INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Engineering and Future Plans James Williams and Chris Robb

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 What is TransPAC? TransPAC is a cooperative project funded by the US NSF and the Japanese JST to provide a high-performance network connection between the Asia-Pacific and the United States science communities; and, to encourage the use of that network in the development of cooperative science.

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 From an engineering perspective, TransPAC has three components 1.The TransPAC circuit between Tokyo and Chicago, landing at the STAR TAP. 2.The equipment configuration at the Tokyo site (Tokyo XP) 3.The equipment configuration at the Chicago site (Chicago XP) This talk focuses on current configurations, future plans for these three components and some applications.

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Circuit

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Circuit

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Circuit

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Circuit

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Tokyo XP

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Current Chicago XP

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Future TransPAC Circuits

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Future TransPAC Circuits

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Future TransPAC Circuits

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Tokyo XP

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Chicago XP: The Future Replacement of Cisco 7505 router with Juniper M20 TransPAC OC3mon deployed; more powerful general Unix host deployed

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Chicago XP: The Further Future Removal of Cisco LS1010 cflowd data from Juniper would capture all data Less reliance on OC3mon machine

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Interesting TransPAC Applications Telemicroscopy Measurement issues N-body problem

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Scientific Instruments Trans-Pacific Telemicroscopy Scientists at the Osaka University Research Center for Ultra High Voltage Electron Microscopy (UHVEM) and University of California San Diego National Center for Microscopy and Imaging Research (NCMIR) successfully use international advanced research networks to couple the world's largest and most powerful (3 million volt) transmission electron microscope at UHVEM to a remote-use computer pavilion set up at NCMIR.

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC interface at ST DV Utokyo to UIC Slide courtesy of Linda Winkler - STAR TAP

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 TransPAC Flow Analysis Tool

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 N-body Problem Simulate gravitational interactions among many particles Special purpose computer at University of Tokyo (GRAPE) Storage of data (terabytes/month initially) at Indiana University TransPAC as enabling network I2SS as test new technology

INDIANAUNIVERSITYINDIANAUNIVERSITY Spring 2001 Questions?? James Williams Chris Robb