EE: Servicetype#cablesL avg L tot Costs est [ksfr] LV50mm 2, (1)32018576026 (US?) EE fibres yellow ribbons420+332611788US HV (SCEM 04.61.11.145.5) 25 (13+12)

Slides:



Advertisements
Similar presentations
Status of EC-C assembly at Liverpool C Buttar EC PAR, Nikhef Nov 04.
Advertisements

Duct numbering for EE- Wolfgang Funk - CERN CMS 30/07/ B 06.A07.B 07.A 08.B 08.A 09.B 09.A 10.B 10.A 11.B 11.A 12.B12.A 13.B 13.A 14.B 14.A 1.
1 S. Lusin, LV Cabling, CERN 06 Apr 06 LV Cabling 06 Apr 06 S. Lusin Fermilab / CERN Cabling from USC to UXC, Power Distribution.
Duct numbering for EE- Wolfgang Funk - CERN CMS 23/09/ B 06.A07.B 07.A 08.B 08.A 09.B 09.A 10.B 10.A 11.B 11.A 12.B12.A 13.B 13.A 14.B 14.A 1.
Technical Board, 12 July 2005Børge Svane Nielsen, NBI1 Status of the FMD Børge Svane Nielsen Niels Bohr Institute.
EMB PAR, 23 nov P. Perrodo, LAPP, Annecy1 ATLAS EMB SERIE MODULE CABLING Experience started with three successive prototype modules (module 0) in.
Tullio Grassi ATLAS–CMS Power Working Group 31 March 2010 DC-DC converters and Power Supplies requirements for CMS HCAL Phase 1 Upgrade.
Experimental Area Meeting V. Bobillier1 Good connection to earth (in many points) of every metallic parts to be installed in the cavern is very.
VELO upgrade electronics – HYBRIDS Tony Smith University of Liverpool.
CMS ECAL End Cap EDR Meeting CERN 28 Nov. to 29 Nov 2000 A.B.Lodge - RAL 1 ECAL End Cap CMS ECAL End Cap Engineering Design Review. EDR meeting held 28.
Proposal of new electronics integrated on the flanges for LAr TPC S. Cento, G. Meng CERN June 2014.
ATLAS Upgrade ID Barrel: Services around ‘outer cylinder’ TJF updated According to the drawing ‘Preparation outer cylinder volume reservation’
J A Hill – EID RAL 1-2 September EE End Cap Mechanical Design ECAL EE End Cap Engineering CMS-UK Collaboration Meeting Brunel University September.
Saverio Minutoli INFN Genova 1 1 T1 Electronic status Electronics Cards involved: Anode Front End Card Cathode Front End Card Read-Out Control card VFAT.
EE and SE Installation Wolfgang Funk - CERN CMS 11/9/ ) Introduction 2.) Installation scenario 3.) SE schedule, manpower, cost estimates 4.) EE.
1 E906 Pre-Amplifier Card 2009/10/07. 2 E906 Wire Chambers Station1 MWPC: –build a new E906 MWPC. –4500 channels in total. Station2 DC: –recycle old E866.
Straw Electronics status and preparation for the technical run NA62 workshop Siena.
S. Lusin, T1 ESR, CERN 17 Sep 101 Totem T1 ESR 17 Sep 10 S. Lusin Observations from Electrical Inspection of T1.
CMS ECAL End Cap Meeting CERN 19 June to 23 June 2000 A.B.Lodge - RAL 1 ECAL End Cap High Voltage Cards and 2000 Electrical/Thermal Model. Progress on.
Electronic Systems Support CAN Branch PSU Designed: Bjorn Halgren PH-ESS Responsible:Paul Harwood.
Construction and Installation Readiness of TOTEM Roman Pots Detectors Federico Ravotti (PH/TOT) Gennaro Ruggiero (PH/TOT) LHCC minireview – 06 May 2009.
1 Outer Tracker Front-End Layout Distribution of Signals and Bias NIKHEF/HeidelbergOctober 2002.
S. Zelepoukine CMS Electronics Status Report: ECAL Detector Control System S. Zelepoukine IHEP Protvino/ETHZ
ECAL planning, 10 Jul 2003 AB CMS schedule draft v33.1:surface.
Waclaw Karpinski General meeting CMS TRACKER SYSTEM TEST Outer Barrel –TOB Inner Barrel –TIB End cap –TEC TIB TOB TEC Different Geometries One.
Power Distribution Existing Systems Power in the trackers Power in the calorimeters Need for changes.
PXL Cable Options LG 1HFT Hardware Meeting 02/11/2010.
W. Karpinski, Nov CMS Electronics week CMS Microstrip Tracker grounding & shielding of the CMS Tracker R. Hammarstrom (CERN EP/CMT) & W. Karpinski.
CMS ECAL End Cap Meeting CERN 18 Oct to 22 Oct ECAL End Cap High Voltage and Fibre Optic Monitoring Systems Progress. Progress on High Voltage and.
Status report on the development of a readout system based on the SALTRO-16 chip Leif Jönsson Lund University LCTPC Collaboration Meeting
2 Silicon pixel part Done and to be written Written! Under way To be done Introduction 1.Hybrid Pixel Assembly Concept 2.Silicon sensor 1.First thinned.
Mechatronics Task Force, 26-nov-02 Olivier Teller, CERN EP-CMA1 Cooling Mechatronics Schedule.
