost Analog voltages (AC and DC) Voice/tones DC Voltage Level Display results Stable, accurate VREF Real Time Clock Watch Dog Timer Serial Ports Timers/ Counter Timers/ Counter Low Voltage Detect Comparators DMA #2 – Managing Peripherals Peripheral functions Digital (Primarily AC Drain) Analog (Primarily DC Drain) Other: DC current in Standby? AC current when operating? Can clocks be gated/scaled? What should be left on in standby mode? MCU Analog Blocks MCU Analog Blocks Legend: CPU/ SW MCU Digital Blocks MCU Digital Blocks CPU Active Mode (all resources) CPU Active Mode (all resources) CPU Halt/Idle Mode (all Peripherals) CPU Halt/Idle Mode (all Peripherals) CPU STOP Mode Vs. 20% x Active Current <0.01% x Active Current Digital processing (CPU/ SW) CPU/ SW Digital processing (CPU/ SW) CPU/ SW CPU/ SW

24 © 2010 Renesas Electronics America Inc. All rights reserved. #3a – Use CPU Clock for Optimum Performance/Current Drain CPU performance vs. Clock Frequency Goals 1 or 2 clock cycles Highest Lowest current Scale back/turn off CPU Minimize average battery drain Better 0.5mSEC (8mA-SEC) ~ CPU Clock Tradeoff Example Cycle time depends on application Best! 8MHz 2mSEC (4mA-SEC) ~ 0.5MHz 20mSEC (10mA-SEC) Good ~ Some MCUs use a 2x/4x Oscillator – not as efficient as One-to-one OSC: CPU The Fastest speed - not always the most efficient one Some MCUs use a 2x/4x Oscillator – not as efficient as One-to-one OSC: CPU The Fastest speed - not always the most efficient one

25 © 2010 Renesas Electronics America Inc. All rights reserved. (1) Internal high-speed system clock for fast startup #3b –Use Internal High Speed OSC to Minimize Startup Time, Save Power Normal Operation Oscillation Standby Release Signal Status of CPU Internal High-Speed Oscillation Clock STOP Mode Oscillation Stopped STOP Instruction (2) External Xtal/resonator oscillator for accuracy STOP Mode Oscillation Stopped STOP Instruction Normal Operation Int. HS. Oscillation * Normal Operation Int. HS. Oscillation Standby Release Signal Status of CPU Internal High-Speed Oscillation Clock External Xtal/Resonator * Optional XTAL/Resonator Oscillation Stabili- zation Int. HS. Oscillation Normal Operation Supply of Clock Is Stopped Interrupt Request Supply of Clock Is Stopped Interrupt Request

26 © 2010 Renesas Electronics America Inc. All rights reserved. I/O Ext. osc. block MCU core voltage reg. DAC ADC CPU POR/ POC Int. HS osc. WDT RTC I/O LCD C/D with booster Op- amp Voltage ref. Timers Serial Low volt detect Com- parator Clock gen. stby control #4 – Use Internal Voltage Reg. to Minimize Current Drain Internal voltage regulator Internal core LDO voltage regulator - Keeps CPU and core function current drains constant Functions attached to I/O pins - Current drains rise proportionally to supply voltage 1.8V 2.4V 3.0V 3.6V 4.2V 4.8V 5.5V Supply Voltage Supply Current, CPU and Core Peri- pherals MCUs with No Internal Voltage Reg; Current Drain Increases with Supply Voltage! MCUs with No Internal Voltage Reg; Current Drain Increases with Supply Voltage! MCUs with an Internal Voltage Reg; Current Drain Constant Over Supply Voltage! MCUs with an Internal Voltage Reg; Current Drain Constant Over Supply Voltage!

