2009 Litho ITRS Update Lithography iTWG July 2009

Outline Lithography Potential Solutions Major Challenges

ITRS Working Group United States Japan Taiwan Greg Hughes SEMATECH (Chairs) Mike Lercel IBM Japan Takayuki Uchiyama NEC (Chair) Naoya Hayashi DNP Masomi Kameyama Nikon Tetsuo Yamaguchi NuFlare Taiwan Anthony Yen TSMC (Chair)

Potential Solutions 2009

Preferred Technology by Year 2008 SEMATECH Litho Forum survey results 45nm HP 32nm HP 22nm HP

2009 Litho Requirements

2009 Litho Requirements Single Litho Tool Overlay

2009 Litho Requirements Restricted Definition of CD - one direction, single pitch, single iso dense ratio.

2009 Lithography Techniques

Difficult Challenges > 22nm

Difficult Challenges > 22nm

Difficult Challenges <= 22nm

Difficult Challenges <= 22nm

Summary Lithography solutions for 2010 Lithography solutions for 2013 45 nm half-pitch CoO is Driving 193 Immersion Single Exposure for DRAM/MPU Flash using Double Patterning (Spacer) for 32 nm half-pitch Lithography solutions for 2013 32 nm half-pitch Double patterning or EUV for DRAM/MPU 22 nm half-pitch Double patterning or EUV for Flash Double exposure / patterning requires a complex set of parameters when different exposures are used to define single features LER and CD Control Still remain as a Dominant Issue Mask Complexity for Double patterning Mask Infrastructure for EUV