Very Large Detector Kick-off Meeting - Vertexing - Tracking - Summary Summary of Tracking Devices For Huge Detector Jik Lee(SNU) for Hwanbae Park (KNU) Huge Detector Kickoff Meeting, Nov. 10 SLAC CERN DESY KEK

Very Large Detector Kick-off Meeting Huge Detector: best optimized for “PFA” - excellent momentum resolution - good separation of clusters/tracks SiVTX pixel(cold version)  HCAL (Pb(Fe)/scinti or digital) W/Scinti ECAL TPC Si intermedi.-Trk SC-coil ▣ Concepts of Huge Detector SDTESLA Huge SolenoidB(T)543 Rin(m) L(m) E st (GJ) TrackerR min (m) R max (m) σ(μm)7150 N sample dpt/pt 2 3.9e-51.5e-41.1e-4 maximize BL 2

Very Large Detector Kick-off Meeting ▣ Vertexing Performance Requirements excellent spacepoint precision < 4 microns impact parameter resolution ≤ 5µm  10µm/(p sin 3/2  ) minimal multiple scattering  % X 0 or less per layer (transparency) two track separation, occupancy  20 x 20 µm 2 pixel size Charge Coupled Devices (CCD) Monolithic Active Pixels (MAPs) DEPleted Field Effect Transistor (DEPFET) Silicon On Insulator (SOI) Image Sensor with In-Situ Storage (ISIS) pixelated type

Very Large Detector Kick-off Meeting Beam Structures ▣ Beam Structures Pileup over bunch train Or fast timing bx live: 3   power pulse Fast readouts: OK, no pileup Digital pipeline bx live: 5  warm cold readout speed radiation hardness occupancy

Very Large Detector Kick-off Meeting Vertex Detector: CCD ▣ Vertex Detector: CCD faster readout needed for cold machine - need to readout every 50 µs (20 times) during a train ~0.5% occupancy - use Column-Parallel CCD with low noise (increase readout speed ~50MHz) cryostat for operation at 200 K - could be unnecessary with fast readout CP CCD separate amplifier and readout for each column LCFI CP CCD thin and mechanically stable ladder 400x750 pixels(20µmx20µm)

Very Large Detector Kick-off Meeting Image Sensor with In-situ Storage (ISIS) ▣ Image Sensor with In-situ Storage (ISIS) 20 readouts/bunch train may be impossible due to beam –related RF pick up  motivates delayed operation of detector for long bunch train: charge collection to photogate from µm silicon, as in a conventional CCD signal charge shifted into storage register every 50 µs, providing required time slicing string of signal charges is stored during bunch train in a buried channel, avoiding charge-voltage conversion totally noise-free charge storage, ready for readout in 200 ms of calm conditions between trains

Very Large Detector Kick-off Meeting Vertex Detector: MAPS Prototype ▣ Vertex Detector: MAPS Prototype neutron irradiations - fluencies up to neutrons/cm 2 are acceptable with considering LC requirements which is ~ 10 9 n/cm2/year ionizing irradiations - tests up to a few 100kRad - exact sources of performance losses are under investigation (diode size and placements of the transistors are important parameters) 5% drop in charge at 1.5e12 n/cm2 ▪ standard CMOS sensor technology - readout/sensor on one chip - signal is corrected from epi. layer ▪ pixel size and precision ~ CCD

Very Large Detector Kick-off Meeting Vertex Detector: DEPFET Prototype ▣ Vertex Detector: DEPFET Prototype thinning process for sensors established 800x104 mm 800x104 mm 2 - sensitive area 50µm thinned - fast signal to cope with high rate requirement - resolution of 9.5 μm complete clear  no clear noise - (1 x clear) then sample 500x in 2.5ms - (clear + sample) 500x for single pixel ▪ detector and amplification properties ▪ fully sensitivity over whole bulk ▪ very low noise operation at room temp.