G. Pugliese RPC requests for GIF++ G.Pugliese, N. Zaganidis and I. Pedraza on behalf of the RPC group 1.
12-nov-2003Muon Plenary, R.Richter1 Status of MDT elx and services ON-chamber –mezzanines –ON-chamber cables –hedgehog boards –CSM Motherboard –CSM Daughterboard.
ECAL – EE Design Status Presentation 19/7/06 D.J.A. Cockerill - RAL 1 EE Design Status D Cockerill CERN 19 July 2006.
Status of NA62 straw electronics Webs Covers Services Readout.
L0 Technical Readiness Review-Electronics Installation Linda Bagby L0 Electronics Installation  System Electronics Overview u Low Voltage s Filter.
Low Voltage Workshop, CMS Electronics Week CERN, 8 June 2010 W. Lustermann, ETH Zurich EB + EE LV systemOPFC MonitoringEB HV systemEE HV system.
P. Aspell CERN April 2011 CMS MPGD Upgrade …. Electronics 2 1.
DCS meeting27.Sep.2002 Serguei Zelepoukine (IHEP, Protvino) Contents: 1. Front-end electronics: problems & solutions. 2. DCS cabling outside the ECAL detector.
Pixel power R&D in Spain F. Arteche Phase II days Phase 2 pixel electronics meeting CERN - May 2015.
12/17/01 Ron Sidwell 1 Run2b Datapath 17 Dec Update Bill Reay, Ron Sidwell, Noel Stanton, Russell Taylor, Kansas State University.
9/17/2008TWEPP 2008, R. Stringer - UC Riverside 1 CMS Tracker Services: present status and potential for upgrade Robert Stringer University of California,
S. ZelepoukineECAL DCS status, ECAL TCG 17.Jun ECAL DCS status: Sensors, probes and cabling (SM/Dee) S. Zelepoukine IHEP Protvino/ETHZ
G. Dissertori ETH Zürich ECAL - DCS 1 ECAL G. Dissertori DCS Coordination Board, Nov 10, 2004 Status report Trigger/DAQ project  DCS.
EOS and type I Prototype Service Modules Mike Dawson (Oxford), Rob Gabrielczyk (RAL), John Noviss (RAL) 19 th January 2015 ATLAS Upgrade Activities, Oxford.
Preparation for production phase Web – New web with HV pigtail qualified (?) – Installed on 2 views in Technical run Very little effect on noise; detector.
High Voltage Cards & 2000 Electronic/Thermal Model. CMS ECAL End Cap Meeting CERN 19 June to 23 June 2000A.B.Lodge - RAL -1 ECAL End Cap 1 EE End Cap Engineering.
9/12/2003Ivan Hruska1 First box prototype –Box design in July ‘03 –Box produced during August ’03 Tested last week in few fingers Small changes necessary.
G. Dissertori ETHZ CMS Electronics ECAL DCS : Plans for 2003 G. Dissertori ETHZ
G. Dissertori ETHZ CMS Electronics ECAL DCS Software Planning G. Dissertori ETHZ
Upgrade PO M. Tyndel, MIWG Review plans p1 Nov 1 st, CERN Module integration Review – Decision process  Information will be gathered for each concept.
D. Greenfield CLRC1 End-cap Mechanics FDR Baseline Design Overview Debbie Greenfield, RAL 1 November 2001.
Duct numbering for EE- Wolfgang Funk - CERN CMS 12/05/ B 06.A07.B 07.A 08.B 08.A 09.B 09.A 10.B 10.A 11.B 11.A 12.B12.A 13.B 13.A 14.B 14.A 1.
ECAL Plenary 27/2/07 D.J.A. Cockerill - RAL 1 Status of the CMS ECAL Endcaps ECAL Plenary, 27 Feb 2007 D Cockerill  VPTs  Electronics and Integration.
CMS-UK Oversight Committee 17/11/06 D.J.A. Cockerill - RAL 1 The CMS Electromagnetic Calorimeter UK Responsibilities Procurement and testing of VPTs Design.
Location of SVD Temperature and Humidity Monitors L.Vitale & L.Lanceri INFN & Univ. Trieste 6 th VXD Workshop, 02/10/2014 SVD parallel for discussion Sep.
Hybrid CMOS strip detectors J. Dopke for the ATLAS strip CMOS group UK community meeting on CMOS sensors for particle tracking , Cosenors House,
2 March 2012Mauro Citterio - SVT Phone meeting1 Peripheral Electronics Some updates Mauro Citterio INFN Milano.
Meeting CERN 28 Nov A.B.Lodge - RAL 1 ECAL CMS ECAL Mechatronics Task Force Meeting.. CMS ECAL Mechatronics Scheme Applicability to EE Meeting held.
Mauro Citterio - Mi meeting
LKr status R. Fantechi.
- STT LAYOUT - SECTOR F SECTOR A SECTOR B SECTOR E SECTOR D SECTOR C
T1 Electronic status Conclusions Electronics Cards:
Meeting on Services and Power Supplies
Mini-drawers, FE-ASIC , Integrator
Pierluigi Paolucci - I.N.F.N. Naples
RPC HV&LV status Introduction HV power supply tender
Overview of T1 detector T1 is composed by 2 arms
Duct numbering for EE- 09/06/2008 Wolfgang Funk - CERN CMS 1 06.B 07.B
Presentation transcript:

