ITRS Factory Integation TWG 2017/3/27 2002 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing The Factory Si Substrate Mfg Wafer Mfg Chip Mfg Product Mfg Distribution Reticle Mfg FEOL BEOL Probe/Test Singulation Packaging Test Increasing cost & Cycle time implications Factory is driven by Cost, Productivity, and Speed: Reduce factory capital and operating costs per function Enable efficient high-volume production with operational models for high and low product mixes and other business strategies Increase factory and equipment reuse, reliability, and overall efficiency Enable rapid process technology shrinks and wafer size changes Faster delivery of new and volume products to the end customer FITWG 2000

Factory Integration Requirements and Solutions are Expressed through 6 Functional Areas Production Equipment Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots, Load Ports Internal software & computers Process Equipment UI Facilities Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment Factory Operations Policies and procedures used to plan, monitor and control production Direct factory labor Test Manufacturing Prober, Handler, and Test Equipment Manufacturing processes to test wafers and chips Material Handling Systems Wafer and Reticle Carriers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Internal Software & computers Factory Information & Control Data and Control systems required to run the factory Decision support Process control Plan, Schedule, Dispatch Computers, databases, software outside equipment AMHS Eqpt (side view) DB Management Document MES MCS Network or Bus DSS Controllers Station APC Scheduling + Dispatching

2002 Factory Integration Focus Areas New business requirements driving changes to the factory design Combination of many different industry business models: IDM, Foundry, Joint Ventures, Collaborations, other Outsourcing, etc Faster new product delivery to customers [design to receipt] Integrating the Factory with other parts of the engineering chain (design, reticle mfg…) Implications of 300mm factory sizes reaching 30k-40k wspm on facilities, AMHS, and factory control systems Gaps Factory productivity/Equipment OEE and methods to improve including Equipment Engineering Capabilities (EEC) EEC includes e-diagnostic, fault detection, process control, on-line manuals, spares management etc. Factory modeling needs and gaps to do design analysis, demand planning, optimization tradeoff analysis, etc. Preparing for more focus in 2003 on Assembly and Test Manufacturing driven by costs & complexities

ITRS Factory Integation TWG 2002 Difficult Challenges 2017/3/27 > 65nm through 2007 < 65nm after 2007 Managing Complexity Quickly and effectively integrating rapid changes in semiconductor technologies and market conditions Need to integrate the entire product development process Factory Optimization Productivity increases are not keeping pace with needs Flexibility, Extendibility, Scalability Ability to quickly convert to new semiconductor technologies while reusing equipment, facilities, and skills Post Conventional CMOS Manufacturing Uncertainty Inability to predict factory requirements associated with different manufacturing requirements 450mm Wafer Size Conversion Timing and manufacturing paradigm for this wafer size conversion Will 450mm be a scale up of 300mm or a more radical change in manufacturing technology (single wafer carriers, etc.) FITWG 2000

Factory Operations Technical Requirements Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016 Wafer Diameter 300mm 450mm High Volume / Low Mix Factory Requirements Factory cycle time per mask layer (non-hot lot) [1,2] (days) 1.4 1.3 1.2 1.1 1.05 1 Factory cycle time per mask layer (hot lot) [1,2,7] (days) 0.9 0.8 0.7 0.65 0.6 Number of lots per carrier (lot) One Wafer layers/day/head count 55 61 67 73 81 89 High Volume / High Mix Factory Requirements Factory cycle time per mask layer (non-hot lot) [2,3] (days) 0.95 Factory cycle time per mask layer (hot lot) [2,3,7] (days) 0.75 0.55 0.5 0.45 0.4 0.35 Multiple 37 41 45 49 54 60 Common requirements across Both Factory Types Groundbreaking to first tool move-in (months). 9 8 7 6 5.5 5 First tool move-in to first full loop wafer out (months) 4 3.5 3 2.5 2 1.5 Node to Node change-over (weeks) 13 12 11 10 9.5 Floor space effectiveness 1X 2003 will propose adding new product cycle time to the metrics (analysis on-going) - Progress lacking in ability to run multiple lots per carrier

