Test TWG Spring Workshop - Koenigswinter, Germany Test TWG Spring ITRS Workshop Attendees: Mike Rodgers Prasad Mantri Roger Barth Wataru Uchida Shuichi Ito Peter Mumenthaler Rene Segers

Test TWG Spring Workshop - Koenigswinter, Germany Cross TWG Minor table updates planned for 2008 Focus on preparation for 2009 Assembly and Packaging –Yield, SiP, TSV, –GHz limit on high pin packages – re-examine model Interconnect –3D die structures Rules and considerations (Cost, power and performance) KGD issues Model for test Wireless –77GHz proximity detection for USA automotive –Test for MEMs Yield –S/N, impact of data compression, electrical signature vs visual defect (modeling), Statistical issues

Test TWG Spring Workshop - Koenigswinter, Germany Cross TWG - Design High reliability machines (medical) – design criteria differences Pins per package. –Ratio of PWR, GND and signal. # of Unique core supplies Consumer core model –# of I/O & their speed, # of cores (homogenous and non- homogenous, # of current sources, # of clocks, # of memories Design margin to spec criteria –Identification of most marginal circuits to test –Matching of design simulation to product actual DFT –Partitioning between design and test chapters –New design structures that drive new test concepts –Test modes i.e. Test power management vs operational power management –Test wrappers for cores, including legacy cores –Quality level – coverage – test vs. system operation –Compression, compression ratio and fault isolation