EE: Servicetype#cablesL avg L tot Costs est [ksfr] LV50mm 2, (1) (US?) EE fibres yellow ribbons US HV (SCEM ) 25 (13+12) together in bundle (1300) 52 bundles Control (LVR+sense) (US?) DCS 3 types (SCEM , SCEM , SCEM ) 3x x680 2 (ETH) 3 (ETH) 1 (ETH) Wolfgang Funk - CERN CMS 13/01/ TP/cable (40 sensing inhib TP/ Dee)

MEM coax 96 2 (Dee- MEM) 192Saclay MEM TP bus 16 2 (Dee- MEM) 32Saclay MEM ring 24 2 (Dee- MEM) 48Saclay MEM Hybrid 8 18 (MEM- PSU) 144Saclay MEM Ving+sense PSU- US5) 400Saclay MEM fibres yellow ribbons (MEM- outs) 200Saclay MEM laser fibres Saclay Wolfgang Funk - CERN CMS 13/01/20042 LAPP Muller 54744/B SCEM SCEM defined Nexans (ATLAS prod.) Radiospares

Wolfgang Funk - CERN CMS 13/01/20043 Servicetype#cablesL avg L tot Costs est [ksfr] LV 16mm 2 10mm Fibres yellow ribbons US HV SCEM Control (LVR,sense, DCS) SCEM ? ? ES: Total number of cables: EE: 1057 ES: 952 Total length of cables: EE: 28604m ES: 29680m missing: green Ericson fibre cables: 72 (EE) and 19? (ES)

