July 14, 2010 San Francisco, California Marriott Hotel Assembly and Packaging

July 14, 2010 San Francisco, California Marriott Hotel Assembly and Packaging 82 Members 22 present for Summer workshop Focus of activities for 2010 – The only change to tables will be AP1: Difficult Challenges – Preparation for 2011 with expanded coverage for: Medical electronics, 3D integration Interposers Automotive electronics Optoelectronics Printed electronics Handling of thinned wafers and die Embedded components MEMS integration – Rewrite of the System in Package paper Cross TWG coordination – Major collaborations include ERM, ERD, ESH, Interconnect, Design, Test Coordination with other Roadmaps – iNEMI – CTR/MPC – JISSO Difficult Challenges changing: 3D integration, new materials, more Moore

July 14, 2010 San Francisco, California Marriott Hotel Assembly and Packaging Technical Working Group Summer Meeting 2010

July 14, 2010 San Francisco, California Marriott Hotel Medical Electronics Expanded Coverage of Emerging Requirements for 2011: Medical Electronics Medical electronics Categories to be addressed: – Portable medical electronics – Implantable medical electronics (Parkinsons disease symptom control) Selected Issues for Medical electronics – Power requirements: energy scavenging; wireless radiated power; batteries – Safety issues (voltage, biocompatibility, power delivery) – FDA certification – Reliability requirements – Environmental issues – Connectivity (wireless) – Optical components (cameras) – Microfluidics – Implantable micro-robotics – Sensors – MEMS

July 14, 2010 San Francisco, California Marriott Hotel 3D Integration Expanded Coverage of Emerging Requirements for 2011: 3D Integration Selected Issues for 3D Integration – Die stacking methods Homogeneous stacking Heterogeneous stacking – Test challenges for 3D Test access Test cost – Through silicon Vias – Thermal management for 3D structured – Power integrity – 3D SiP – Bonding methods – Codesign and simulation

July 14, 2010 San Francisco, California Marriott Hotel Interposers Expanded Coverage of Emerging Requirements for 2011: Interposers Selected Issues for Interposers: – Systems integration for 2D and 3D – Interposer features Redistribution wiring Passive networks Thermal management Stress management – Materials selection Si Ceramic Glass Organics

July 14, 2010 San Francisco, California Marriott Hotel Automotive Electronics Expanded Coverage of Emerging Requirements for 2011: Automotive Electronics Automotive electronics Categories to be addressed: – Internal combustion – Hybrid – All electric Selected Issues – Communications (including optical networks) – Thermal management In cabin Hostile environments – Safety – Sensors – Controls for improved efficiency – Cost One side air cooling Cooling on both sides Liquid immersion cooling

July 14, 2010 San Francisco, California Marriott Hotel Thin Wafer and Die Handling Expanded Coverage of Emerging Requirements for 2011: Thin Wafer and Die Handling Selected Issues for Thin Wafer and Die Handling – Testing: contactors with ohmic contact without damage – Holding mechanisms Electrostatic chucks Bernouilli chuck Temporary bonding (sacrificial layer) Vacuum chucks (porous ceramic chucks) – Dicing of thin wafer – Warpage

July 14, 2010 San Francisco, California Marriott Hotel Embedded Components Expanded Coverage of Emerging Requirements for 2011: Embedded Components Embedded Component Categories to be addressed: – Active devices – Passive devices Selected Issues for Embedded Components – Performance enhancement due to reduced distance between die and passives – Incorporation of additional functionality (heat pipes; wave guides) – Keep out area around embedded components – Charge source close to the die for current surge – Reduced size by placement of passives under die – Placement accuracy for small thinned die – 3D alignment tolerance for assembly – Improved resistance to shock – Thermal management

July 14, 2010 San Francisco, California Marriott Hotel MEMS Integration Expanded Coverage of Emerging Requirements for 2011: MEMS Integration MEMS Integration Categories to be addressed: – Sensors – Accelerometers – RF Switches, Oscillators, and filters – Microfluidics – Optical Selected Issues for MEMS Integration – Low stress interconnect between MEMS device and package cavities – Low cost, high reliability mechanical mounting – Electrical and environmental connections – low electrical parasitic interconnect – Low cost hermetic cavities – Stress management Microfluidic pump

July 14, 2010 San Francisco, California Marriott Hotel Difficult Challenges

July 14, 2010 San Francisco, California Marriott Hotel Difficult Challenges

July 14, 2010 San Francisco, California Marriott Hotel Difficult Challenges

July 14, 2010 San Francisco, California Marriott Hotel Thank You