Large Area Processing Research Programme National Science Foundation Manufacturing Energy Workshop 24 – 25 March 2009

A large area processing research centre for research, prototyping and pilot production for printed electronics, energy devices, functional films and microfluidics devices. Objective

Motivation Rigid & Integrated Devices Complex Lithography High- Performance Electronics Assembly & Packaging Conventional Silicon Electronics Manufacturing

Paradigm Shift Flexible & Conformal Large Area Manufacturing Ambient Intelligence Sensors Lighting Direct-Write “On-Demand” Large Area Flexible Substrates

Roll-to-Roll Spatially Selective Patterning Roll-to-Roll Embedding Hybrid Rigid- Elastic Substrates Research AreasIndustry DriversTechnology Drivers Direct-Write Manufacturing Large Area Lightweight Embedded Channels & Structures Large Area Additive Patterning Drivers & Research Areas Low- Temperature Processing Green Mfg Conformal Multi- Functional

Manufacturing Processes System Integration Functional Substrates & Materials Energy Functional Films Printed Electronics Microfluidics High Volume Manufacturing Devices & Systems Equipment Materials Scope

Manufacturing Processes  Web width: 1 m  Pattern Resolution < 1  m  Roll-to-Roll patterning: printing, etc.  Roll-to-Roll structuring: embossing, etc. Materials  Flexible & transparent thermoplastic substrates: eg LCP, etc.  Metal & composite substrates  Organic and inorganic conductors, dielectrics & semiconductors Technology Platforms  Energy devices  Printed electronics  Functional films  Microfluidics devices Scope

Manufacturing Processes Resolution, throughput, yield and substrate technologies Large area format manufacturing In-situ inspection and reliability characterization Low temperature additive and direct-write patterning Conformal and stretchable substrates Materials Performance, processability and stability Synthesis and characterization of nanoparticle, inorganic and organic based semiconductors, conductors and dielectrics Devices Performance, density and reliability Analysis of device structures, interconnects and system-level architectures TFT, PV, OLED, supercapacitors and batteries Research Challenges Manufacturing Processes Resolution, throughput, yield and substrate technologies Materials Performance, processability and stability Devices Performance, density and reliability