problems to be solved before ordering (1) LV EE : (50mm**2 copper bus bares, sense wires, control-wires for LVRs) : several tests have to be made before we really know if our present baseline is valid. Critical issue is the PSU prototype from CAEN delivered beginning of '04 if we are lucky. Present Baseline: 2 cables (aller, retour) and one 100A PSU per mostly 100crystals, grounding made to cooling bars and backplate, sensing made at distribution box close to each 100crystals, inhibit on/off lines for all LVRs not dealing with control, one common inhibit line per LVR card. Requested tests: analogue/digital power together, sensing, control system architecture verification, AC/DC boxes, PSU, connecting scheme at patch-panel, grounding, LVR radiation tests, inhibit level degradation with radiation? Are the unshielded cables sufficient? Sense and control cables have not yet been selected. LV ES : (16mm**2 and 10mm**2 bus bares, control-wires for LVRs); very recently the baseline has been changed from 6X 16mm**2 to 4X16mm***2 and 4X10mm**2 per feedtrough. Like this we can avoid huge ground loops outside of ES. Electronics to do tests is not yet ready. If we are lucky first tests can be made beginning '04. Present Baseline: 4 cables (aller, retour) 16mm**2 for analogue and 4 cables 10mm**2 for digital and control per feedthrough (1 feedthrough feeds 2 rings normally). Most of control rings are getting power through 2 feedtroughs. One 100A PSU subdivided into 4X 25A supplies per control ring, the 4 subsupplies deliver power for analogue-feedthrough1, analogue-feedthrough2, digital/control-feedthrough1, digital/control-feedthrough2. Grounding made via mechanics inside ES, no sensing, inhibit on/off lines for all analogue and digital regulators together with one line per motherboard leads to 12 Inhibits, Inhibit on/off lines for all GOH regulators with one line per motherboard leads to another 12 Inhibits. CAEN A3100 delivers 24 Inhibits!) Requested tests: analogue/digital power together, sensing, control system architecture verification, AC/DC boxes, PSU, grounding, removal of parasitic powering of chips via clock etc. coming from CCU, LVR radiation tests, inhibit level degradation with radiation? Decision about overcurrent bit, decision about sensing. Taking the return current for the analogue through the structure back out. Are the unshielded cables sufficient? Control cables have not yet been selected (see DCS ES chapter). Wolfgang Funk - CERN CMS 13/01/20044

problems to be solved before ordering (2) Fibers EE: (standard yellow ribbons run in the ducts). The whole system architecture has never been really defined, very recently we started this activity. The problem is that the standard tracker architecture is not applicable, therefore new technical solutions have to be found, developed and verified. The aim is clearly to use as much as possible from the original tracker system. The baseline is a MFS housing (if possible the 4-way) at the patch-panel, where the yellow ribbons start through the ducts. Problems and questions: Can we find the space for 43 boxes (boxes used to go from 12pigtails into 1 yellow ribbon) per Dee inside? (Tony and John are trying hard!). If yes, the length of yellow ribbon to MFS connector is most probably inside the tracker contract, but we need several different lengths! If not,the so-called distributed patch panel connector has to be placed close to the EE patch panel, Therefore the length of fibers+furcation element+yellow ribbon is shorter than in tracker contract. The yellow ribbon has to cover fully the fibers up to connector entrance for protection reasons maybe not inside, but certainly at the other side at the outside of the EE patch panel. Different strain release schemes are under discussion. We found a possible mechanical problem with the 4 way-MFS housing and the MFS connector with our preferred strain release option. Is Diamond willing to produce what we need? Fibers EE: (standard yellow ribbons run in the ducts). The whole system architecture has never been really defined, very recently we started this activity together with EE, see above). The problem is that the standard tracker architecture is not applicable, therefore new technical solutions have to be found, developed and verified. The aim is clearly to use as much as possible from the original tracker system. The baseline is a single way MFS housing (not in the tracker contract and not promoted by Diamond, but in their catalogue?) placed at the fingers where ES is fixed on EE. The furcation element sits in the feedthrough. There is no distributed patch panel connector, since there is no space. Instead we splice the fibers inside ES before the furcation element. Problems and questions: The length of the furcation element+yellow ribbon up the MFS connector is shorter than in tracker contract. The yellow ribbon has to cover fully the fibers up to the connector entrance for protection reasons on both sides of the MFS housing. Different strain release schemes are under discussion. Is the single MFS housing adequate? Wolfgang Funk - CERN CMS 13/01/20045

