Examination of some key CMP input parameters on slurry fluid mechanics PI: Chris Rogers Researchers: Jonathan Coppeta Chris Duska Jeremy Javidi Samuel.

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Presentation transcript:

Examination of some key CMP input parameters on slurry fluid mechanics PI: Chris Rogers Researchers: Jonathan Coppeta Chris Duska Jeremy Javidi Samuel Brodsky Corporate Sponsors : Cabot Corporation (Frank Kaufman) Intel Corporation (Ara Philipossian) VEECO Corporation

Numerical Simulations Fluid Thickness Thermal Gradients Mixing Measurements Polishing Data Results Year 3 Integration Research Strategy Friction Data FdFd

Polishing Platform 100 RPM Struers RotoPol-31 Drill Press Weighted Traverse Two Aligned 12 Bit Camera Three Way Solenoid Valve Tagged Slurry Slurry

Conditioning System

Design of Experiment 43 Runs Variables -Pad Manufacturer (Cabot, Rodel, Freudenberg) -Pad Groove Depth (0-40 mils) -Wafer Down Force (2-6 psi) -Platen Speed (30-90 rpm) -Slurry Flow Rate (20-50 ml/min) Constants -Groove Style (X-Y Grooving, 0.025” width) -Head Speed (60 rpm) -Head Position (3/4” wafer to platen edge) -Injection Location (pad center) -Conditioning (163 Micron diamond grit)

Design of Experiment

Slurry Transport Interrogation Region Wafer Post Examining; -Mean slurry age -Residence time -Slurry Gradients (flat pads) -Drag on wafer -fluid thickness measurements Pad

Repeatability Flat Pad Grooved Pad Manufacturer: Cabot Slurry Flow Rate: 35 cc/min Wafer Down Force: 4 psi Platen Speed: 60 rpm X-Y Groove Depth: 20 mils Time (sec) Percent New Slurry

Repeatability Flat Pad Grooved Pad Manufacturer: Rodel Slurry Flow Rate: 35 cc/min Wafer Down Force: 4 psi Platen Speed: 60 rpm X-Y Groove Depth: 20 mils Time (sec) Percent New Slurry

Slurry Flow Rate Flat Pad Grooved Pad Manufacturer: Rodel Slurry Flow Rate: x cc/min Wafer Down Force: 4 psi Platen Speed: 60 rpm X-Y Groove Depth: 20 mils Time (sec) Percent New Slurry

In Situ Conditioning Time (sec) Percent New Slurry Oscillation Period

Platen Speed Manufacturer: Freudenberg Slurry Flow Rate: 35 cc/min Wafer Down Force: 4 psi Platen Speed: x rpm X-Y Groove Depth: 20 mils Flat Pad Grooved Pad Time (sec) Percent New Slurry

Static Case Pad deformation: (4 psi, 0 rpm) Image of a single pad Thickness profile as determined by ratiometric technique

Pad Profile Rodel Pad

Radial Profile (static cases)

Static Fluid Thickness Measurements wafer PAD Trapped slurry Asperity? Surface tension?

Static Fluid Thickness Measurements

Friction Measurements

Cabot Pad 6 psi down force 35 cc/min 30 rpm platen speed 20 mils x-y groove depth Friction Data ~0.5 Hz Sine Wave Time (sec) Coefficient of Friction

Friction Measurements Down Force (psi) Friction Force (lbs)

Stribeck Curve Coefficient of Friction Sommerfield Number: (Viscosity*Linear Speed) / Pressure

Flow Regime Stribeck Curve

Polishing Rates for Crown Glass 3.0” Diameter wafer

Polishing Rates for BK7 3.5” Diameter wafer

Conclusion -Functional scaled down polishing platform Polishing data Slurry mixing measurements Slurry film thickness measurements Friction measurements -Beginning of DOE analysis Slurry mixing rates depend on: Platen speed Flow rate In situ conditioning

Future Directions -Optimize Struers Polishing performance -New DOE study on pad material properties -Scale results to an industrial polisher -Verify data on an IPEC 372 polisher -Correlate fluid mechanics to polishing performance

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