RICH 17 m Beam Pipe Mirrors Separate pions from muons <1% level between 15 and 35 GeV/c Track time at 100 ps level Partecipate in the L0 trigger Neon as Cherenkov radiator mosaic of mirrors (17 m focal length) two spots with PM (1000 PM per spot) beam pipe passing through PM lodging disk INFN Perugia INFN Firenze CERN M.Lenti

M.Lenti Vessel tender not submitted yet (CERN responsibility)

Photomultipliers Hamamatsu R7400 U PM available (quality test ongoing) PM needed: 976x2 = 1952 (7.5% spares available) Quality test ongoing M.Lenti

M.Lenti4 M.Piccini R.Piandani

M.Lenti5 M.Piccini R.Piandani

Photomultipliers: mechanics PM “mechanics” in production (aluminum disks) “Winston Cones Disk”: separate Neon from air “PM Lodging Disk”: keep PM in position and light shielded “Vacuum Protection Hat”: used during vessel evacuation M.Lenti

Technical Drawing (in EDMS) M.Lenti Winston Cones Disk

Winston Cones Disks Hook hole Disk 1Disk M.Lenti zoom Both disks now at CERN for quartz windows and mylar floils gluing

Technical Drawing (in EDMS) PM Lodging Disk M.Lenti

PM Lodging Disks 1° Disk completed (presently in Florence) 2° Disk (and 2 “hats”) to be started soon M.Lenti

Fixation in the evaporator: The clamped Mylar foil is fixed to the rotating plate in the upper part of the evaporation plant NA62 Mylar reflective coating with Al/MgF2 Quality Control samples: For each process (foil) we add a glass sample to assure the quality control of the process. An extra sample is cut out of the Mylar foil to document the result on the foil. T.Schneider

Aluminium evaporation: Tungsten filaments are charged and pre-melted with pure Aluminium. NA62 Mylar reflective coating with Al/MgF2 Via resistive heating (joule effect) the Aluminium is evaporated to the rotating substrate (Mylar foil). The vacuum during the process is in the order of mbar. T.Schneider

Reflectivity scan of some coated Mylar foils (scan from 200nm-600nm) NA62 Mylar reflective coating with Al/MgF2 T.Schneider

Hamamatsu E5780 Socket Assembly Voltage Divider Circuit Total Resistance 2.8 M  14M.Lenti CERN request of halogen-free cables, not Hamamatsu default. Expensive custom production. Homemade prototypes (R.Ciaranfi) with halogen free cables. Tests in INFN – Firenze Lab. PMTs tested w. pulsed diode LASER (Hamamatsu PLP-10 Picosecond Light Pulser) 10 KHz, 96ps pulses, =440nm R.Ciaranfi S.Lami

First Step: Reproduce Hamamatsu socket performance with homemade prototypes DONE Second Step: Optimize bleeder circuit parameters: – Reducing divider current while preserving efficiency and time resolution DONE 15M.Lenti Goal: satisfy CERN requirements, reduce total cost, optimize HV Divider and eventually reduce heat dissipation New INFN HV Dividers R.Ciaranfi S.Lami

Systematic tests w. different resistors M.Lenti16 2m long cables. Molex connectors. Comparison Hamamatsu - INFN dividers with 3x, 5x, 6x, 8x and 10xR. Tests with laser illuminating 2 PMTs at the same time, one kept fixed at 900V as a reference, to monitor laser fluctuations. R.Ciaranfi S.Lami

Reminder: Divider circuit current has to be >> PMT current Average flow in RICH PMT ~ 24 nA M.Lenti17 HB SocketHama.3xR5xR6xR8xR10xR I (  A) V dT C -  (ns) (ns) 6.1 +/ / / / / /-0.3 I (  A) V dT C -  (ns) (ns) 6.5 +/ / / / / /-0.2 dT C = Time difference Trigger-PMT corrected for slewing Width = PMT digital signal width New INFN HV Dividers R.Ciaranfi S.Lami

M.Lenti New INFN HV Dividers 18 PMT HB A R.Ciaranfi S.Lami

New HV patch panel M.Lenti19 New HV filter board:  More compact / smaller connectors  8 SHV inputs – 32 outputs, to match new NINO board  Extra 200 M  to ground for safety, slightly different filter  Standard HV rack at 2m from electronics  HV_PATCHP_REVD R.Ciaranfi S.Lami