problems to be solved before ordering (3) HV EE: (single coax for both voltages in bunches). Baseline: for 12 SCs we will have one bundle of 25 (12+13) coax (1 spare) with one connector for 25 coax on each side. For both endcaps we will have 52 cable bunches. Presently tests with the baseline connector and cables are performed at RAL. Tests should be finished this year. We believe that we will handle those 25 (12+13) coax as 1 cable with one connector at each side. Companies will gave quotations for individual coaxes and bunch coax cable. HV EE: (Multi Conductor Cable). Baseline: 76 cables for both endcaps. Tests have been successfully finished. DCS EE: (Multi Twisted pair cable) As far as I know nobody has seriously worked on DCS aspects in EE. Therefore before better knowing I assume the same number of types and sensors as in EB (1 Quadrant=1 SM). The baseline cables of EB would as well fulfill the radiation requirements of EE. Baseline: 3 different multi twisted pair cable for the 3 different DCS systems. PTM (Precision Temperature Monitoring STP 21x2) HM (Humidity Monitoring STP 4x2), TSS (Temperature Safety System, STP 9x2) Problems and questions: Is the number of sensors as I have extrapolated from EB correct? Is the baseline humidity sensor radiation resistant up to EE radiation dose? DCS ES: (Multi Twisted pair cable together with control-wires for LVRs).Dave Barney has prepared a paper on ES DCS. The 100KOhm thermistors used in EB and EE have to be tested for radiation resistance. A 2-wire readout of those should provide the precision of the temperature which is required. Is the baseline humidity sensor radiation resistant up to ES radiation dose? Is the present read-out scheme with ELMBs or the Tracker read-out scheme better (this changes length of cables and therefore might force us to use more wires)? Since the final number of DCS wires is not known and the the number of control-wires for LVRs is not yet fixed (see above) no selection of the cable can yet be done. Wolfgang Funk - CERN CMS 13/01/20046

problems to be solved before ordering (4) MEM EE: (several types of cables between the Dee and the MEM box and between the MEM box and outside) Between the Dee and the MEM box: MEM coax, MEM TP bus, MEM ring. Between the MEM box and outside dispatch box: Hybrid (MEM LV 5V, MEM 2.5V, MEM Ving, MEM sense for all three), Between the MEM box and the outside: OF yellow ribbon Between the Dee and the outside: MEM laser sheath (6 fibers). Between the dispatch box and the outside: MEM Ving and MEM sense for Ving in one cable Cables are close to be finally defined. A meeting will take place in Saclay in January. The yellow ribbons are standard ones, the laser fiber sheath which was initially proposed is too thick, we look for other solutions. The laser fibers will be spliced or glued at the intermediate patch panel under the balconies. The hybrid cable will end at the dispatch box (close to the PSUs) in the balconies. For the LV a 5A Caen PSU with 12channels could be used, since the output voltage can go up to 8V. One channel would deliver 5V another 8V. The requested current per MEM box is 2 X2A per single MEM box. Per endcap we would need 8 (2X4) PSU-channels. This is all contained in one module. The MEM sense wires would end as well at the PSU. Ving and its sense cables will leave dispatch box via laser barrack. EE and ES Dummies: We are progressing quite well, there is good hope to have all in time. A part of the EE and ES Dummies will be the EE and ES patch panels (see below). The ducts between EE and ES patch panels are well advanced. EE patch panel: It is needed to do the cabling. Apart from very rough ideas, nothing is known and fixed. This concerns layout and connector types. The layout can only seriously been worked on if the so-called 'mechatronics' is finalised. Tony and John are working on it. Schedule:? ES patch panel: It is needed to do the cabling. Piet has quite good ideas how it should look like. If the choices of architecture of the different services and the choices of the cables are made, I am confident that Piet will finalize design quite rapidly. Wolfgang Funk - CERN CMS 13/01/20047

problems to be solved before ordering (5) MEM box Dummy: It is needed to do the cabling. Meetings will take place at Saclay in January to understand where we could place the connectors etc. Schedule: delivery Sept.04. Cable lengths: calculation is underway. Purchasing and 'Greek connection‘ : Our geek collaborators are willing to spend money on EE and ES cables (as well connector mounting). The condition on this it that the money has to be spend in Greece. After a long search we found a french based company which has a subsidiary in Greece and is capable to produce several of our cables. Prices are correct. In the moment we enquire how our greek colleagues could purchase the cables, via the 'magasin' of CERN, cables to Greece and then to CERN, etc. How long this takes and if the whole effort is successful, I can't predict. Since for several cable types we do not yet know who could pay if not the Greeks as EE HV, all of ES, I am unable to present any delivery schedule. Wolfgang Funk - CERN CMS 13/01/20048