Very Large Detector Kick-off Meeting pair background hit at R=15mm is 1.7 times larger than that of 4T background hits are decreased significantly at larger R ▣ Vertex Detector Issue R(mm)B(T) Pair background (hit/mm2/train) configuration of R=20mm with silicon thickness < 70 µm satisfies the impact parameter resolution requirement: ≤ 5µm  10µm/(p sin 3/2  ) readout speed and rad. hardness very thin detector Y. Sugimoto

Very Large Detector Kick-off Meeting ▣ Tracking Performance Requirements excellent momentum resolution - dilepton recoil mass for higgstrahlung process - end-point measurement for SUSY chains excellent pattern recognition and 2 track resolution - high energy, high density jets tolerant to high machine backgrounds -tracks in central tracker dominated by γγ events MWPC and pads - limited by positive ion feedback and MWPC response MPGD’s (Micro Pattern Gas Detectors) - GEM (Gas Electron Multiplier) - MicroMEGAS (Micro Mesh GAS detector) gaseous type (readout)

Very Large Detector Kick-off Meeting ▣ TPC with GEM 50 µm Kapton foil for gas amplification 5 µm copper coated on both sides 70 µm holes, 140 µm pitch hexagonally aligned holes multiple GEM structures - safer operation - more flexibility to optimize charge transfer GEM voltages up to 500 V yield 10 4 gas amplification

Very Large Detector Kick-off Meeting ▣ TPC with GEM to reduce ion feedback -GEM with Micro Hole Strip Plate (MHSP) apply negative strip voltage  ions collected on strips, electrons extracted from holes due to diffusion IF is reduced by a factor of 4

Very Large Detector Kick-off Meeting ▣ TPC with MicromeGAS a micromesh sustained by µm high insulating pillars multiplication takes place btw anode and mesh S1 S2 S1/S2 ~ E amp /E drift - can choose gap/HV to have gain maximum - ion feedback suppressed by E drift /E amp

Very Large Detector Kick-off Meeting ▣ TPC with MicromeGAS Berkeley-Orsay-Saclay TPC Readout Detector Field cage pad layout: 1024 pads 50 cm drift, 1024 channels tested up to 2T at Saclay - no gain drop with 55 Fe principle is proven but optimization to be done

Very Large Detector Kick-off Meeting ▣ TPC Tracking Issue small structures (no ExB effects) fast electron signal intrinsic ion feedback suppression optimize novel gas amplification systems ion feedback suppression neutron backgrounds optimize single point and double track resolution demonstrate large system performance with control of systematics

Very Large Detector Kick-off Meeting ▣ Intermediate and Forward Tracker located btw vtx and main tracker (GLC model) - 5 layers at r=9 to 37 cm - angular coverage |cosΘ|<0.9 - spatial resolution σ = 20μm - total amount of Si required: 10 m 2 improve momentum resolution improve track finding efficiency forward tracking SET intermediate between vertex and central (IMT, SIT, FTD) intermediate between central and calorimeters (FCH, SET) SIT + TPC + SOT

Very Large Detector Kick-off Meeting 512ch 50um pitch sensor 1cm PIN Diode For SDD R&D 64ch 50um pitch sensor 32ch 50um pitch sensor 16ch 50um pitch sensor Backside of SSD PIN Diode array ▣ Intermediate Tracker n+ implanted p-stop in atoll via in hourglassreadout pad in staggering guard ring p+ implantedreadout strip N sideP side

Very Large Detector Kick-off Meeting ▣ Tracking Devices ΔP t /p t 2 P t (GeV/c) Y. Sugimoto Si Vertex Detector 5 layers, t=70µm,  =3µm cos  < 1 (non-realistic) Si Inner Tracker 3 layers (12, 24, 36 cm), t=300µm,  =7 µm, cos  <1 (non-realis tic) TPC 40cm < R < 200cm, Z<235cm Ar gas, 220 samples,  =150µm Si Outer Tracker R=205cm(barrel)/Z=250cm(EC),  =7µm detail (realistic) simulation studies are underway

Very Large Detector Kick-off Meeting ▣ Vertexing/Tracking Issues R&D must be guided by continuing physics and simulation programs which can deliver the accuracy that the LC physics needs - evaluate the tracking performance: backgrounds, occupancy studies, pattern recognition studies demonstrate performance in large scale prototypes in cosmic ray and test beams studies with the magnetic field vertex detector, tracker, calorimeters should be integrated for optimal jet reconstruction

Very Large Detector Kick-off Meeting Backup Slides

Very Large Detector Kick-off Meeting ▣ Physics Performance end-point measurement for SUSY chains GLC project report