sLHC Strip Tracker Module Envelopes (Tim) WP4 Meeting Glasgow, 13 th June 2011

Overview Development of engineering design for stave layout requires knowledge of likely stave core thickness. Components – Core Dimensions outer dimensions, bus-tape to bus-tape – Core Envelope Twists, bows local ‘roughness’, thermo-mechanical deformations – Module-to-tape adhesive – Module Envelope Module Envelope – Use experience from ABCN25’s with likely extrapolation to ‘final’ ABCN13 modules

ABCN25 Module Z Heights SmartScope survey of one hybrid glued to a sensor – Mount wire-bonding jig on SmartCcope and measure z-height – Locate module and establish vacuum – Measure z-heights of:- Silicon wafer Hybrid ASICs Wirebonds Capacitors

Results Wirebonds – Intended difference in loop-height is 0.2mm – 4-row wirebonding establishes on LHCb VeLo Beetle ASICs – 0.2mm bond height difference maintained. – Expect 4-row ABCN13 wirebonding to be similar giving wirebond height of 0.8mm above ASICs – Total height = = 2.21mm Capacitors – Measured height = 2.17 above local hybrid height of 0.65mm – Hybrid unsupported so measured height affected – Corrected height = = 2.32mm