IMD series Iljin Metal bond Diamond ILJIN DIAMOND Co., Ltd.

IMD series IMD-G IMD-F IMD-D IMD-B IMD-A Sawing of granite & ceramic tiles Rough polishing of granite Reinforced glass edge Ferrite motor core CMP pad conditioner Core drill of glass Crystal & glass decorating groove Silicon nitride OD grinding Middle stage grinding of Crystal & granite Glass (Normal, TFT-LCD, Motor) edge Cut-off wheel for crystal or glass Final polishing of granite Fired tungsten carbide Dental burrs Beveling of glass and mirror Cut-off wheel for glass & quartz Ferrite grinding

Toughness Index Toughness Index Mesh Size G F D B A TP IGD II 10 20 30 40 50 60 70 80 80/100 100/120 120/140 140/170 170/200 200/230 230/270 270/325 325/400 400/500

Grades equivalent IMD-G IMD-F IMD-D IMD-B IMD-A MBG-660 MBS-640 PDA-999 PDA-989 PDA-878 PDA-P768

Shape comparison As-grown Product Crushed Products IMD-TP IGD-II IGD-V

Ti coating MESH Weight Percent Spec. 80/100 2wt% ±0.5 100/120 120/140 4wt% ±0.5 140/170 5wt% ±0.5 170/200 6wt% ±0.5 200/230 7wt% ±0.5 230/270 8wt% ±0.5 270/325 9wt% ±0.5 325/400 10wt% ±0.5 400/500 11wt% ±0.5

Ferrite Motor Core Grinding B A Test Condition Area : Japan Wheel Type : N/A Bond : Electroplated Workpiece Material : Ferrite motor core Mesh Size : 100/120 Concentration : Peripheral Speed : DOC : Feed rate : D Company

Glass Grinding Test Condition Area : Japan Wheel Type : N/A Bond Material : Bronze (Cu-Sn) Work piece Material : Glass Mesh Size : 170/200 Concentration : Peripheral Speed : DOC : Feed rate :

Safety Glass Grinding Area Korea Industry Automotive Part Name Operation Glass Edge Grinding (Bando) Workpiece Material Glass Wheel Specific Metal Bond Φ200 x 4w x 75H x 11t Diamond & cBN IMD-F Ti (Ti Coating) Process Parameters Wheel Vs : 1600m/min Feed rate : 10~20m/min Results Remark

Ti coated wheel grit ILJIN DIAMOND Co., Ltd. Grit Business Unit

1. 코팅 광학 형상 기존 IMD-Fti 170/200 신규 IMD-Fti 170/200 광학사진에서 기존 방식은 상당히 어두운 색을 띄고 표면이 거칠어 보임. 신규 샘플은 기존 방식의 제품과 비교하여 광택을 띄고 표면이 매끄러움.

2. 코팅 SEM 형상 기존 IMD-Fti 170/200 신규 IMD-Fti 170/200 기존 제품은 edge가 벗겨지거나 코팅층이 불균일하게 형성되었음. 신규 제품은 코팅층이 일관성있게 형성되어 있음.

2. 코팅 SEM 형상 기존 IMD-Fti 170/200 신규 sputtering IMD-Fti 170/200 고배율 관찰에서도 기존 제품에 비해 치밀한 코팅층을 유지하고 있고, edge부분도 손상이 없음.

3. TRS test result Transverse Rupture Strength Test Kg/mm2 Transverse Rupture Strength Test Dia grade/size: IMD-FTi 170/200 mesh Concentration: 100 Segment size: 6.4*6.4*40mm TRS M/C: ZWICK Z050 Test condition: ISO B Type New coating As-is #1 1.72 1.32 #2 1.96 1.47 #3 1.75 1.43 #4 1.61 1.50 #5 1.66 1.60 Avg 1.74 1.46 TRS Test-Kgf/mm 2 Sintering Condition Bond system: 50%Cu-20%Sn-30%Fe Sintering Temp: 700℃/2min 3.0 1.74 1.46 New coating As-is

4. 소결 후 본드와의 결합 상태 기존 IMD-Fti 170/200 신규 IMD-Fti 170/200 SEM 관찰 시 신규 제품이 본드층과의 접합성이 기존 제품에 비해 우수한 것으로 관찰됨.