Production Equipment Technical Requirements (1 of 2) Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016 Wafer Diameter 300mm 450mm Throughput improvement (run-rate) per year Base +4% New base +10 to 12% Relative consumables, chemicals, gases, exhaust, emissions, utiliity <1.0X 200mm  -10% Bottleneck equipment OEE 75% 78% 80% 82% 84% 87% 88% 90% 91% 92% Average equipment OEE 55% 58% 60% 63% 65% 67% 70% 72% 74% Relative maintenance/spares cost <1.0x 200mm <98% Overall factory non-product wafer usage as a % of production <16% <15% <14% <13% <12% <11% <10% <9% % capital equipment reused from previous node Limited >90% >70% Wafer edge exclusion 3mm 2mm Production equipment lead time:  - Order to move-in (Litho) 12 mos - Order to move-in (other tools) 6 mos - Setup to full throughput capable 4 wks No significant changes to values - Progress lacking in OEE improvements, NPW reduction

Production Equipment Technical Requirements (2 of 2) Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016 Wafer Diameter 300mm 450mm Process/product changeover time (weeks) 4 3 2 Production equipment install and qual cost as % of its capital cost 10% 8% 6% Process equipment availability >85% >88% >90% >92% >94% >95% Metrology equipment availability 92% 94% 95% >96% >97% >98% Ability to run different recipes and parameters for each wafer Partial Yes Max allowed electrostatic field on wafer and mask surfaces (V/cm) 150 100 75 50 25 Relative capital cost of production equipment <1.3x of 200mm  New base <1.3x of 300 mm No significant changes to values - Progress lacking in OEE improvements, NPW reduction

Material Handling Technical Requirements (1 of 2) Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016 Wafer Diameter 300mm 450mm Material handling total capital cost as a % of total capital cost < 3% < 2% Wafer Transport system capability Separate interbay/ intrabay Some Separate Some Direct Direct tool Direct tool to tool MTTR (minutes) (SEMI E10) 24 20 18 15 12 10 8 Failures per 24-hour day over total system (SEMI E10) <1 <0.75 <0.5 <0.3 System throughput [20k wspm Factory] ·Interbay transport (moves/hour) 1200 1300 1400 1500 1625 1750 1875 2000 · Intrabay transport (moves/hour) 170 180 190 200 System throughput [40k wspm Factory] · Interbay transport (moves/hour) 2400 2600 2800 3000 3250 3500 3750 4000 No significant changes to values AMHS system throughput numbers include both 20k and 40k wspm factories + Good progress on AMHS single transport hardware system development

Material Handling Technical Requirements (2 of 2) Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016 Wafer Diameter 300mm 450mm Stocker cycle time (seconds) 15 14 12 10 8 Average factory wide carrier delivery time (in minutes) 5 Maximum factory wide carrier delivery time (in minutes) 20 Stocker storage density (% Total WIP carrier volume / Total stocker volume) * Small stocker (%) > 25 >30 >40 >50 * Nominal stocker (%) >35 >45 >60 Material handling equipment lead time (weeks) <16 <14 <12 <11 <10 <9 <8 Material handling equipment installation time (weeks) <7 <6 <5 <4 System downtime required to extend system capacity when previously planned (minutes) <180 <90 <60 <30 <15 30 No significant changes to values AMHS system throughput numbers include both 20k and 40k wspm factories + Good progress on AMHS single transport hardware system development

Factory Info & Control Technical Requirements Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016 Wafer Diameter 300mm 450mm Availability of mission critical system (%) 99.97% 99.98% 99.99% Mean Time to Recover for mission critical applications (minutes) <30 <15 15 10 5 Availability of the total factory system (%) 99.80% 99.90% 99.95% Peak number of AMHS transport moves supported by material control system (moves/hr) 8,000 8200 8400 8600 8850 9150 9450 9700 % Factory information and control systems reusable for next node >93% >80% Time to create FICS industry standard (months) <12 <6 4 Lead time for solutions to conform to standards >18 <9 <4 FICS cost including integration as a % of capital <2% Ability to run different recipes/parameters for each wafer Partial Yes ? Need to assess software systems (scheduling, dispatching, etc) readiness for single transport system - Lead time to create and conform to standards needs additional progress

