 Computer enthusiasts often push their system’s performance to its limits. Exceeding default settings causes excessive heat buildup, which may cause components to fail.

 A lack or malfunction of proper cooling may cause permanent damage to computer components. A powerful and reliable solution is needed to meet the demands of the high end user community.

 Articles  Patents  Solutions

 Article Summary: › The article lists five major components of liquid cooling a computer, as well as an introduction to the concept and references to alternatives to liquid cooling a computer. The five major components of liquid cooling a computer are broken down into heat sinks, parts, pumps and radiator, reservoirs and tubing, and coolant liquid.  Article Critique: › The article was written very well and the author cited their sources very well. The article covered the concept well, but could have gone into more specifics, especially with materials and methods. The article was helpful, and the sources cited may prove to be useful in later stages of the project.  Attack Path: › Technical  Article in APA Citation format: › Wilson, T. (n.d.). How liquid-cooled pcs work. Retrieved from

 Article Summary: › A custom computer company, Puget Systems, built a computer that was submerged in mineral oil as its primary cooling system. The article provides performance data and the company’s justification for constructing the project. It was formatted much like a lab report would be formatted; there was an intro with their thesis of what they predicted would happen followed by their procedures and performance result. A conclusion was written that accounted for any externalities that could have affected the project and what they would have done differently.  Article Critique: › The article provided useful information regarding the performance of the system. It provided pictures which helped explain many of the concepts, and prove its legitimacy. Good primary source document.  Attack Path: › Technical  Article in APA Citation format: › Bach, J. (2007, May 7). Mineral oil cooled pc.Retrieved from

 Patent:  Filed: October 28, 1992  Awarded May 4, 1993  Inventor: Mark S. Tray  Assignee: Compaq Computer Corporation  Houston, TX  Purpose: Isolates fan vibration from case and  other components.

 Patent:  Filed: June 3, 2000  Awarded: July 3, 2010  Inventors: Daryl J. Nelson; Steve J. Loflnad; Eric J. Salskov  Assignee: Intel Corporation  Purpose: Draw in cool air from outside to cool a component.

 Patent:  Filed: Jul 10, 1992  Awarded: Jun 8, 1993  Inventors: Duy Q. Huynh; Prabhakara R. Vadapalli  Assignee: International Business Machines Corporation  Armonk, N.Y.  Purpose: Arrange the computer component layout so that  air can easily travel from front to back while using  a minimal amount of fans

 Pros › Extremely effective › Aesthetics  Cons › Inefficient › Moving parts › Fluid needs to be replaced › Expensive

 Pros › Silent › No electricity required  Cons › Can’t cool demanding hardware › Large size

 Pros › Alarm to alert critical temperature › Support about 5 fans  Cons › Do not control pumps › Use 5.25” bays or PCI slots

 Must and Nice to Have  Sketched Solutions  Decision Analysis  Specifications

MUST HAVESNICE TO HAVE  Keep components at low temperature  Minimal power consumption  Quiet operation  Competitive with current market price  Simple assembly/installation  Lightweight  Small  No potentially dangerous leaks  No regular input cost  Aesthetically Pleasing

 HPN

 HSCH Heat Sink

 LGHPHSH

Customer RequirementsDesign Solution Feature Maximum noise level of 35 dB Silent heat sink Maximum CPU heat level of 60° Celsius Large surface area to dissipate thermal energy Low maintenanceOptional use of tap water and cheaply available dry ice. Consumer price below $65Simple design for ease of manufacture Low power consumptionPassive heat sink that doesn’t use electricity Good looking design for show Physical design is aesthetically pleasing

 Fourier’s Law  Materials

 q = k A dT / s › q = quantity of heat (energy) (watts) › k = Thermal conductivity (W/m.K or W/m o C, Btu/(hr o F ft)) › A = Heat transfer area (m 2, ft 2 ) › dT = Difference in temperature (K or o C, o F) › s = Material thickness (m, ft) Conductive Heat Transfer

 Aluminum › 44 Btu/(hr o F ft 2 /ft) › Melting temperature 1220˚C  Copper-Brass › 64 Btu/(hr o F ft 2 /ft) › Melting temperature 1083˚C  Steel › Various grades of steel produce different results