5. 소결 후 TIP 파단면 상태 New Coating As-is SEM 관찰 결과 다이아몬드 표면은 모두 Ti 코팅층으로 형성되어 있음. 기존 제품과 신규 제품과의 소결 후 탈락된 부분을 비교 관찰한 결과 신규 제품에 비해 기존 제품이 약 20% 가 탈락율이 높은 것으로 분석됨.

Diamond for CMP Pad conditioner ILJIN DIAMOND Co., Ltd.

Metal vs. Oxide CMP : Million $ Trend of CMP Process Metal vs. Oxide CMP : Million $ CMP growth by material Metal CMP의 성장속도가 높으며, 이 중 Cu CMP의 성장율이 높음. Cu CMP에서 scratching issue 및 고집적화에 의한 diamond의 fine, narrow 경향 심화 Metal CMP에서 Diamond의 Shape, Narrow PSD, Diamond purity의 중요성이 강조

CMP Process Logic Memory Memory Semiconductor와 Logic 간에 가공하는 피삭재의 차이에 따라 적용되는 Diamond는 틀리게 적용

Tech. Trend of CMP Conditioner Typical Type of CMP Conditioner Pattern, Narrow Size, Special Shape CMP Conditioner에서 요구되는 Cutting Rate가 높아지고, 고 집적화 되면서 Diamond는 fine, narrow한 PSD가 요구됨. Conditioning 효과를 높이기 위하여 pattern 및 diamond의 돌출높이는 높이기 위한 개발, 적용 진행 중

Tech. trend of diamond for CMP As was As is Increased number of particles (High Density) Coarse size 80/90 90/100 Medium / fine size 100/120 140/170 170/200 200/230 Blocky shape IMD – F,D PDA 999 MBG 660 Angular shape IMD – B,A,TP PDA 878 MBG 620 Higher Cutting Rate (CR)

Special process for CMP only PSD Narrow PSD (Double size → Single mesh → Micron size) Over size particle removing process (3 stage sieving at clean room) Shape Precision heating control (HPHT) Perfect shape sorting and consistency Impurity Minimized metal inclusions using high magnetic field Suitable for electroplating and vacuum brazing process Special Treatment – I Removing the twin, sharp needles and weak crystal No damage of normal crystal’s sharp edge Special Treatment – II To prevent the Ni over plating and nodules on diamond crystal Perfectly clean and non electric conductivity on the surface of diamond De-magnetizing

Shape – HPHT technology Temp (0C) 1300 1400 1500 5.5 6.0 6.5 (111)+(100) (110) (111) (100) Pressure (GPa) A B C D E F G H I

Shape – HPHT technology IMD-F IMD-T

Shape – Sorting technology IMD-G IMD-F IMD-D IMD-B IMD-A IMD-TP

Special treatment I IMD-NB1 IMD-NA1 IMD-NB2 IMD-NA2

Special treatment II

Special treatment II Metal impurities on the surface of diamond grit for CMP (unit : ppb) Element ILJIN DI E6 2hrs 4hrs 8hrs Li - 0.00 0.01 Na 1.54 1.28 1.22 1.79 3.37 3.76 13.34 12.39 14.53 Mg 0.80 0.89 1.00 0.13 0.21 0.20 6.66 6.02 6.61 Al 0.42 0.39 0.47 0.34 0.64 0.61 0.33 0.43 0.50 K 0.04 0.15 2.17 2.25 2.36 Ca 1.83 1.94 1.47 2.01 2.12 55.72 54.72 58.23 Cr 0.12 0.36 0.35 4.71 4.58 0.52 9.80 10.52 Mn 0.27 0.25 0.10 0.41 0.44 0.07 1.14 1.42 Fe 7.25 23.02 30.47 5.19 31.41 44.57 14.38 97.34 135.27 Co 0.03 Ni 1.08 4.30 6.82 1.39 5.79 9.25 4.78 20.64 31.59 Cu 0.92 0.93 0.83 1.96 2.23 2.39 0.28 0.38 Zn 1.10 1.29 0.67 0.90 1.15 1.36 1.92 As 0.02 Sr 0.17 0.18 Cd 0.05 Ba 1.05 1.17 1.20 Pb 0.81 0.77 0.69 0.06 0.14 0.48

Special treatment II Metal impurities on the surface of diamond grit ILJIN DI E6 150 135.27 100 58.23 (ppb) 50 44.57 31.59 30.47 14.53 10 10.52 9.25 6.82 4.58 3.76 2.39 2.12 1.94 2 1.22 0.83 0.35 0.44 Na Ca Cr Cu Fe Ni

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