Gigabit Ethernet – IEEE 802.3z The Choice of a New Generation ECE 4006c G2- Gigabit Ethernet Intel/Agilent TX Javier Alvarez, gte006r Astou Thiongane,

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Gigabit Ethernet – IEEE 802.3z The Choice of a New Generation ECE 4006c G2- Gigabit Ethernet Intel/Agilent TX Javier Alvarez, gte006r Astou Thiongane, gt3083a Ebrima Kujabi, gte212s

Background Coverage General Introduction to the Ethernet The IEEE Ethernet Standards z Single Mode V. Multimode Fiber VCSELs V. EELs The Specifics of the Project -The Intel Ethernet Card - The Maxim Evaluation Board (MAX3287SW EV KIT)

Evolution of the Ethernet The Internet Revolution and the need for ever Increasing Bandwidth The Ethernet Advantage: - Increase in Efficiency - Larger Capacity - Lower cost - Simpler Networks

From Ethernet to Gigabit Ethernet

Why Fiber? The two fibers can transmit the same amount of information as the bundle of copper wires.The two fibers can transmit the same amount of information as the bundle of copper wires.

SMF v. MMF SMF - Core Size 9um - 2km w/o losses - No bouncing off cladding MMF - Core Size um - Graded v. Step-Index Graded Index MMF is what is most common and what will be used in this project b/c of low cost.

VCSEL vs. EEL VCSELs have a circular laser beam, which is easier to couple with fiber than the EEL’s elliptical beam. VCSELs are cheaper for several reasons: – They can be tested on the wafer; thus, bad chips can be discarded early in the manufacturing process.This increases the yield and decreases the unit price. – The laser beam being circular and perpendicular to the substrate makes it possible to couple it with fiber without rectifying optical lenses.

Project Goals Test previous semester’s Intel testbed Replicate transmitter in the opto-module – By using: Maxim 3287 Evaluation Board Using Reverse Engineering to design our own board Test the board by: – Obtaining an eye diagram

Intel Opto-module Pin Assignments: – Pins 1 and 9 are grounds for the receiver and transmitter – Pins 2 and 3 are differential inputs for the receiver – Pin 4 is Signal Detect – Pin 5 and 6 are VCC for the receiver and transmitter – Pins 7 and 8 are differential outputs for the transmitter.

Intel Opto-module (Cont’d) The sub-circuit in the the red box is the actual opto-module, which consists of a TX (top) and RX (bottom). The circuit in the green circle is a filter for the dc power provided to the transmitter and receiver. Capacitors C9, C10, C11, and C12 provide dc coupling. Resistors R1, R2, R3 and R4 provide 50 ohm terminations.

Opto-module (Cont’d) Our Group’s part of the job is to design a transmitter. The other groups have to design the laser and the receiver. The figure on the right is a high level drawing of how all three parts will be put together for testing.

General Use of MAXIM board Replace transmitter of Intel opto-module with Maxim MAXIM 3287, is a transmitter used to drive the VCSEL for optical transmission.

Maxim Board Specs Basic Features – Optimized operation at 1.25 Gbps. – Supports a current modulation up to 30mA. – Deterministic Jitter of approx. 22 ps. – Requires a 3.3 V to 5V power supply.

Component Analysis Differential Input (IN+, IN-) & Output (OUT+, OUT-) – Eliminates noise in channel Reference Voltage (REF) – Used for programming a laser bias current in VCSEL applications (~0.8mA) – Feature disabled for this project Monitor Diode (MD) – Monitors Laser Current – Not supported by board

Component Analysis (Cont’d) Current Modulation Control (Pin 15) Temperature Coefficient Control (Pin 16)

AC Coupling Remove R20 (49.9  ) Replace R24 (24.9  ) with R20

Safety Features Shutdown Driver Output (SHDNDRV) Power-On Reset (POR) – Resets Laser when turned off. – Rejects Noise caused by VCC during power-on or hot plugging. Bias Controlling Transistor Driver (BIASDRV) – Transistor placed between BIASDRV and VCC – Ensures Low Noise Operation – Rejects Power Supply Noise Decoupling Capacitors at VCC & GND

Board Design The Figure below shows a PSpice schematic of the new board design without the safety features.

Board Design (Cont’d) Parts List Consists:

Transmission Line Issues To avoid transmission line problems, wires should not be longer than 1/10 of a wavelength. Using the equations in the figure below, it was determined that the wires should not be longer than 4mm.

IEEE 802.3z Eye Mask The Eye Mask from IEEE 802.3z on the figure shows the distinction between a logical 1 and 0 An open eye represents proper functionality

PCB Layout In order to avoid transmission line problems, components in the signal path were placed close to the pins on the Maxim chip. The trace widths and separations were laid out to match the manufacturer’s (Bob House) specifications.

New Populated board The figure to the right shows the board that was designed using SuperPCB The yellow jumper wires connect VCC to certain components because the initial design did not include them.

Quick fixes The components in the red circles are SMA connectors – They had to be moved from the top to the bottom of the circuit: To avoid more Transmission line problems Make better contact with the board.

Maxim Board Eye Diagrams Eye from DC coupled board. Overshoot at bottom could be attributed to: -Power Supply noise - Inductance from board Eye from AC coupled board Overshoot at bottom is smaller than when DC coupled. Undershoot at top possibly due to using 47  termination, instead of 49.9 .

Eye Diagram from New Board The eye diagram was from a simple square wave (D215) produced by the BERT. An open eye could not be obtained from the other bit patterns. – This could be attributed to transmission line problems.

Troubleshooting The red arrows show where the pins were connected to the traces via small metallic wires. – The length of these wires might be the major contributor to transmission line problems.

Recommendations Redesign the board using SuperPCB to incorporate all the fixes. Be very cautious about transmission line problems. – The lines to be considered the most are the ones lying on the signal path.