PACKAGING SOLUTIONS Christian Ganninger Product Manager MicroTCA, Backplanes and PSU EMEA  : : Rugged MicroTCA

Agenda Rugged MicroTCA: Introduction, explanation of MicroTCA.1 & MicroTCA.3, Statusupdate Presented by Christian Ganninger, Schroff GmbH Rugged MicroTCA Connector tests Presented by Michael Burger, ept Gmbh & Co. KG Rugged MicroTCA Applications Presented by Irene Hahner, Kontron AG

MicroTCA.0 (Micro Telecommunications Computing Architecture Base Specification) MicroTCA.0 as defined provides support for requirements such as NEBS, ETSI and ITU specifications, which are focused on the central office telecommunication environment. Shock & Vibration requirements: ItemVibrationShockSpecification ConnectorContact Only Hz, 10g, 3x 8 hours30g, 11ms, 18 shocksGR-1217-CORE With Module5-100Hz, 1g, 3x 8 hours15g, 11ms, 3 shocks/axisGR-1217-CORE Shelf, Cube, Pico Subrack / Module 2-9 Hz / Hz, 0,5g sinusodial, > 10 min / axis 7g, 11ms, 18 shocksIEC Subrack / Module NEBS Zone 4IEC / ANSI T1.329

Rugged MicroTCA The Rugged Micro Telecommunications Computing Architecture specifications defines the requirements for a System that meets more stringent levels and cycles of temperature, shock, vibration, and humidity than those defined in MicroTCA.0. MicroTCA.1 (Air Cooled Rugged MicroTCA): this first sub-specification of MicroTCA describes rugged air-cooled systems for industrial applications. MicroTCA.2 (Hardened Air Cooled MicroTCA): the second sub-specification of MicroTCA; it describes rugged air-cooled systems for military applications. MicroTCA.3 (Hardened Conduction Cooled MicroTCA): the third sub-specification of MicroTCA; it describes rugged conduction-cooled systems for military applications Adopted 19-Mar-09 Not started In work

MicroTCA.1 (Air Cooled Rugged MicroTCA) Shock & Vibration requirements : ItemVibrationShockModule RetentionSpecification ConnectorContact OnlyXR1 -EIA D XR2 -EIA D With ModuleXR1 AMC.0 Locking LatchIEC XR2 Additional Retention Device mandatoryANSI/VITA 47 Shelf, Cube, Pico Subrack with Plug-in Unit XR1 AMC.0 Locking LatchIEC DL3 XR2XR1Additional Retention Device mandatoryANSI/VITA 47 V2 & DL3 XR1: Vibration 3g Sinusoidal (MicroTCA.0 = 0,5g) (2-9 Hz, amplitude 10 mm, Hz, acceleration 30 m/s², 1 octave/min, 3 axes / 10 cycles each axis) Shock 25g (MicroTCA.0 = 7g) (250 m/s² / 18 ms half-sine, 3 axes, 3 shocks, two directions each axis (18 shocks) In accordance to IEC :2007 Performance level DL3 XR2: Vibration 8g Random ( Hz, 0.04 g²/Hz, 3x1h) In accordance to VITA 47 Class V2 Shock 25g (250 m/s² / 18 ms half-sine, 3 axes, 3 shocks, two directions each axis (18 shocks)) In accordance to IEC :2007 Performance level DL3 Resistance shall not increase more than 10 Ohms for longer than 10 ns per contact pair. See GR-1217-CORE section 5.4.4, objective O5-81

MicroTCA.1 (Air Cooled Rugged MicroTCA) Thermal requirements : 3 different Levels: Ambient (MicroTCA.0) and 2 Extended Temperature ranges XT1 & XT1L MicroTCA.0: - 5°C to + 55°C XT1L:- 40°C to + 55°C XT1:- 40°Cto + 70°C Additional requirements: Drop test, RoHS, Acoustic, Surface temperature are defined as application specific For other requirements like Earthquake, Flammability, Atmospheric, Module insertion cycles, ESD, EMC, Safety MicroTCA.1 refers to the MicroTCA.0 base specification -> actions: Electronic parts with enhanced temperature range, System cooling has to be adopted

MicroTCA.1 (Air Cooled Rugged MicroTCA) Shock & Vibration requirements : ItemVibrationShockModule RetentionSpecification ConnectorContact OnlyXR1 -EIA D XR2 -EIA D With ModuleXR1 AMC.0 Locking LatchIEC XR2 ANSI/VITA 47 Shelf, Cube, Pico Subrack with Plug-in Unit XR1 AMC.0 Locking LatchIEC DL3 XR2XR1ANSI/VITA 47 V2 & DL3 Additional Retention Device mandatory Rugged MicroTCA Retention Device

Rugged MicroTCA Retention Device AdvancedMC.0 front panel MicroTCA.1 front panel ( XR2 ) MicroTCA.1 (Air Cooled Rugged MicroTCA) front panel with flange additional retention screw

Why is a special Retention Device needed? Gap between Faceplate / attachment plane due to tolerances of the module and the subrack 0,0mm min. MicroTCA.1 (Air Cooled Rugged MicroTCA) 1,6mm max.

