Selective Soldering System ◆ Cost efficient application ◆ Selective spray fluxer with precision needle point ◆ Six individual FLIP units -individually.

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Presentation transcript:

Selective Soldering System ◆ Cost efficient application ◆ Selective spray fluxer with precision needle point ◆ Six individual FLIP units -individually programmable Stand – alone model TPD6-25

Selective Soldering System Flip Solder Flow System Six Individual FLIP -Individual programmable Sp Coating -Reduce corrosion Easy Core removable -Maintenance

Selective Soldering System Applicable boards:MAX. 330(W)×400(L)mm. / MIN. 50(W)×50(L)mm Parts clearance:Top MAX. 150mm / Bottom MAX. 25mm Circuit board height allowance :3 mm Parts to other parts clearance Solder bath :::: 5 mm 6 Flip (Flat Linear Induction Pump) Input source:AC200V,208V,220V,480V,3φ 14kVA at 200V Weight:approx. 300kg Specification

Selective Soldering System Centralized control for electric machinery and instrument of whole equipment (sequence controller) Digital display and control Solder Temperature Alarm display : 0 ~ 260 degrees Emergency stop Solder bath overheat Display: Language can be switched between Japanese and English Control Box

Selective Solder and Flux unit

Nozzle unit

Flux unit

Flux unit (Nozzle)