HV_PATCHP_REVD REVISION E FOR EACH CHANNEL WE ADDED A COMMON MODE FILTER CONFIGURATION IN CASE OF SOME NOISE, WHILE PRESERVING THE DIFFERENTIAL CONFIGURATION SOME OPTION AVAILABLE TO CONNECT GROUND AND P.E. THE BOARD WIDTH RESULTS TWICE THE PREVIOUS ONE, AS MORE COMPONENTS HAVE BEEN ADDED R.Ciaranfi S.Lami 20M.Lenti

Electronics chain PMT PRE_NINO NINO_CHIP TELL 62 RG174 PCB MICROSTRIP OHM DIFFERENTIAL FOR NINO CHIP MATCHING MADISON UNIVERSAL TM CABLE FOR 130 OHM DIFFERENTIAL FOR LVDS SIGNAL VME RICH FE 32 CH BOARD GAINDIFF PCB MICROSTRIP 130 OHM DIFFERENTIAL FOR CABLE MATCHING BIPOLAR HV CABLE 50 OHM TERMINATOR VHDCI CONN M.Lenti

FE board 340 mm 360 mm CUSTOMIZABLE FRONT END (“FE”)AREA “DAQ” AREA 8CH NINO CHIP DC/DC CONVERTER 3.3 TO 2.5V I2C CAN 8CH NINO CHIP 8CH NINO CHIP 8CH NINO CHIP MIN. 120 mm MAX. 220 mm 32 LEMO COAX SIGNAL FROM PMT 32 CHANNEL FRONT-END AREA J1 VME CONNECTOR 32 CH VHDCI CONNECTOR TO TELL62 4CH MULTIPLICITY TO TELL62 CAN BUS CONNECTORS G M.Lenti

FE, HV, HV dividers summary New PM sockets: few other prototypes, then mass production (to be completed: oct 2012) HV Patch Panel: same time scale HV supply: completed New FE board: to be completed by spring M.Lenti23

DAQ TEL62 board equipped with 4 HPTDC: 512 ch 4 TEL62 for all PM (2000 ch) 1 TEL62 for “multiplicity” trigger (250 ch) Perugia group works on the TEL62 fimware and trigger See M.Sozzi report for details M.Lenti

Mirror Support The Mirror is supported through one hole in the back where a dowel is inserted. The Mirror is falling: the dowel is touching the mirror not in the barycenter Actuating ribbon works against g and gives vertical axis alignment A second actuating ribbon at 90 deg gives the horizontal axis alignment Piezo motors are used to pull the ribbons System heavily tested in Lab in Firenze M.Lenti

Front view M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

Front view (half of the mirrors removed) M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

Detail of the front view M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

Detail of mirror support M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

View from the top M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

Side Views M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

Side-Rear view M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

Rear View M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

Rear view (detail) M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

The two piezo motors… M.Lenti V.Carassiti F.Evangelisti INFN Ferrara

Mirror Aluminization All the mirrors (18 hexagonal and 2 semihex) are at CERN Aluminization (in the same worshop as for the mylar foils) delayed: no need to have them ready too early Some joints to be glued on the back of each mirror for ribbon joining Gluing to be done just after aluminization (fall 2012) M.Lenti36

MonteCarlo work People involved: F. Bucci, A.Cassese, R.Piandani, M.Piccini GEANT4 modelling of all the RICH Simulation of RICH response (signal-background) Optimization of RICH alignment RICH material budget (dangerous for gamma hiding) …… M.Lenti

RICH Illumination Generate 10 5 K +  + events ~ after applying cuts on geometrical acceptance and momentum of the charged track Look at the end position of the optical photons M.Lenti38 Transverse plane F.Bucci

M.Lenti39 M.Piccini, S.Venditti

15-Oct. Tech. Run May 2014 Phys. Run Vessel Order RICH Installation Planning (V.8.45) M.Lenti

M.Lenti41 People Perugia Staff: G.Anzivino, P.Cenci, M.Pepe, M.Piccini TD: R.Piandani (A.R. end: ), V.Duk (A.R. INFN 2 years, start ) Firenze Staff: A.Bizzeti, E.Iacopini, S.Lami, M.Lenti, M.Veltri TD: F.Bucci (art.23, end: march 2013), A.Cassese (PhD, end: )