Facilities Technical Requirements Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016 Wafer Diameter 300mm 450mm Cleanroom area as a % of total site building area 17% Mfg (Cleanroom) area/Wafer starts per month (m2/WSPM) 0.34 Classification of air cleanliness in the manufacturing (cleanroom) area ISO Class 5 ISO Class 6 ISO Class 7 ISO Class 8 ISO Class 9 Power utilization (demand/installed) 80% 70% Gas and chemical purity Discussed in Yield Enhancement Chapter Power and water consumption Discussed in EHS chapter and Process Equipment sections Factory construction time (months) from ground break to all facility ready 12 10 Facility capital cost as a % of total factory cost (includes equipment) 15% Production equipment install and qual cost as a % of capital cost 10% 8% 6% Facility operating cost including utilities as a % of total operating cost 13% Utility cost per total factory operating cost (%) 3% Maximum allowable electrostatic field on facility surfaces (V/cm) 150 100 75 50 25 No significant changes to values - Facilities momentum needed to reduce cycle time

Key Gaps: 2003 Focus areas for Factory Integration Technology Gaps that Need Attention Today Integrated intrabay readiness for 300mm Factories Ability to run different process parameters for each wafer Production equipment OEE NPW Reduction Hot Lot and normal cycle times for high mix factories Faster Product delivery Efficient Product development Better modeling capabilities Future Technology Gaps and Focus Areas Factory software systems to support Direct Transport AMHS Equipment Engineering Capabilities and Standards Engineering Chain Management Systems Impact of 157nm and Next Generation Litho on the Factory Post Conventional CMOS Manufacturing 450mm Wafer Processing

Integrated Solutions are Essential to Meet Needs + Agile Manufacturing - Equipment Engineering Capabilities - Single wafer control Engineering Chain Mgmt Process Control - FDC, R2R, W2W control IM and M2M matching Material Handling - Direct Transport for Send Ahead, monitors, hot lots Integrated Sorters, Stockers, Metrology? Flexible Factory Designs Quick ramp-up operation Extend & Scale quickly Convert quickly Technology Requirements New disruptive process technologies Next Generation Litho 157nm litho High K gate stack Low k dielectrics Copper processing + Improved Productivity Decreased Factory Cycle Time (QTAT) Improved Equipment Efficiency Reduction in non-product (I.e. test) wafer usage More efficient direct labor Faster factory conversion at technology nodes Integrated Factory Goal = Meet Factory Challenges and Technology Requirements

Industry Business Model Is Changing ITRS Factory Integation TWG 2017/3/27 Industry Business Model Is Changing Foundry/Fabless Age IDM Age Collaboration Age Transactions and Interlinkage will be flexible and open. Marketing IP Design Marketing Design Design EP/BP Fab Marketing Design Fab Foundry 水平分業の時代から、よりフレキシブル、ダイナミックなコラボレーション時代に変化していく。この時代のキーテクノロジーの一つがＩＴ技術になる。 IPﾞ Foundry Marketing IT is a must and Speed is most important FITWG 2000

Engineering Chain Management Customers want new products delivered faster [design  ship] The Engineering Chain integrates the development flow from design specification to customer delivery for a new product through engineering data exchange Engineering Chain = Design  Reticle  Process Integration  Customer  High Volume This is different from supply chain mgmt which focuses on efficient volume production Engineering chain management ensures customer cycle times are met, while new products are properly integrated with the process Supply Chain (O2D) Sales SCP MES Factory Shipping WO WIP Order Promise Design Commerce Data Engineering Data Engineering Chain (T2M) e-Diag Maintenance Support EE Data EES APC Recipe Eqpt. Configuration Mass Production Product Development Process Devmn’t YMS Mask Eqpt. Eqpt. Supplier

