Assembly and Packaging

Assembly and Packaging Technical Working Group – 2010 (93 Participants) Joseph Adam, Sai Ankireddi, Bernd Appelt, Richard Arnold, Muhannad S. Bakir, Souvik Banerjee, Rozalia Beica, Steve Bezuk, Mario Bolanos-Avila, W.R. Bottoms, Yi-jen Chan, Chi-Shih Chang, Clinton Chao, Carl, Chen, William Chen, Sonjin Cho, Yulkyo Chung, Bob Chylak, Mark De Samber, Krishor Desai, Dan Evans, Bradford Factor, Tatsuhiro Fujiki, Michael Gaitan, Michel Garnier, Steve Greathouse, Tom Gregorich, Richard Grzybowski, George Harman, Shuhya Haruguchi, Ryo Haruta, Tomoo Hayashi, Harold Hosack, Willem Hoving, Mike Hung, John Hunt, Kazuyuki Imamura, Hisao Kasuga, Dan Kilper, Mitchitaka Kimura, Shoji Kitamura, Takanori Kubo, Choon Heung Lee, Ricky S W Lee, Rong-Shen Lee, Russell Lewis, Sebastian Liau, Weichung Lo, David D. Lu, Abhay Maheshwan, Debendra Mallik, Kaneto Matsushita, Masao Matsuura, Lei Mercado, Hirofumi Nakajima, Keith Newman, Luu Nguyen, John Osenbach, Masashi Otsuka, Richard F. Otte, Gilles Poupon, Klaus Pressel, Gamal Refai-Ahmed, Charles Richardson, Peter Robinson, Bernd Roemer, Gurtej Sandu, Naoto Sasaki, Paul Siblerud, Vern Solberg, Simon Stacey, Yoshiaki Sugizaki, Teresa Sze, Coen Tak, Takashi Takata, Patrick Thompson, Claudio Truzzi, Andy Tseng, Shigeyuki Ueda, Shoji Uegaki, Ryosuke Usui, Henry Utsunomiya, Kripesh Vaidyanathan, Freek Van Straten, Julien Vittu, James Wilcox, Max Juergen Wolf, Jie Xue, Zhiping Yang, Hiroshi, Yokota, Eiji Yoshida, Hiroyoshi Yoshida.

Assembly and Packaging Technical Working Group - 2010 87 Members Participated in 2010 Activities Focus of activities for 2010 The only change to tables will be AP1: Difficult Challenges Preparation for 2011 with expanded coverage for: Medical electronics, 3D integration Interposers Automotive electronics Optoelectronics Printed electronics Handling of thinned wafers and die Embedded components MEMS integration Rewrite of the System in Package paper Cross TWG coordination Major collaborations include ERM, ERD, ESH, Interconnect, Design, Test Coordination with other Roadmaps iNEMI CTR/MPC JISSO

The Pace of Innovation is Accelerating Today packaging has become a crucial enabler for both “More Moore” as the industry enters the deep submicron regime and the functional diversification and heterogeneous integration which has been titled “More than Moore”. In response to these dual challenges we have an unprecedented pace of innovation in assembly and packaging technologies.

Innovation in Wafer level Packaging WLCSP and Wafer Level Fan-Out technologies have become main stream. Future directions will be include multi-die (side by side and stacking) fanout. They are becoming an enabling part of the SiP technology portfolio providing: Miniaturization lower power cost reduction heterogeneous integration Examples include complex PoPs, embedded components, integrated passives, and others.

Future Directions in Wafer level Packaging

Progress Continues in Wire Bond Technology The rising cost of gold is driving copper wire bonding to replace gold. Conversion from gold wirebond packages to copper requires: Changes in almost all materials and wirebond equipment New process engineering New reliability science to addressing new failure mechanisms Fine Pitch Copper wire bonds are now in volume production

3D Stacking with Wirebonds 3D wirebond stacking with 50um thick wafer

Lead Free Requirements Demands New Interconnect Technology Copper pillar has become the lead free bump metallurgy of choice for the fine bond pad pitch at deep submicron nodes. The technical challenges include: New underfill materials New processes for cu pillar and under bump metallurgy (UBM) Design tools for copper pillar interconnect This must be accomplished while maintaining adequate margins of safety for dielectric damage and package integrity.

Copper Pillar Array

Expanded Coverage of Emerging Requirements for 2011: Medical Electronics Medical electronics Categories to be addressed: Portable medical electronics Implantable medical electronics (Parkinson’s disease symptom control) Selected Issues for Medical electronics Power requirements: energy scavenging; wireless radiated power; batteries Safety issues (voltage, biocompatibility, power delivery) FDA certification Reliability requirements Environmental issues Connectivity (wireless) Optical components (cameras) Microfluidics Implantable micro-robotics Sensors MEMS

Expanded Coverage of Emerging Requirements for 2011: 3D Integration Selected Issues for 3D Integration Die stacking methods Homogeneous stacking Heterogeneous stacking Test challenges for 3D Test access Test cost Through silicon Vias Thermal management for 3D structured Power integrity 3D SiP Bonding methods Codesign and simulation

Expanded Coverage of Emerging Requirements for 2011: Interposers Selected Issues for Interposers: Systems integration for 2D and 3D Interposer features Redistribution wiring Passive networks Thermal management Stress management Materials selection Si Ceramic Glass Organics

Expanded Coverage of Emerging Requirements for 2011: Automotive Electronics Automotive electronics Categories to be addressed: Internal combustion Hybrid All electric Selected Issues Communications (including optical networks) Thermal management In cabin Hostile environments Safety Sensors Controls for improved efficiency Cost One side air cooling Cooling on both sides Liquid immersion cooling

Expanded Coverage of Emerging Requirements for 2011: Thin Wafer and Die Handling Selected Issues for Thin Wafer and Die Handling Testing: contactors with ohmic contact without damage Holding mechanisms Electrostatic chucks Bernouilli chuck Temporary bonding (sacrificial layer) Vacuum chucks (porous ceramic chucks) Dicing of thin wafer Warpage

Expanded Coverage of Emerging Requirements for 2011: Embedded Components Embedded Component Categories to be addressed: Active devices Passive devices Selected Issues for Embedded Components Performance enhancement due to reduced distance between die and passives Incorporation of additional functionality (heat pipes; wave guides) Keep out area around embedded components Charge source close to the die for current surge Reduced size by placement of passives under die Placement accuracy for small thinned die 3D alignment tolerance for assembly Improved resistance to shock Thermal management

Expanded Coverage of Emerging Requirements for 2011: MEMS Integration MEMS Integration Categories to be addressed: Sensors Accelerometers RF Switches, Oscillators, and filters Microfluidics Optical Selected Issues for MEMS Integration Low stress interconnect between MEMS device and package cavities Low cost, high reliability mechanical mounting Electrical and environmental connections low electrical parasitic interconnect Low cost hermetic cavities Stress management Microfluidic pump

Difficult Challenges

Difficult Challenges

Difficult Challenges

Thank You