CS/COE0447 Computer Organization & Assembly Language Course Intro and CHAPTER 1

Course Information Welcome to CS/COE0447! Professor Teaching Assistant Dr. Jan Wiebe Teaching Assistant Graduate: Kiyeon Lee Undergraduate: Toby Horn, Mike Maksymowych, Jesse Szwedko Course web page, including syllabus, lectures notes, assignments, labs, schedule, … http://www.cs.pitt.edu/~wiebe/courses/CS447/Fall07

Computer Systems “Desktop computers” “Servers” “Embedded computers” E.g. PCs, MACs, … Includes Notebooks “Servers” Web servers File and compute servers Supercomputers “Embedded computers” Usually NOT directly observable Very wide range of applications

Desktop Computers

Servers

Embedded Computers

A Cell Phone System

Computer Organization Study this part in CS1541! We study this part in this course!

In CS/COE 447 We will study We will do Computer architecture MIPS architecture Concepts of assembler, linker, compiler Computer arithmetic Signed and unsigned binary numbers Floating point format Operations (add/div/…) Logic design Basic processor performance analysis Processor organization Datapath Control We will do Assembly language programming (in MIPS) BA

Computer Architecture? Computer systems Underlying hardware Software running on it Computer architecture The hardware/software interface seen by the user Instruction set architecture (ISA) Processor microarchitecture Implementation of a given architecture May or may not be visible to the user

Layered Approach in Computer Design Computer Architecture or Instruction Set Architecture Architecture Microarchitecture Logic gates Transistors

Machine Code Example void swap(int v[], int k) { int temp; temp = v[k]; v[k] = v[k+1]; v[k+1] = temp; } swap: muli $t0, $a0, 4 add $t0, $a1, $t0 lw $t1, 0($t0) lw $t2, 4($t0) sw $t2, 0($t0) sw $t1, 4($t0) jr $ra compiler 00000000101000010… 00000000000110000… 10001100011000100… 10001100111100100… 10101100111100100… 10101100011000100… 00000011111000000… assembler

Components of ISA In most cases, a “programmer’s reference manual” (PRM) will disclose the ISA of a processor To understand an ISA, find in PRM Data types the processor supports Supported instructions and their definitions Registers (general-purpose & special purpose) Processor modes Exception mechanism

Inside a PC Integrated Circuits (ICs) CPU (Central Processing Unit), companion chipset, memory, peripheral I/O chip (e.g., USB, IDE, IEEE1394, …) Printed Circuit (PC) boards (next slide) Substrate for ICs and interconnection Distribution of clock, power supply Heat dissipation Hard disk, CD-RW DVD-RW, (floppy disk) Power supply Chassis Holds boards, power supply, and provides physical interface for user and other systems Connectors and cables

Closeup photo of one side of a motherboard PCB, showing conductive traces and solder points for through-hole components on the opposite side.

Integrated Circuits 1mm~25mm on a side 100 ~ 1000M transistors 25 ~ 250M “logic gates”

Technology Trend (Processor Complexity) 2x transistors/chip every 1.5 years!

Astounding that it has held for so long!!! Moore’s Law The term Moore's Law has been coined by Carver Mead around 1970.[4] Moore's original statement can be found in his publication "Cramming more components onto integrated circuits", Electronics Magazine 19 April 1965: “The complexity for minimum component costs has increased at a rate of roughly a factor of two per year ... Certainly over the short term this rate can be expected to continue, if not to increase. Over the longer term, the rate of increase is a bit more uncertain, although there is no reason to believe it will not remain nearly constant for at least 10 years. That means by 1975, the number of components per integrated circuit for minimum cost will be 65,000. I believe that such a large circuit can be built on a single wafer.[1] Astounding that it has held for so long!!!

Memory Capacity Trend (DRAM) 1.4x/year or 2x every 2 years 8000x since 1980!

Technology Advances (!) Memory DRAM capacity: 2x / 2 years (since ’96) 64x size improvement in last decade Processor Speed (in terms of clock frequency): 2x / 1.5 years (since ’85) 100x performance improvement in last decade Disk Capacity: 2x / 1 year (since ’97) 250x size improvement in last decade

Main memory PC/servers use “DRAM” (Dynamic RAM) SDRAM DDR SDRAM RDRAM (RAMBUS DRAM) A typical SDRAM “module”

Main memory, cont’d Embedded computers use DRAM or SRAM (or both) depending on applications SRAM, SDRAM, FLASH all in a same chip!

Storage Secondary storage Non-volatile Stores programs, user-saved data, etc. In PC/server domain, magnetic disk (hard-disk) is usually used In embedded computers, “flash” memory or “ROM” is usually employed

Storage, cont’d USB Flash card 256MB 5.25-inch floppy disk 1.2MB

Storage, cont’d

Computer Networks Local Area Network (LAN) Wide Area Network Within limited distance (e.g., in a building) Mostly based on Ethernet 10Mbps, 100Mbps, 1Gbps, 10Gbps, … Wide Area Network Connecting networks far apart Proliferation of wireless LAN (IEEE802.11) 1 ~ 100Mbps

(Simple) IC Process Overview Silicon ingot (silicon cylinder) (Blank) Wafers Various steps to build circuits on wafers Patterns of chemicals placed wafer “Wafer test” to sort out bad parts Tested “die” (diced into components – dies, chips) “Packaging” steps Wire bonding (connected to the I/O pins of a package) “Chip test” to sort out bad parts (mistakes happen during packaging) Products