Potential Solution it is driving Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality Metric Potential Solution it is driving Production Equipment Overall Equipment Efficiency (OEE) Equipment Engineering Capabilities including: e-Diagnostics, spares management, fault detection, on-line manuals to improve MTTR Advanced Process Control to improve output Integrated factory scheduling and dispatching capabilities to improve equipment utilization Optimized Wafer movement at equipment Ability to run different process parameters for each wafer on equipment Implement embedded controller standards MES capabilities to handle standard and non-standard operational scenarios Non-product wafers as a % of factory wafer starts Techniques to design equipment for reliability Advanced Process Control systems Hot-Lot and regular lot cycle time per mask layer for the factory Direct transport systems integrated with factory schedulers for tool to tool moves Innovative carrier/wafer level control systems

Potential Solution it is driving Translating Material Handling, FICS, and Test Manufacturing Metrics to Reality Metric Potential Solution it is driving Number of transport types in the factory Direct tool transport using conveyors Direct tool transport using overhead hoist AMHS system throughput for interbay and intrabay Electrical, mechanical, and control systems for transport types: OHS, OHT, RGV, AGV, PGV Improved Scheduling/Dispatching for direct tool transport, hot lots, send ahead wafer, etc. Time to create industry standards Monthly or Continuous voting cycles to approve Use Internet for balloting/approval Dedicated resources for development Lead time for solutions to conform with standards Develop standards and applications in parallel Automated test tools for compliance verification Groundbreaking to first tool move in Standardized design concepts Design tools including e-tools More off-site module construction

Continued Standardization is needed to Reduce Integration Time, Cost, and Complexity Production Equipment AMHS interfaces Automation data interfaces Facilities hook-up ESD Factory Information & Control E-Factory standards (EEC, APC, etc.) Equipment Data Interfaces Company Data Interfaces Security Process Equipment UI Test Equipment Automation data interfaces AMHS interfaces Facilities hook-up ESD Partner Security Firewall Customer / Supplier Material Handling Systems Production Equipment Interfaces Automation data interfaces Facilities hook-up Carriers Facilities Height, weight, temperature Equipment Hook-up Safety AMHS Eqpt (side view) Not an exhaustive list

Potential Solutions driving R&D Agenda Engineering chain management models, data integration and interface standards Factory capacity planning and supply chain management systems integrated with actual factory data Internet based Manufacturing and Engineering systems Advanced Factory/Mfg Modeling Tools and Capabilities Equipment Engineering Capabilities (EEC) e-diagnostic, fault detection, advanced process control, on-line manuals, spares management, etc. Scheduling, Dispatching, and MES integration for Direct Transport AMHS Additional Industry Standards for Equipment, AMHS, Facilities, and Information/Control Systems

Key Messages Improving the Factory’s Cost, Productivity and Speed is essential Business strategies, market demands, and process technology changes continue to make factories difficult to integrate More focus must be spent on new product development and high mix factory cycle times Gaps in Production Equipment OEE, Factory NPW usage, and Factory modeling must be improved. e-Factory concepts are being developed to solve complexity, integration and equipment OEE issues Standards have been very effective in 300mm, but must be implemented more consistently in some areas More focus must be given to Post-Fab manufacturing (Assembly, Test, etc.) to improve productivity

No Significant 2002 Changes to ESD Requirements Production Equipment Technology Requirements 150 150 100 100 75 75 50 50 25 25 Facilities Technology Requirements 200 150 150 100 100 75 75 50 50 25 ---- 200 ---- 150 ---- 100 ---- 75 ---- 50 Test Manufacturing Technology Requirements Was Maximum allowable electrostatic charge on devices 1-2.5 nC 100-250V 1.0 nC 100V 0.5 nC 50V 0.1 nC 10V 0.25 nC 25V Is Facilities Standards The SEMI ESD Task force is currently working on a new document to define facility electrostatic levels. First ballot expected March 2003. Change color to blue – under development Facility electrostatic levels stds No data available to support changing the values in the tables SEMI ESD Task Force working on a document for electrostatic compatibility in the factory – most likely data source for changes