Section I: Motivation and introduction The technological foundations of most high-tech industries are based primarily on the development/creation and utilization.

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Presentation transcript:

Section I: Motivation and introduction The technological foundations of most high-tech industries are based primarily on the development/creation and utilization of different kinds of thin films: deposition and patterning.

Outline of the course Basic thermostat and vacuum tech sources deposition morphology

Example: Cross section of a computer chip

Magnetic storage ---towards terabits/in 2 C. Ross, Annu. Rev. Mater. Res : Three strategies: exchange-decoupled grains (conventional) In-plane patterned media Perpendicular patterned media

11 “Photonic bandgap: woodpile structure” (Professor S. Lin, RPI)

MRS: Colvin, MRS Bulletin August, 2001, page 637

Optical switches: MEMS---mirror switches: D. Bishop et al, Physics Today Oct 2001 (Lucent) MEMS

Solid state laser:

Cleland (2003) Industrial Physics (2002) Mini-machnines (Micromechanical systems): actuator, resonator, valve, damper, motor…. Wu (2002) Micro-mirror arrays--Lucent (2001) microns

Physical vapor deposition: thermal evaporation, e-beam evaporation, sputter deposition, laser ablation, ion beam deposition thickness monitor pump substrate source vapor Base pressure --vacuum seal, outgasing, contamination, pumps Deposition rate (nm/s) --source T, vapor pressure, impinging rate Film structure --morphology, crystal orientation, substrate T, uniformity

Chemical vapor deposition: thermal CVD, atomic layer deposition Ar H2H2 Pump Ar precursor Substrate Heater Pressure, T (source and substrate), flow rate, deposition rate, pulse duration, film properties Pd 2+ O OC C HC CF O O OC C CH CF 3 3 O -

Solution based deposition: electrochemical deposition (ECD), Electroless deposition (ELD) Cu 2+ (EDTA) SO 4 2- OH - wafer glyoxylic acid - + Cu 2+ e-e- SO 4 2- H+H+ Cl - wafer anode electrochemical deposition Electroless deposition (HO 2 CCH 2 ) 2 NCH 2 CH 2 N(CH 2 CO 2 H) 2 Room T T~70 o

Home work. 1. (Deadline: Sept 7, 8am) Describe briefly five different devices or structures (with figures or drawing) that require extensive thin film coating work. (One page per device.)