ITRS Winter Conference 2011 Incheon, Korea 1 Work in Progress: Not for Distribution 2012 ITRS Litho One Pager April 24, 2012 Mark Neisser – SEMATECH Mauro Vasconi – Micron Tatsuo Chijimatsu, Fujitsu Y.C. Ku – TSMC Reiner Garreis -- Zeiss

ITRS Winter Conference 2011 Incheon, Korea 2 Work in Progress: Not for Distribution Updated Challenges Short term challenges are similar to last update Long term challenges add DSA design rules and more EUV complexity

ITRS Winter Conference 2011 Incheon, Korea 3 Work in Progress: Not for Distribution Updated MPU/DRAM Options Imprint no longer considered an option for 22nm MPU and DRAM, but still option for all 16nm products DSA + Litho considered more likely than imprint for 16nm and 11nm nodes for MPU, DRAM and flash

ITRS Winter Conference 2011 Incheon, Korea 4 Work in Progress: Not for Distribution Notes 450nm production use considered unfeasible for 2014 and 2015 Litho can support proposed accelerated MPU roadmap assuming use of double patterning –ArF immersion plus double patterning for 2013 (27nm half pitch) –EUV with double patterning for 2017 (14nm half pitch) Will add a DSA table similar to current resist requirements one for the 2013 update