Conclusions Lot of progress on many items of RICH Vessel production (CERN responsibility) delayed Mirror support system to be finalized M.Lenti

Backup M.Lenti

RICH PMT: Hamamatsu R7400U-3 Worlds’s smallest PMT 44M.Lenti Fast, low noise, single anode PMT, 8 dynodes, G ~ V ~2000 PMTs tested in Perugia/Firenze Recent thesis about PMT characterization by Valentina Gori

Hamamatsu E5780 Socket Assembly Voltage Divider Circuit Total Resistance 2.8 M  45M.Lenti CERN request of halogen-free cables, not Hamamatsu default. Expensive custom production. Homemade prototypes (R.Ciaranfi) with halogen free cables. Preliminary tests in INFN – Firenze Lab

INFN – Firenze Socket Prototype 46M.Lenti

RICH prototype results NIM A593 (2008) NIM A621 (2010) GeV/c 35 GeV/c  suppression: 0.7% ( 15<p<35 GeV/c) M.Lenti

Foil preparation: The Mylar foils are carefully sorted out from a new roll directly from the company. No extra cleaning is applied. All operations take place in our Clean room! NA62 Mylar reflective coating with Al/MgF2 Mylar foil fixation: The foil is kept under tension on a bent aluminium support plate. T.Schneider

Air cleaning: possible dust is removed with an air pistol (external gas bottle). NA62 Mylar reflective coating with Al/MgF2 Thermal treatment: Over night the foils dry in an degree to reduce the water content. T.Schneider

MgF2 evaporation: a tungsten recipient, so called “boat”, is filled with MgF2 granulate NA62 Mylar reflective coating with Al/MgF2 In a second Joule source the MgF2 is heated up and deposited on top of the Aluminium layer. T.Schneider

Quality control: With the Universal Reflectance Accessory of our Perkin Elmer spectrometer each sample is measured for reflectance in- between 200 and 600nm NA62 Mylar reflective coating with Al/MgF2 The 2 corresponding samples (1 glass 1 Mylar) per evaporation are stored in our lab for future crosscheck. T.Schneider

Packing and storage: For protection reasons the foils are packed in stocks of 10 in a dedicated metallic cover to reduce mechanical friction on the surface. NA62 Mylar reflective coating with Al/MgF2 A sealed plastic bag is filled up with dry clean gas to suppress oxidation of the metallic layer. T.Schneider

Similar scans of the first 10 production foils in eV scale NA62 Mylar reflective coating with Al/MgF2 T.Schneider

Simulation with Film Star software helped us to optimize the coating parameters. In addition it gives us the information needed for the NA62 RICH geometry (77deg). Measurement were done at 30deg. NA62 Mylar reflective coating with Al/MgF2 substrate Incident angle T.Schneider

The plot shows the quantum efficiency of the foreseen PM’s (data sheet) and the expected performance for the combination of PM and 77deg reflection on the Mylar foils in the cones. Other factors are not taken into account (absorption via windows and passing media, or % of direct and reflected light). NA62 Mylar reflective coating with Al/MgF2 T.Schneider

Mirrors All mirrors ready (18 hex + 2 semi-hex), now at CERN Quality test made in Italy in may 2011 Coating to be done at CERN Mirror support system with a “dummy” mirror: hung at the center aligned with micrometric piezo.motors V.Carassiti will engeneerize the mirror support system In the fall M.Lenti

Lab’s Optical Measurements Lab Dummy Mirror in Clean Room M.Lenti

Hex10 Hex10 in Box3 ( ) Hex10 in box ( ) Hex10 in Optics Lab ( ) M.Lenti

Hex10 Dist Laser-Mirror: m Dist Mirror-Diode: m Minimum: +0.6 cm R = ( )/2 = m F = R/2 = m σ X (min) = 0.20 mm σ y (min) = 0.13 mm √(σ X *σ Y )(min) = 0.12 mm Fx-Fy: +4.2 cm Horiz. Sigma Vert. Sigma Horiz.*Vert. Sigma(2) M.Lenti

A. Cassese M.Lenti