Masters and Masters Qualifier in Electronic Systems and Telecommunications Engineering School of Electronic Engineering

Majors Masters in Electronic Systems –NEW Major in Semiconductor Manufacturing –Major in Nanoelectronics & Photonics –Major in Image Processing & Analysis Masters in Telecommunications –Major in Network Implementation

Entry Requirements H2.2 minimum in electronic/ electrical engineering, applied physics or computer science for direct entry onto the Masters Programme. Basic primary degree for direct entry onto the Qualifier Programme. (In exceptional circumstances diploma + 3yrs experience + interview)

Masters Qualifier Programme Choose your modules wisely and you only need to take 8 modules in total for both the Qualifier and the Masters. Pass 4 modules and you transfer onto the Masters Programme (level %)

Flexible Masters You can opt out of the Masters Programme and you will still get a cert (4 modules) or a diploma (8 modules) To complete the Masters you must pass 8 modules plus project within 4 years. You can take more than 8 modules if you wish and result calculated on best 8 results.

Programme Structure MASTERS 8 Modules + Project QUALIFIER 4 Modules Full-timeRecommended 4 modules per semester Recommended 4 modules per semester Part-timeRecommended 2 modules per semester Recommended 2 modules per semester

Timetable

Students who are studying part time can study remotely using the DCU Moodle system to access notes, video’s and other course material Students who work a shift pattern and would like to attend lectures are free to do so.

Choosing Your Modules See the ‘Programme Planner’ for 2012/13 Semester 1/2 (next slides). IMPORTANT NOTES: –Electronic Systems Students can choose ANY 8 modules. –Telecoms students MUST take at least 6 modules from the ‘telecoms’ module set (marked with *) plus ANY other two modules See for module descriptions and criteria for Majors.

Programme Planner 2012/13 SEMESTER 1 EE402: Object Oriented Programming * EE449: DSP (Digital Filters & DFT) * EE450: Communications Theory * EE453: Image Processing & Analysis with Project EE509: Data Network Protocol Analysis and Simulation * EE535: Renewable Energy: Systems, Technology and Economics EE540: HDL/High Level Logic Synthesis EE541: Nano & Microelectronic Device Manufacturing EE554: Image and Video Compression * EE588: Semiconductor Manufacturing Equipment and Systems EE562: Network Programming *

Programme Planner 2012/13 SEMESTER 2 EE417: Web Application Development * EE451: Mechatronic System Simulation & Control EE452: Wireless and Mobile Communications * EE454: Optical Communications System Design * EE500: Performance of Data Networks * EE502: DSP (Signal Modelling & Compression) * EE558: Advanced RF Circuit Modelling EE506: Fundamentals of Photonic Devices EE507: Entrepreneurship for Engineers EE587: Plasma Process Technology EE538: Secure Sys Admin & Internetwork Security * EE544: Computer Vision EE550: Characterisation Technology for Nanomaterials EE552: Broadband Networks * EE563: Graphics & Visualisation

Programme Planner Masters Project Every student should complete ONE of the following Masters project modules Project Module Codes for each M.Eng flavour: EE592: Electronic Systems Project (MEN) EE593: Telecommunications Eng. Project (MTC) EE594: Nano Major Project (MEN) EE595: Imaging Major Project (MEN) EE596: Network Major Project (MTC) EE598: Semiconductor Manufacturing Project (MEN)

Project Literature Review Interim Presentation Project Implementation Final Report –Research paper –Appendices Final Oral Examination

Major in Semiconductor Manufacturing Newly introduced in the academic year is a Major in Semiconductor Manufacturing, a specialisation on the Masters in Electronic Systems addressing modern semiconductor manufacturing practices, methodologies and technologies.

Core Courses Nano & Microelectronic Device Manufacturing Characterisation Technology for Nanomaterials Plasma process Technology Semiconductor Manufacturing Equipment and Systems Applied Project

Semiconductor Manufacturing Equipment and Systems This course aims to provide the students with an understanding of the of the design and control of the primary families of equipment used in modern semiconductor manufacturing plants, including chemical mechanical polishing, optical lithography, implantation, thermal annealing and diffusion, metal and dielectric etch, and packaging technologies. The student will learn how to design and implement statistical and advanced process control schemes and how to specify the appropriate metrology. We will also explore fundamental facilities issues including vacuum technology, gas handling, and water and waste management. Finally, the student will learn to analyse and optimize process flow through the factory and the needs of the specific tool sets.

Semiconductor Manufacturing Equipment and Systems 1. Design semiconductor manufacturing process flows. (PO3)· 2. Analyse the performance of a tool-set and relate to productivity and yield (PO2)· 3. Calculate and solve for optimal manufacturing throughput.. (PO1,PO2)· 4. Outline deficiencies in the major processing systems. (PO1)· 5. Explain the basic physics of vacuum technology and associated technology. (PO1,PO2)· 6. Specify the best practice in hazardous materials handling, as relevant to semiconductor manufacturing. (PO4)· 7. Develop strategies for waste and water management, as relevant to semiconductor manufacturing. (PO4)·

Plasma Process Technology This course aims to provide the student with a fundamental understanding of plasma process technology as applied to semiconductor manufacturing. The students will develop an understanding based on an examination of the basic plasma physics of low temperature plasmas. Using this fundamental knowledge, combined with a study of the typical chemistries used in semiconductor etch and deposition processes, the students will be able to design a process and identify the optimal hardware configuration for a given technological need. The interaction of plasma produced species with a surface will be examined and the student will learn to quantify and estimate surface effects including sputter and etch rates, anisotrophy, selectivity, and deposition rates. Methods for controlling, analyzing, and characterizing process plasmas will be examined in order for students to be able to apply their learning to real-world manufacturing problems.

Plasma Process Technology 1. Interpret and solve for basic plasma physical parameters and properties. (PO1,PO2)· 2. Describe electron heating mechanisms in low pressure plasmas. (PO1)· 3. Use global models to solve for basic plasma chemical and electrical properties. (PO1,PO2)· 4. Design plasma processes for deposition and etch. (PO3)· 5. Identify optimal hardware configurations based on the technological requirements. (P03) 7. Describe the motion of particles in the plasma bulk and sheath regions. (PO1)· 8. Understand surface effects including etch, deposition, physical sputtering and functionalising. (PO1)· 9. Calculate the number densities of the major plasma species. (PO1)· 10. Design plasma control and characterization processes. (PO3)

How to Apply? Apply through There are two intakes – Sept and Feb Deadline for application is Mid Sept (approx) for Sept intake and for February intake it’s mid January (approx) Non EU applicants must apply early Check on line for exact dates

Fees 2012/2013

Payment of Fees

Any Questions? Thank you for your time