27 © 2010 Renesas Electronics America Inc. All rights reserved. Question 2: What are the reason(s) why newer MCU designs use an internal LDO voltage regulator Answer 2: a. To provide a stable CPU core voltage b. To optimize the CPU core design using a limited internal Voltage range c. To reduce the power dissipation d. To reduce current drain at higher Supply Voltage e. all the above Question

28 © 2010 Renesas Electronics America Inc. All rights reserved. #5a – Avoid “Sneak paths” on I/O Lines I/O drive and loading MCU General purpose I/O pin, Output = Low IOL VOL Output Low Loading Ext. Circuit Output High Loading IOH VOH MCU General purpose I/O pin, Output = High Ext. Circuit VDD = 3.0 Volts R R Pull-Up Turned On Output data P-ch N-ch P-ch Output disable Pull-up enable Input enable Input data VDD Input Pull up/Pull down Pin Loading Ext. Circuit

29 © 2010 Renesas Electronics America Inc. All rights reserved. #5b – Avoid Floating Input Pins Phenomena of floating inputs (due to contaminated PCBs) 0V 1.0V 2.0V 3.0V 4.0V 5.0V 5.0V 4.0V 3.0V 2.0V 1.0V 0V 5uA 4uA 3uA I DD 2uA 1uA 0uA Vout Vin Side Bar: PCB cleanliness Board contaminants can often swamp out nano-amp standby currents INPUT pin P-ch N-ch Gate VDD To Internal MCU circuits IDD = “On” currents Leakage paths VDD 10 MegOhm? 10 MegOhm?

30 © 2010 Renesas Electronics America Inc. All rights reserved. Advantages of Segmented STN LCD panels Low Current Drain Works in STOP/Standby (32KHZ) Large Segment Count Inexpensive Customized - Quick Tooling TAT Disadvantages: Need Backlight Contrast/View Angle vs. Drive #6a – Using Segment LCD panels to Save Power + mmgl dL Dot matrix example: 8x50 dots Modern LCD MCUs, Flexible LCD drive – LCD Booster Resistive Divider, Split Capacitor Alphanumeric: Segments Full custom: Segmented LCD panels – STN (Super Twist Nematic)

31 © 2010 Renesas Electronics America Inc. All rights reserved. #6b – Optimum LCD Panel Drive Driving Segmented STN (Super Twist Nematic) LCD panels MCU 2R* R* VLC0 VLC1 VLC2 VSS0 VDD P-ch Resistor Ladder Network 3V Constant Current Drain, Declining: Drive Voltage Contrast (example: If R =100K, Then 10uA is drawn continuously!) Capacitor Charging gives back to LCD Panel (almost no DC Bias Loss) C1= C2= C3= C4= C5= 0.47uF C1 C2C3C4 VLC0 VLC1 VLC2 VLC3 CAPH CAPL LCD Booster C5 Constant: Drive Voltage Contrast MCU

32 © 2010 Renesas Electronics America Inc. All rights reserved. #7 - Effects of temperature on standby current (STOP/halt IDD) -35C -25C -15C -5C +5C +15C +25C +35C +45C +55C +65C +75C +85C 0.7uA 0.6uA 0.5uA 0.4uA 0.3uA 0.2uA 0.1uA 0.0uA 100% 90% 80% 70% 60% 50% 40% 30% STOP/halt IDD = 3V % of battery capacity after 10years (Lithium) RAM leakage current mainly affects STOP/halt current increase (> 55C) Battery Drain from RAM Leakage: 0.2uA – 1uA Typ. 2uA-8uA Max. Battery Drain from RAM Leakage: 0.2uA – 1uA Typ. 2uA-8uA Max. Battery Drain from Self-Leakage: 10s of uA

33 © 2010 Renesas Electronics America Inc. All rights reserved. Renesas Electronics’ Ultra-Low-Power K0R MCUs Renesas Electronics delivers full line of 16bit ultra-low-power MCUs Designed for low power 150nm flash process; – Low current consumption; low leakage – Small size and high performance – Special architecture (secret sauce) Industry-leading low-power, Optimum performance Dynamic System Clocking = Flexible On-Chip Peripherals ++ Multiple Standby Modes + + High Perform. CPU Low leakage 150nm Process Renesas Ultra Low Power MCU Attributes

34 © 2010 Renesas Electronics America Inc. All rights reserved. K0R Ultra-Low Power MCU Design Keys Analogy: Turn Off Car Engine instead of Idling! Opcode (Byte1) Opcode (Byte1) Operand (Byte2) Operand (Byte2) Operand (Byte3) Operand (Byte3) Opcode (Byte1) Opcode (Byte1) Opcode (Byte2) Opcode (Byte2) Operand (Byte3) Operand (Byte3) Turn off Opcode Decoder Earlier! Turn off Opcode Decoder Earlier Instruction Fetch operation: Analogy: Turn off the lights when you leave the room! Analogy: Turn off the lights when you leave the room! Halt Hi-Speed Internal Oscillator Hi-Speed Internal Oscillator X1 Clock Sub Clock CPU Peripheral Function Clock Selection Peripheral Function RTC Peripheral Function PS Added

