Design your own microsystem October, 14, 2009, Budapest, Hungary "E-Training Microsystems Technologies" project (LLP-LdV/ToI/2008/ RO/003) for development microsystems engineering skills in Romania and Bulgaria Assoc. Prof. Norocel Codreanu, Ph.D. “Politehnica” University of Bucharest, Center for Technological Electronics and Interconnection Techniques, Bucharest, Romania

Design your own microsystem October, 14, 2009, Budapest, Hungary Table of contents 1. Introduction 2. Objectives 3. The approach 4. The MSYSTECH European Project 5. Conclusions

Design your own microsystem October, 14, 2009, Budapest, Hungary  Multi-media learning involves active learning, both behavioral as well as cognitive, because it is a type of computer-based training that uses two or more media, including text, graphics, animation, audio (sound/music), and video.  Msystech project offers a new approach of thinking the vocational learning process: a public, performance-centered, task-oriented multi-lingual training environments. 1. Introduction

Design your own microsystem October, 14, 2009, Budapest, Hungary 2. Objectives  The shortage of engineers in micro-, nano- systems and the systematic decrease of students in electronics at the university can be a threat to the European economy competitiveness.  The primary target groups concerned are: professionals from SME in electronics and micro-systems, students in engineering education and vocational schools, educated but unemployed people looking for additional training for employment.

Design your own microsystem October, 14, 2009, Budapest, Hungary  1. Performance-Centered Design - is the key difference between performance support systems and training systems;  2. Learn by doing - much of what we know to do in a job we learn on the job;  3. Organizational Memory - refers to the knowledge that an organization has or could have about its business and to the process it uses to acquire and recall that knowledge;  4. Technology Use - the performance support system (PSS) is a natural extension of building technologies that transform the way people work and learn. 3. The Approach

Design your own microsystem October, 14, 2009, Budapest, Hungary 4. The MSYSTECH European Project  The mSysTech project is based on the positive results and experiences in two European pilot projects: Leonardo da Vinci project IPCI and Socrates/Minerva "On-line Learning Mathematics and Sciences" (OnLine Math&Sciences).  In mSysTech the performance-centred job-linked training approach will be used also and the selected content from the courses of IPCI will be adapted and up- dated for the needs of Romanian and Bulgarian electronic sector and education.  The e-learning platform used for this project is MOODLE (Modular Object-Oriented Dynamic Learning Environment).

Design your own microsystem October, 14, 2009, Budapest, Hungary Starting page of the MSYSTECH project website

Design your own microsystem October, 14, 2009, Budapest, Hungary Courses available in MSYSTECH Packaging Technologies Teacher: Norocel Codreanu

Design your own microsystem October, 14, 2009, Budapest, Hungary “ Creating a PCB footprint ” animation “Simulation in frequency domain” “Simulation in frequency domain” animation

Design your own microsystem October, 14, 2009, Budapest, Hungary Microsystems Design Teacher: Philippe Morey-Chaisemartin

Design your own microsystem October, 14, 2009, Budapest, Hungary Thermal Management of Microsystems Teacher: Slavka Tzanova

Design your own microsystem October, 14, 2009, Budapest, Hungary Photomasks Data Preparation Teachers: Eric Beisser, Farid Benzakour

Design your own microsystem October, 14, 2009, Budapest, Hungary Packaging Technologies Course institution: "Politehnica" University of Bucharest, Center for Technological Electronics and Interconnection Techniques (UPB-CETTI) Course author: Norocel Codreanu and other colleagues from UPB-CETTI Objective The objective of the course is to introduce the learners in microsystems packaging technologies, including design, analysis, fabrication, assembling, characterization and testing. In addition, this course will also introduce the most recent developments of micro-/nano-fabrication technologies.

Design your own microsystem October, 14, 2009, Budapest, Hungary Contents of the course The course covers the research and innovation in the following major topics: Fundamentals of microsystems packaging; Packaging materials; Modelling, simulation and CAD of microelectronic structures and systems; Assembling technologies - classical and based on RoHS&WEEE European Directives; Basics of nanopackaging.

Design your own microsystem October, 14, 2009, Budapest, Hungary Learners The primary target groups concerned are: professionals from SMEs in electronics and micro-systems, students in engineering education and vocational schools, educated but unemployed people (e.g. engineers, physicists) looking for additional training for employment. Prerequisite and Corequisite Knowledge Fundamentals of electronics and electronic packaging; Passive and active components in electronics; Analog and digital electronic circuits; Basics of electronic modules design and EDA; It is assumed also that learners have a good knowledge of physics and chemistry. Estimated duration of the course: 30 hours

Design your own microsystem October, 14, 2009, Budapest, Hungary 1. Fundamentals of microsystems packaging 1.1Introduction 1.2The packaging hierarchy 1.3 Milestones in packaging 1.4 Packages and technologies 1.5 Packaging Technologies Trends

Design your own microsystem October, 14, 2009, Budapest, Hungary 2. Packaging materials 2.1 Introduction Materials for Packaging Technology Non-woven fabrics from electrospun nanofibers New Packaging Materials 2.2 Basic electronic packaging materials 2.3 Plastic materials and processes Thermosets vs. Thermoplastics Transfer molding thermosets Thermo-shaping of thermoplastics Injection Molding Wire bonding material

Design your own microsystem October, 14, 2009, Budapest, Hungary 2.4 Dielectric materials used in the manufacture of printed circuit boards Two major applications areas, RF/analog and digital Two Major Materials Classes Goal of each application area List of woven glass materials used in digital applications Nonwoven or very low glass content materials 2.5 Materials for lead-free assemblies Lead-free folder pastes Lead-free surface finishes Components for lead-free soldering Substrates for lead-free soldering Reliability of Lead-Free Solder Joints Solder Joint Intermetallics Effect of Alloy Composition Effect of Surface Finish

Design your own microsystem October, 14, 2009, Budapest, Hungary 3. Modelling, simulation and CAD of microelectronic structures and systems 3.1 Modelling, simulation and design of interconnection structures Example: Ball Grid Array package 3.2 CAD of microsystems structures Introduction Beam Design Mirror Design Thermally-Actuated Pop-Up Mirror

Design your own microsystem October, 14, 2009, Budapest, Hungary Cap 4 Chip assembling technologies 4.1 Chip packaging technologies -Brief Wire Bonding TAB Flip-Chip 4.2. Board assembling technologies

Design your own microsystem October, 14, 2009, Budapest, Hungary 5. Basics of nanopackaging 5.1 Introduction 5.2 The significance of the nanoscale 5.3 Nanomaterials 5.4 Nanomaterials Science 5.5 Applications of nanomaterials 5.6 Carbon Nanotubes 5.7 Nanotechnology images

Design your own microsystem October, 14, 2009, Budapest, Hungary 6. Conclusions  With their new technology, mSysTech project moves the traditional teaching systems to the closely related to the job learning.  The most important tangible outcomes are that the training centers, industrial associations and schools will be able to provide the self-learning web-based courses for both students and people of the region who are seeking for jobs in this field or are interested in continuing or convergence education for any other reasons.  The message to the teachers, to consider the impact of teaching on results, good performance and competitiveness, is another perspective of this innovation.

Design your own microsystem October, 14, 2009, Budapest, Hungary Thank you for your attention !