Salem Cherenet, Kyle Jacobs, Keng Hsu, Nicholas Fang Department of Mechanical Engineering, College of Engineering, University of Illinois at Urbana-Champaign.

Slides:



Advertisements
Similar presentations
Electroplate used to make nanostructures Can the cathode plate be insulator? Electroplate System: Can the cathode plate be coated with some conductive.
Advertisements

Display Systems and photosensors (Part 2)
Microscale Device Fabrication: Electrochemical Deposition (EMD) of Metals By Mahmoud Hayat and Cerise McLaren.
MetalMUMPs Process Flow
Design and Simulation of a MEMS Piezoelectric Micropump Alarbi Elhashmi, Salah Al-Zghoul, Advisor: Prof. Xingguo Xiong Department of Biomedical Engineering,
ECE/ChE 4752: Microelectronics Processing Laboratory
INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #6.
Carbon Nanotube Electronics
SYNTHESIS OF COPPER NANOWIRES WITH NANO- TWIN SUBSTRUCTURES 1 Joon-Bok Lee 2 Dr. Bongyoung I. Yoo 2 Dr. Nosang V. Myung 1 Department of Chemical Engineering,
Dr. Mansour Al Hoshan TiO 2 Nanotubes Arrays fabricated by anodizing process.
Sample Devices for NAIL Thermal Imaging and Nanowire Projects Design and Fabrication Mead Mišić Selim Ünlü.
SOIMUMPs Process Flow Keith Miller Foundry Process Engineer.
INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #5.
ECE 424 – Introduction to VLSI Design Emre Yengel Department of Electrical and Communication Engineering Fall 2012.
Thin Film Deposition Prof. Dr. Ir. Djoko Hartanto MSc
MEMs Fabrication Alek Mintz 22 April 2015 Abstract
1 ME 381R Fall 2003 Micro-Nano Scale Thermal-Fluid Science and Technology Lecture 18: Introduction to MEMS Dr. Li Shi Department of Mechanical Engineering.
INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #7. Etching  Introduction  Etching  Wet Etching  Dry Etching  Plasma Etching  Wet vs. Dry Etching  Physical.
In Technology Size Does Matter In the world of Microchip design and fabrication the industry is constantly pushing for smaller, more viable structures.
Plasma Etch and the MATEC Plasma Etcher Simulation
Microfluidics: Catalytic Pumping Systems Paul Longwell Hollidaysburg Area High School Summer 2005.
NANOFABRICATION -3 NOVEL PROCESSES EEE5425 Introduction to Nanotechnology1.
Strands of DNA have been used as tiny scaffolds to create superconducting nanodevices that demonstrate a new quantum interference phenomenon. These nanowire.
INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #2. Chip Fabrication  Silicon Ingots  Wafers  Chip Fabrication Steps (FEOL, BEOL)  Processing Categories 
Bidirectional field-flow particle separation method in a dielectrophoretic chip with 3D electrodes Date : 2012/12/24 Name : Po Yuna Cheng( 鄭博元 ) Teacher.
Review- 7th. Rules 1 right answer= 1 candy If you do not like the candy, hold onto it until the end of the class to replace it If you did not have the.
Nano/Micro Electro-Mechanical Systems (N/MEMS) Osama O. Awadelkarim Jefferson Science Fellow and Science Advisor U. S. Department of State & Professor.
Dilbert. Next steps in the antenna fabrication process Create a dielectric surface. The antenna must sit on a dielectric or insulating surface,
Gas-to Solid Processing surface Heat Treating Carburizing is a surface heat treating process in which the carbon content of the surface of.
SEMINAR ON IC FABRICATION MD.ASLAM ADM NO:05-125,ETC/2008.
I.C. Technology Processing Course Trinity College Dublin.
Biotechnology Introduction Gel Electrophoresis. Method of analyzing DNA Allows a researcher to determine how alike or different two samples of DNA are.
Techniques for Synthesis of Nano-materials
Chapter 20 Electrochemistry and Oxidation-Reduction.
Ch 24 pages Lecture 10 – Ultracentrifugation/Sedimentation.
INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #4. Ion Implantation  Introduction  Ion Implantation Process  Advantages Compared to Diffusion  Disadvantages.
Presentation Outline February 25 th 20112Microfabrication Design Challenge 2011.
POSTER TEMPLATE BY: Fabrication of Nanobiosensors Tom Fitzgerald, Nathan Howell, Brian Maloney Oregon State University, Department.
Top Down Manufacturing
Top Down Method Etch Processes
Fabrication of Suspended Nanowire Structures Jason Mast & Xuan Gao
REDUCING SCALE DEPOSITION BY PHYSICAL TREATMENT Sungmin Youn and Professor X. Si, Calvin College REDUCING SCALE DEPOSITION BY PHYSICAL TREATMENT Sungmin.
CORPORATE INSTITUTE OF SCIENCE & TECHNOLOGY, BHOPAL DEPARTMENT OF ELECTRONICS & COMMUNICATIONS NMOS FABRICATION PROCESS - PROF. RAKESH K. JHA.
Motivation There has been increasing interest in the fabrication and characterization of 1D magnetic nanostructures because of their potential applications.
Substitute beer and pizza?. Basic Silicon Solar Cell as fabricated in Cameron With Schematic.
Etching: Wet and Dry Physical or Chemical.
Warm-up Describe what occurs before and during an ionic bond. If the bond is broken what happens to the atoms? Describe what occurs before and during a.
Gas sensing Panca Mudji Rahardjo, ST.MT Electrical Engineering - UB.
Molecular and Electronic Devices Based on Novel One-Dimensional Nanopore Arrays NSF NIRT Grant# PIs: Zhi Chen 1, Bruce J. Hinds 1, Vijay Singh.
Side ViewTop View Beginning from a silicon wafer.
1 An Electrostatic Theory of How Roots are Attracted to Water Part 1- Roots Attraction to Water Drops Part 2- Roots Attraction to Water Vapor Arde Ramthun,
© 2012 Anwendungszentrum GmbH Oberpfaffenhofen Idea by: Dr. Eng. Mohamed Zayan | 1.
Electrolysis 2 Types of electrochemistry 1. Battery or Voltaic Cell – Purpose? 2. Electrolysis - forces a current through a cell to produce a chemical.
Soldering Brazing.
Dilbert.
Microfabrication Home exercise 1
Etching Processes for Microsystems Fabrication
Nanowire Fabrication Based on Porous Alumina Template
Rapid Tooling.
EXPERIMENTAL PROCEDURE EXPERIMENTAL PROCEDURE
PVD & CVD Process Mr. Sonaji V. Gayakwad Asst. professor
VISTA work in Ulm since Jan. 2002
VLSI System Design LEC3.1 CMOS FABRICATION REVIEW
Luís Filipe Martinsª, Fernando Netoª,b. 
31/08/ GaAs and 5629 GaAs growth 5622 GaAs,
19.7 Magnetic Fields – Long Straight Wire
Tong Zuo, Xiaoliang Li, Soumil Shah, Advisor: Prof. Xingguo Xiong
Memscap - A publicly traded MEMS company
2. SEM images of different SiNW structures 3.Results and discussion
Presentation transcript:

Salem Cherenet, Kyle Jacobs, Keng Hsu, Nicholas Fang Department of Mechanical Engineering, College of Engineering, University of Illinois at Urbana-Champaign Acknowledgments I would like to thank Kyle Jacobs for being my graduate mentor, Keng Hsu, and Nicholas Fang for advising me. Special thanks to Shell Co. and ISUR program for sponsoring my research. Recommendations If this system works as predicted, then some more parameters could be added to make it more efficient and accurate. One of the things one can do is to implement a robotic arm to control the motion of the magnetic bar by tracking the position of the alumina film instead of doing it manually. Another thing I recommend is incorporating a tracking system for the film since it is hard to see where it is in the buffer and/or acetone solution visually. Objective The main purpose of this research is to create a system that is capable of: 1)Changing the buffer solution with acetone solution 2)Effectively deposit the PMMA free template onto the silicon wafer 3)Perform multiple deposition at once Introduction Silicon Nanowire (SiNWs) fabrication can be achieved through several different techniques including vapor- liquid-solid mechanism (VLS), deep reactive ion etching (DRIE), metal-assisted chemical wet etching and more. However, each method separately fails to either restrict the growth of the nanowires in only one direction (axial) or have a diameter less than 100 nm with big separation between each ‘hole’. One of the ways to resolve these issues are using a process called chemical wet etching where metallic chromium/gold nanodots were first deposited onto the silicon wafer using anodic aluminium oxide template and eventually chemical wet etching is carried out in a hydrogen peroxide and deionized water. In previous experiments, using this method, it was showed that the silicon nanowires can be precisely controlled to a precision of 10 nm in the range of 40 to 80 nm that is uniform and well aligned. One of the biggest issues we face in this fabrication process is during the transfer of the anodic aluminium oxide template onto the silicon wafer. The aluminium oxide is a very thin film so to prevent it from falling apart, we support it with PMMA and let it sit in a buffer solution. The last step before depositing the template is transferring it from the buffer solution to an acetone solution to remove the PMMA. After this step is completed, we deposit the “PMMA free” template onto the silicon wafer. However, we do not have a good way of executing the last two steps, which is causing in poor final result. Method The first step is design. Having all the requirements in mind a simple sketch of the system was made. Once a simple concept was achieved, it was translated to a 3D sketch. The picture above shows a snap shot of the 3D sketch of the alumina (aluminum oxide) transferring system. The two tubes labeled ‘’A” and “B” are used for transferring a solution in and out respectively. The silicon wafer will be hold in the I–beam structure shown below. Methods Continued The cubes at the base of the rectangle are there to restrict the motion of the I-beam in a predictable manner for the purpose of simplicity. The motion is of the I-beam is controlled by a magnetic force attraction between the ‘’magnetic tip” (shown in Figure 3) and the magnetic bar shown in Figure 4. Results A simulation of the Alumina Transfer system was made to analyze what kind of motion it could have. The I-beam moved in the straight line following the position of the ‘magnetic bar.’ However, in some situations where the bar magnet position was changed rapidly the I-beam could not keep up and as a result falls sideways as shown in Figure 5 below. Results Continued According to several of experiments we run, the alumina floated on the buffer solution but it sank in the acetone solution. This makes sense since acetone is less dense than the buffer solution. The other result we got was that it takes about a minute to have more than 90% of acetone concentration if we remove the buffer solution in our cube while adding acetone at the same time with the same flow rate. Finally, the instability of the I-rod was no longer there on the actual prototype. Figure 5: I-beam on its side during simulation Photo by Salem C Figure 2: Structure for carrying the silicon wafer. Photo by Salem C. Figure 3: Magnetic Tip for motion control Photo by Salem C Figure 1: Alumina Transfer System-ATS Top view Photo by Salem C Silicon NanoWire (SiNW) Fabrication: Alumina Transfer System A B Magnetic tip I-beam Figure 4: Alumina Transfer System-ATS Side View Photo by Salem C Magnetic Bar