VTS Sputter Roll Coater

VTS’s Sputter Roll Coater Introduction VTS’s Web/Roll Systems for the Converting Industry are individually designed to meet each customer’s specific requirements. The system presented in this brochure allows the user to develop a process using state-of-the-art components and then go into production. VTS’s multi-process high vacuum Web/Roll Coating system is designed to coat Polyimide Film, Mylar, foil and other thin plastic or metallic materials stored in continuous roll form. Typical process stations within the high vacuum chamber can include sputter sources, electron beam guns, thermal sources, substrate heat, ion beam sources and Plasma Process Bar.

AWC-550 Sputter Roll Coater Product Information Technology By AWC-550, metals will be deposited to one side of the film to form a multi- layer at high rate. Ion beam source is equipped with gas inlet system for argon and reactive gases. Equipment Technique Multi-Chamber-System consisting of chambers for winding, pretreatment, coating, intermediate pumping One coating drum to cool the film during the coating process Cooling/heating equipment for coating drum Pump equipment for short pump down with turbomolecular pumps Pre-treatment by Ion beam source Up to four standard DC magnetrons for metallic sputter processes Electronically controlled winding system with 3 driving motors Technical Data Substrate Material Plastic film (PET, PI, etc.) Roll diameter max. 380mm Width up to 550 mm Thickness 25㎛ to 200㎛ Film Speed 0.1 to 5 M/min

Linear Ion Beam Source Product Information VTS’s Linear Ion Beam Source Features / Benefits No Filaments or Grids Truly production Worthy-low maintenance, no consumables, low cost Reactive gas compatible - I.e.100% oxygen Low temperature Operates at Magnetron Pressures(0.1-5mTorr) Size Free No need for multiple power supplies-hence easy integration High Energy High Current Density Stability of Beam Uniformity Current Density Distribution Profile

DC magnetrons Sputter Source Product Information VTS’s Linear Sputter Source Features / Benefits Truly production Worthy-low maintenance, no consumables, low cost Low temperature Operates at Magnetron Pressures(0.8- 5mTorr) Size Free High Power compatible High Deposition Rate Stability of Coating Uniformity ㎛/min Power vs Deposition Rate Å Position vs Deposition Profile

PI film Electro- Plating Patterning VTS’s Technical Data for FCCL Fine Pitch Polyimide Film Copper PI film Tie layer Deposition Pretreatment Electro- Plating Patterning Web coating PRODUCTION PROCESS OF FCCL

VTS’s Technical Data for FCCL Surface Modification of Polyimide film by ATEC’s Linear Ion Beam Source Wetting angle of polyimide with various Doses by irradiated at ions Surface energy of polyimide with various Doses by irradiated at ions

VTS’s Technical Data for FCCL Surface Modification of Polyimide by ATEC’s Linear Ion Beam Source Low Current Density High Current Density Wetting angle of polyimide with different ion current by irradiated at ions Adhesion strength with different gases by irradiated at ions

VTS’s Technical Data for FCCL XPS Data of modified polyimide film by Ion Beam Source Schematic drawing of the polymeric repeat unit of PMDAODA. Binding Energy (eV) XPS spectra of O 1s, N 1s, and C 1s from as-received PMDA-ODA polyimide after peak deconvolution Binding Energy (eV) XPS spectra of O 1s, N 1s, and C 1s from PMDA-ODA polyimide after irradiation by linear ion beam source.

VTS’s Technical Data for FCCL SAM Data of modified polyimide film by Ion Beam Source By Gas A Raw Film By Gas A + C By Gas C

VTS’s Technical Data for FCCL Surface Modification of Polyimide film by Ion Source Peel strength with various doses by irradiated at ions Peel strength with various doses by irradiated at ions

VTS’s Technical Data for FCCL Curing Test (150℃, 168h) Cu Thickness vs Peel Strength ㎏f/㎝ ㎛ 2 4 6 8 10 12 14 16 18 20 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Peel Strength ( ) Cu Thickness ( ) Peel strength with various doses by irradiated at ions

VTS’s Technical Data for FCCL Chemical Test Test Condition Sample Width : 3 ㎜ Sample Position : MD C PI Thickness : 38 ㎛ Cu Thickness : 9 ㎛ Peeling mode : vertical(90˚) Peeling Speed : 50 ㎜ / min Mean : 0.80 kgf/cm 원자재 표면 Normal Temperature Mean : 0. 78 kgf/cm Mean : 0.79 kgf/cm HCL Test By Gas C By Gas A + C KOH Test

Conclusion VTS’s Web/Roll Systems : State-of-the-art Equipment VTS’s Linear Ion Beam Source : High Current Density Stability of Beam Uniformity Size Free VTS’s Linear DC Magnetron Sputter Source : High Deposition Rate Stability of Coating Uniformity Surface Modification of Pl by Gas C Ion : High Surface Energy Fast Surface Modification High Peel Strength Ion Source of High Current Density : High Surface Energy Curing Test : 0.32 kgf/㎝ Chemical Test : 0.78 kgf/㎝ 원자재 표면 By Gas A By Gas A + C By Gas C