Why is a special Retention Device needed? Standard AdvancedMC Module Is plugged into the slot until the module is seated on the bottom of the backplane connector body Fixed in this position by the locking mechanism of the handle. Rugged AdvancedMC Module Inserted into the slot until the module is seated on the bottom plate of the backplane connector Fixed in this position by the locking mechanism of the handle. Gap between the front panel flange and the subrack, worst case: 1.6 mm MicroTCA.1 (Air Cooled Rugged MicroTCA)

Why is the Retention Device needed? F Face plate deflection F F When the Rugged MicroTCA Module is screwed to the subrack… … the face plate will be deflected… … and the force will be applied to the connector. The module bare board and the connector bottom side will be stressed. Conclusion: A locking method is needed, that fixes the module in the chassis in position without applying force into direction of the connector. MicroTCA.1 (Air Cooled Rugged MicroTCA)

Solution (patented, part of the MicroTCA.1 specification): Gap 0.0 mm Maximum gap ( 1.60 mm )* µTCA chassis Front panel flangeµTCA chassisFront panel flange 1.60 * Based on 185,85 subrack depth Collet Screw M3 MicroTCA.1 (Air Cooled Rugged MicroTCA) Welded sleeve

Solution for Rugged MicroTCA & AdvancedTCA MicroTCA.1 (Air Cooled Rugged MicroTCA) Easily exchangeable! Only the stainless steel front panel is different from a standard AMC.0 module. Bare board, die cast parts and handle are the same. With a special Rugged AdvancedMC Carrier the MicroTCA.1 Modules can also be used in a AdvancedTCA environment

Result: Force max. = 1,3 N Test Screw fasteners tightened using a torque screwdriver to the DIN prescribed 0,67Nm (for an M3 screw). Three front panel flange to chassis distances were tested: 0.5mm, 1.0mm and 1.5mm. The measurement was repeated for the three distances, a minimum of five times each. 0.5; 1.0; 1.5 Verifications: Test 1: Force effect to backplane and connector cont. MicroTCA.1 (Air Cooled Rugged MicroTCA) Issue Test to determine if loads are transferred through the AMC Module PCB to the chassis backplane and connector when fixing an AMC module with the SCHROFF supplemental RµTCA screw fastener in a µTCA chassis.

Result F Face plate deflection Face plate deflection in mm Force in N Verifications: Test 2: Face plate stiffeness cont. MicroTCA.1 (Air Cooled Rugged MicroTCA)

Verifications: Test 3: Shock and Vibration MicroTCA.1 (Air Cooled Rugged MicroTCA) Standard Schroff MTCA.0 guide rails and die-cast latch retainer Test Jig for Multiple Slots (3 x Mid-size AdvancedMC.0 Double Modules) Backplane with ConCard MicroTCA connectors AdvancedMC.0 Mid-size Module, Double height, 700g Result: Passed! (Electrically and mechanically)

MicroTCA.3 ( Hardened Conduction Cooled MicroTCA ) Shock & Vibration requirements : Test 1: Random vibration - 50 Hz to 100 Hz increasing at 6 dB/octave Hz to 1000 Hz PSD = 0.2 g²/Hz Hz to 2000 Hz decreasing at 6 dB/octave - 3 axis each axis 60 mins No contact discontinuity exceeding 10Ω/10 ns Mechanical shock - 40g/11 ms half sine - 3 axis/two directions each 3 shocks No contact discontinuity exceeding 10 Ω/10 ns Test 2: Random vibration - 50 Hz to 100 Hz increasing at 6 dB/octave Hz to 1000 Hz PSD = 1.5g²/Hz Hz to 2000 Hz decreasing at 6 dB/octave - 3 axis each axis 60 mins No contact discontinuity exceeding 10Ω/10 ns Mechanical shock - 50g/11 ms half sine - 3 axis/two directions each 3 shocks No contact discontinuity exceeding 10 Ω/10 ns preliminary

MicroTCA.3 ( Hardened Conduction Cooled MicroTCA ) Demands other kind of chassis The AdvancedMC Module must be secured with a Wedge-LOK to the chassis The Wedge-LOK has two tasks: - Securing the AdvancedMC module in extreme conditions - Transfering the heat from the hot spots to the outer side of the chassis

MicroTCA.3 ( Hardened Conduction Cooled MicroTCA ) Intention is: don‘t change the AMC module The module will be inserted into a clamshell The Clamshell will be special for the different AdvancedMC modules The Clamshell will contect the hot spots (with thermal paste)

MicroTCA.3 ( Hardened Conduction Cooled MicroTCA ) Intention is: don‘t change the AMC module The module will be inserted into a clamshell The Clamshell will be special for the different AdvancedMC modules The Clamshell will contect the hot spots (with thermal paste) Heat transfer will be from the hot spot through the clampshell and the Wedge-LOK to the chassis The chassis might have heat sinks, cold plates or forced air cooling.

MicroTCA.3 ( Hardened Conduction Cooled MicroTCA ) Status: The PICMG is planing shock & vibrational tests to proof this concept!!!

Rugged MicroTCA Thank you for your attention! PACKAGING SOLUTIONS Christian Ganninger Product Manager MicroTCA, Backplanes and PSU EMEA  : : Rugged MicroTCA