35 © 2010 Renesas Electronics America Inc. All rights reserved. High Performance High Performance Quick Startup On Int. Oscillators: 20/8/1 MHZ Quick Startup On Int. Oscillators: 20/8/1 MHZ Stop Mode With 32KHZ/RTC Running Stop Mode With 32KHZ/RTC Running High Accuracy Internal to +85C High Accuracy Internal to +85C Efficient Watchdog Timer Operation Efficient Watchdog Timer Operation Internal 1MHZ CPU Clocking Internal 1MHZ CPU Clocking Up to Ultra-Low Active Current: 190uA typical 8MHZ 20MHZ 23uSEC-31uSEC max startup 78K0R Comprehensive Low Power CPU Operation Modes RTC Day/Week Alarms 1ppm Calibration 0.9uA Typ Stop Mode With No Clocks: (Ext Pin Wakeup) Stop Mode With No Clocks: (Ext Pin Wakeup) Flexible but Energy-Conserving Low Power Modes Internal 2.4V/1.8V LDO Regulator Keeps Current Consumption Low In All Modes (+1.8V V) 0.3uA typical

36 © 2010 Renesas Electronics America Inc. All rights reserved. Expand Active Mode Low Speed (32kHz/ RTC) 32kHz 3.8 uA 0.3uA Standby Mode * (No Clocks) * RAM contents retained Stop Mode* (32kHz/ RTC) 0.9uA 32kHz Efficient Power Management Active Current Low Speed (1MHz) 63uA fIH = 1MHz/4 fIH = 1MHz 190uA Halt/Idle Current 20MHZ8MHZ 1.1mA 0.45mA Active Current High Speed 5.3mA TypIcal 2.4mA 20MHZ8MHZ K0R MCU Current Drains

37 © 2010 Renesas Electronics America Inc. All rights reserved. Pre- Scaler: 1/1 1/2 1/4 1/8 1/16 1/32 Full Accuracy -40 to +85C, +2.7 to +5.5V (0.38uA Max) Output Clock Up To 10MHZ Can Run LCD in Standby Mode <3uA Adds less <0.4uA to Backup Current Full 20MHZ -40C to 85C +2.7 to +5.5V K0R Clocking Options 78K0R/Kx3-L G.P./USB, 78K0R/Lx3/KE3-A LCD/non-LCD (12bit ADC/DACs) Int. Low-speed Osc 30kHz +/- 10% Int. Oscillator 8MHz +/- 1.8% 1MHz +/-13% or 20MHz +/- 2.4% Quick Startup Time: uSEC Prescaler & X8, x12 PLL USB Watchdog Timer Buzzer/Clock Output LCD Controller/ Driver Real-time Counter CPU Peripherals: Serial, ADC, Timer Arrays 2-20MHz Ext. Crystal (X1, X2) or Ext. Clock (EXCLK) 32,768 Hz Subsystem 32kHz Ext. 32kHz Crystal

38 © 2010 Renesas Electronics America Inc. All rights reserved. Selectable Interrupt or Reset by Software Low-Voltage Indicator Detection Voltage Selectable by Software Interrupt or Reset V DD Range: 1.9V to 4.22 V Reset Release K0R/Kx3-L Kx3-L(USB) K0R/Lx3 K0R/KE3-A 78K0R/Kx3-L GP, USB and 78K0R/Lx3 LCD MCU Safety Features POC is always ON, Drawing No extra IDD Current POC is always ON, Drawing No extra IDD Current Plus... An external Pin function. EXLVI function: monitor a power source other than VDD! EXLVI (Port) Boost Regulator Boost Regulator VDD 1.5V 3.3V 78K0R MCU 1.21V LVI can be enabled/ disabled LVI can be enabled/ disabled Power-on Clear (POC) Circuit Detection Voltage Rising 1.61V or 2.07V Reset Occurs Reset Release V DD K0R/Kx3-L Kx3-L(USB) Detection Voltage Falling 1.59V or 2.07V K0R/Lx3 K0R/KE3-A Eliminates External Reset Circuitry Monitors Aging Battery Conditions Monitors Aging Battery Conditions POC Current Included In Standby Spec Value! POC Current Included In Standby Spec Value!

