Company Profiles Establish: Year 2010 Business: Bluetooth Solution Provider Products: AES DKM-03A (BC03), AES DKM-04R (BC04) Market: Automotives (Car.

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Presentation transcript:

Company Profiles Establish: Year 2010 Business: Bluetooth Solution Provider Products: AES DKM-03A (BC03), AES DKM-04R (BC04) Market: Automotives (Car Kits & Car Audio) Usage: AES DKM-03A 10K / Month; DKM-04R 30K / Month Experience: Car Handsfree from 2001

Bluetooth Grounding 2.4 GHz Application Standard Platform by SIG Class 1: 100M Class 2: 10M Class 3: 1M Version: V1.2, 2.0, 2.0+EDR, 3.0, 4.0+HS Low Power consumption Profiles – HSP / HFP / A2DP / AVRCP / OPP / FTP & etc.

Bluetooth 1.0A (July 26, 1999) Bluetooth 1.0B (December 1, 1999) Suffered from a number of interoperability and anonymity problems. Bluetooth 1.1 (Feb 22, 2001) Improved robustness. Support for non-encrypted channels. Received Signal Strength Indicator (RSSI). History of Bluetooth

Bluetooth 1.2 (Nov 5, 2003) Adaptive Frequency-Hopping (AFH) to avoid interference Add Fast Connections (typical = 100 ms) Extended Synchronous Connections Oriented links (eSCO) improved voice quality of audio connections. 50 million Bluetooth chips shipped

Bluetooth EDR (Nov 4, 2004) Enhanced Data Rates (EDR) bringing user data transfer rates of up to 2.1 Mbit/s. Reduced power consumption million Bluetooth chips shipped Bluetooth EDR (July 26, 2007) Specification improvements and feature enhancements Extended Inquiry Response Secure Simple Pairing 2008 – 1 billion Bluetooth chips shipped

Bluetooth HS (April 21, 2009) Use of b/g radio for High Speed data transferusing Bluetooth profiles Data rate 24Mbps for data; Approximately 8 times faster than EDR if no SCO connection active 12Mbps with SCO (for voice); Approximately 4 times faster than EDR if SCO connectionactive Enhanced Power Control Bluetooth 4.0 (Dec 17, 2009) Bluetooth Low Energy controller Bluetooth 4.0 (Jun 30, 2010) Bluetooth Low Energy Host

Profiles Headset A2DP AVRCP Handsfree Mobiles Headset A2DP Handsfree BT Headset BT CAR Audio

Solutions Distribution

Applications - Audio

Applications – Automotives

Features Required Handsfree Profile A2DP Profile Acceptable Echo Cancellation Acceptable Full Duplex Speaking AVRCP Profile OPP Phone Book Transfers Caller ID + Redial

Car MCU 8 to 16 Bit BC03 / BC05 RF Codec Echo Handling 7 Layer SW 8M Flash (Application + PS Key + CVC) UART I/O AES DKM-03A / AES DKM-05A (BC03 / BC05) Modules Sales to Market: ~USD5.50 to USD5.80 Current Solution Block Diagram

AES DKM-04R

4 Layer Software Handling RF UART I/O Competitive Edge: Price: USD2.3 / PC Applications: Car Audio CD/DVD usage: K Car Codec: Sunplus 8104GB / 8202GB PSKey + CVC ARM 9 Upper 4Layer Software Codec

CarKit Application Main Stream: BC03 / BC05 (CVC) Less Demand in Fortemedia High competition on Cost TTS is up coming concern but not a “Must”

Automotive SCE Multimedia 東和 Wiwi Industrial 威威 SZ Roadrover 路暢 KRS Hotwell 好威 Best Glory 華泰 Eagle SoundingSunplus 凌揚 Team Force 聯科 Anson High 安信 Eastern Partner 運高 Desay Automotive 德賽汽車電子 Foryou 華陽 Kings Electronics 佳富 Autosound 永合 Soundmax 三馬 FREEWAY 天緣 KAJIWAH 嘉之華 HI-SAN 高成 BOSEN 寶新 歐華 SOLING 索凌 嘉維桑德 SKYPINE 天派 PEIYING 培英 Major Customers

Audio Compress DigitalAlcoNelsonLeaderway SONPRE 亞冠 PlastoformArtsTunbow 3NOD 三諾 Alford Potential Customers Others PrimatronixAvantecQualimanLoyal CCACaron AutosoundSZ Dbole Tech

Roadmap 2011 BT3.0 / 4.0 HS

WE APPRECIATE PARTNERSHIP WE RESPECT EFFORT WE CREATE WIN-WIN