Aerosol Jet® Printing of A Silver Epoxy Conductive Adhesive for High Density Applications Kurt Christenson and Michael Renn - Optomec, Inc. Donald Giroux - Resin Designs, LLC Daniel Blazej - Assembly Answers, LLC IMAPS New England Symposium Boxborough, MA May 8, 2012

IMAPS New England Symposium Who Are The Players? Optomec - Equipment Company Based In Albuquerque, NM Focused On Additive Manufacturing LENS (Laser Engineered Net Shaping) 3D Printer Aerosol Jet® Printer Resin Designs - Adhesives Company In Woburn, MA Producing Custom Formulations For Many Electronic and Industrial Applications Assembly Answers - Manufacturers Representative Providing Sales and Marketing Services For Resin Designs May 8, 2012 IMAPS New England Symposium

Drivers for Collaboration Identified Needs For Conductive Adhesive That Can Be: Dispensed In Small Volumes, Creating Dots 0.001” - 0.002” In Diameter For Small Components and Thin Bond Lines Dispensed In Recessed Areas And On Different Height Substrates With Non-Contact Nozzle, Standoff Up To 1 cm Used For Bonding Small Devices Requiring High Electrical and Thermal Conductivity Push “Pixel Density” from ~100 DPI To ~1000 DPI And From 2D to 3D May 8, 2012 IMAPS New England Symposium

Optomec Aerosol Jet Technology Material Aerosolized and Mixed With Carrier Gas In Atomizer Aerosol Concentrated In Virtual Impactor And Excess Gas Removed Material Stream Exits At Deposition Head And Patterns Created With Shutter (Not Shown) May 8, 2012 IMAPS New England Symposium

Aerosol Jet Process Movie Video May Also Be Seen Here May 8, 2012 IMAPS New England Symposium

Aerosol Jet Is Not Ink Jet! May 8, 2012 IMAPS New England Symposium

Unique Dispense Technology Needs Unique Adhesive Technology Silver Particles Need To Be Nanometer Sized Conventional Die Attach Adhesives Use Multimicrometer Sized Particles Silver And Resins Must Maintain Homogeneous Distribution In Micrometer Sized Droplets Resins Must Be Stable For Processing And Long Work Life Conventional Silver Paste Particle Size Distribution Before and After Aerosol Jet Deposition May 8, 2012 IMAPS New England Symposium

Development Challenges Epoxy System Selected As Core Adhesive Critical Modifications Made Over Course Of Project Separation Of Silver and Resin In Aerosol An Early Stumbling Block Overcome With Modifications To Both Silver and Resin Important To Understand How Aerosol Is Created And Maintained Maintaining Stoichiometry of Resin and Hardener In Aerosol Is Critical For Optimum Properties May 8, 2012 IMAPS New England Symposium

Aerosolizing Adhesive! Collison Nebulizer Creates Aerosol Carrier Gas @ 20 PSI Aspirates Liquid Suspension of Silver and Resins Spray Is Directed Onto Wall of Jar Small Drops Recoil, Producing Aerosol That Exits Through Outlet Tube Silver Adhesive System Designed To Stay Intact Through This Process Choice Of Solvent Is Critical May 8, 2012 IMAPS New England Symposium

IMAPS New England Symposium Printing Adhesive Test Pattern Is 10 x 10 Array Of 10 mil (250 µm) Squares Thickness Range Is 10 - 30 µm Built Up From Individual Drops <5 µm In Diameter Cross Section Is Isosceles Trapezoid Not: May 8, 2012 IMAPS New England Symposium

Producing A Single Square Click On Each Picture To See Video (May Not Show On All Systems) May 8, 2012 IMAPS New England Symposium

Process / Handling Characteristics High Velocity Jet (100 m/sec) Precisely Places Adhesive Solvent Removal Facilitated With Heated Substrate At 60°C Cure 60 Minutes @ 150° Work Life > 1 Week Store 6 Months @ -10°C May 8, 2012 IMAPS New England Symposium

Electrical Properties Five Line Patterns On Alumina Substrate Line Width = 130 µm, Height = 15 µm Cured 60 Minutes @ 150°C Linear Response, Resistivity = 5 x 10-5 Ω-cm May 8, 2012 IMAPS New England Symposium

Adhesion Properties Lap Shear Between Aluminum Plates Is 2000 PSI Die Shear Of 15 Mil Tabs On Gold Is 3000 PSI Cohesive Failure In All Cases Comparable To Standard Die Attach Epoxies Meets MIL-STD-883, Method 2019 Requirement of 882 PSI Tg ~ 100°C 15 mil Square Kovar Tab On Needle Dispensed Nanoparticle Silver Epoxy May 8, 2012 IMAPS New England Symposium

IMAPS New England Symposium Technical Status Basic Formulations Established For Aerosol Jet and Narrow Gauge Needle Dispense Minor Modifications For Handling Optimization May Occur Additional Characterization In Process Thermal Conductivity Expecting High Value Based On High Silver Content Storage Modulus Ionic Content Outgassing CTE Work and Storage Life May 8, 2012 IMAPS New England Symposium

IMAPS New England Symposium Summary New Conductive Adhesive Material Developed For Use With Novel, Non-Contact Dispense Technology Significant Benefits Realized In Creating Small Features With Laser-Like Control On Varying Height Surfaces Unique Adhesive Characterized By High Loading Of Nanoparticle Silver In Epoxy Resin Optomec Aerosol Jet Systems Are Commercially Available Applications Lab In Minnesota For Customer Support Resin Designs Nanoparticle Silver Epoxies Available For Sampling Aerosol Jet Narrow Gauge Needle May 8, 2012 IMAPS New England Symposium

Company Links and E-Mail Resin Designs, LLC: www.resindesigns.com Don Giroux: dongiroux@resindesigns.com Optomec, Inc.: www.optomec.com Kurt Christenson: kchristenson@optomec.com Mike Renn: mrenn@optomec.com Assembly Answers, LLC: www.assemblyanswers.com Dan Blazej: daniel.blazej@assemblyanswers.com May 8, 2012 IMAPS New England Symposium