39 © 2010 Renesas Electronics America Inc. All rights reserved. 78K0R/Kx3-L GP, USB and 78K0R/Lx3 LCD Series Flash Options (KB) Package Options K0R/ GP, LCD and USB Line-up 1MB Linear Memory (No banks) K0R/KE3-L K0R/KG3-L K0R/KE3-A, non-LCD Free full-featured 64KB C-Compiler K0R/KC3-L K0R/KD3-L K0R/KE3-L 12bit ADC/DACs, 3ch Op-AMP Expanded Memory 2 Comparators, 1ch PGA K0R/KE3-L(USB) K0R/KC3-L(USB) USB K0R/LF3, LCD K0R/LG3, LCD

40 © 2010 Renesas Electronics America Inc. All rights reserved. 78K0R Gen. Purpose MCU, LCD MCU and USB MCU Composite Block Diagram Common K0R CPU Core and Peripherals Serial Array Unit UART/SPI/I2C Multi-Master I2C DMA Controller 8/16-bit Timer Array 0: 8ch, 16-biT Timer Array 1: 4ch, 16-bit 78K0R 16-bit core 20MHz (up to 18 DMIPS) +1.8V V -40 to +85C POC (Power On Clear) LVI (Low Voltage Indicator): 16 Levels (1.9V-4.2V) Key Interrupt Gen Purpose I/O HW: 16x16 MULT. 32/32 DIV. On chip Debug/ Programming Internal OSC: 1/8/20MHZ Int. WDT OSC: 30kHz Sub-Clock: 32kHz Flash (1KB Blocks)  Secure self-prog.  Boot Swap Clock/Buzzer Output Real-Time Counter (Clock/Calendar) Watch Dog Timer 10-bit ADC Comparators Programmable Gain Amp K0R/Kx3-L Flash:16KB-256KB RAM: 1KB-12KB Pins: LCD Controller/ driver: up to 400 seg. With LCD booster, Resistor Bias, Split Cap Drive 12-bit ADC 12-bit DAC 2ch 3ch OP-AMP K0R/Lx3/KE3-A Flash: 64KB-128KB RAM: 4KB-7KB Pins: Internal Voltage Ref.: 2.0V/2.5V K0R/Kx3-L (USB) Flash: 64KB-128KB RAM: 6KB-8KB Pins: 48, bit ADC USB Function

41 © 2010 Renesas Electronics America Inc. All rights reserved. Question 3: What is the minimum K0R System Clock required to run an LCD C/D with Booster Circuit, while achieving lowest possible current drain. Answer 3: a. External 20MHZ Xtal Oscillator divided by 32 b. Internal 8MHZ Oscillator c. Internal 1MHZ Oscillator divided by 32 d. External 32KHZ (Ceramic Resonator) e. None of the above (LCD booster circuit doesn’t need a Clock) Question

42 © 2010 Renesas Electronics America Inc. All rights reserved. Design Example: 1-Chip Glucose Meter Block Diagram * = Transconductance Amp using op-amp AC/DC BIAS Reagent strip for blood sample LCD Panel ( segments) + AC AMP Annunciator, Voice Playback (ADPCM) User keypad Serial EEPROM Serial EEPROM Voltage Ref. 12-bit ADC 12-bit ADC 12-bit DAC RTC LVI/ Battery monitor LVI/ Battery monitor Op-Amps Timers, GPIO, Serial ports Timers, GPIO, Serial ports POC/ Reset 32kHz 16-bit CPU CORE (3-stage Pipeline) 16-bit CPU CORE (3-stage Pipeline) WDT, 30kHz WDT, 30kHz LCD booster controller/ driver LCD booster controller/ driver Self-Program Flash 12-bit DAC On-chip-debug + - Internal Oscillators * Filter Amp 78K0R/Lx3:

43 © 2010 Renesas Electronics America Inc. All rights reserved. Innovation Renesas Ultra-Low Power K0R MCU Families Facilitate Battery-Operated Equipment

44 © 2010 Renesas Electronics America Inc. All rights reserved. Questions?

© 2010 Renesas Electronics America Inc. All rights reserved. 45 Thank You!

Renesas Electronics America Inc.