System Test Status Report R. D’Alessandro 1 TIB System Test Report Where were we ….., Mechanics (layer 3 prototype) Mother Cable & Interconnect Board System Test Setup (TIB) Results from the TIB System Test

System Test Status Report R. D’Alessandro 2 TIB system test (July 2002) Not only for PS but “evolving” into a fully fledged mechanical and electrical test –NEEDS optical decoupling to achieve meaningful results At first we needed a relatively good understanding of an optical system compared to a copper one: –Many measurements made, we gained full confidence. –Thanks to Roberto Cecchi for TIST.

System Test Status Report R. D’Alessandro 3 La bara CCU25 DOH Power distribution PCB

System Test Status Report R. D’Alessandro 4 Input/Output temporary connections on the back of module carrier Final Kapton cable could be even shorter than this one Short distance APV-AOH Brico & Flexibility

System Test Status Report R. D’Alessandro 5Mechanics Prepared by Pisa Layer 3 mock-up Up to 4 cooling loops (12 modules) Final dimensions

System Test Status Report R. D’Alessandro 6 Mother Cable (1)

System Test Status Report R. D’Alessandro 7 Mother cable (2)

System Test Status Report R. D’Alessandro 8 Interconnect board Connects up to 4 MC Redundancy implemented Distributes also LV and HV Jumper disable of Hard Reset

System Test Status Report R. D’Alessandro 9 What went on the mechanical structure 3 modules: 180, 168, 177 (14 APV25) 3 Analog OptoHybrids (3 fibres each) 50 Ohms termination (100 Ohms in the future) 1 CCU25 + DOH + Interconnect Board Mother Cable with slight mods. Power: Caen (counting room) prototype 150 m cable LIC (100m Outer + 50m Inner) 40 uF TOTAL LOAD CAPACITORS! Battery for the control loop (5V for the DOH)

System Test Status Report R. D’Alessandro 10Cables

System Test Status Report R. D’Alessandro 11 CCU25 AOH Fibre SPAGHETTI! Cooling loops DLink 3Modules (complete MC)

System Test Status Report R. D’Alessandro 12Results Bias = 200 V on 3 modules simultaneously <1 microA total for the 3 modules HV test with 1 module to 300V, on MC without modules to 450V Able to read out pedestals and noise on all 3 modules at the same time Calibration one module at a time

System Test Status Report R. D’Alessandro 13Pedestals deconv peak Strip no. ADC value

System Test Status Report R. D’Alessandro 14 Common mode noise Module 180 Module V bias non-inv, peak ADC channels

System Test Status Report R. D’Alessandro 15 50nF cap 22k  Bias line Analog opto hybrid TIB System test in Florence

System Test Status Report R. D’Alessandro 16 New TIB hybrid layout (Dec v11) Bias ring DCU input From J.D. Berst

System Test Status Report R. D’Alessandro 17 First and last strip  ~12 ADC counts Unbonded strips 2 noisy neighbours TIB HV 300V on ARC Peak-Inverter on

System Test Status Report R. D’Alessandro 18 Edge effect reduced Furthermore only one strip is now affected …also the common mode is reduced Same module but with 50nF capacitor to ground

System Test Status Report R. D’Alessandro 19 Same module on sys-test Module 180 without cap Module 177 with cap Peak mode

System Test Status Report R. D’Alessandro 20 Signal shapes ADC value ns

System Test Status Report R. D’Alessandro 21 Noise distribution (1) Peak mode Noise very low CMN is lower still S/N ratio Peak ~ 65 Ical=80! ADC channels

System Test Status Report R. D’Alessandro 22 Noise distribution (2) Deconv mode S/N ratio Deconv ~ 52 Ical=80! ADC channels

System Test Status Report R. D’Alessandro 23 LV behaviour HARD RES (14 APVs + 9 Lasers)  V=280 mV 2.5V 200 mV/div 200 us/div 10 mV/div 20 us/div Noise on 2.5V line

System Test Status Report R. D’Alessandro 24Conclusions So far we have witnessed an excellent behaviour of the system. Mother Cable is very well thought out, signals are clean, voltage drops negligeable. (Thanks to Giuseppe De Robertis) The interconnect board has delivered at first go. (Thanks to Roberto Ciaranfi) This Pisa-Florence common endeavour is getting along fine (incredible though this might seem)

System Test Status Report R. D’Alessandro 25Future Need to go to 4 strings (12 modules) –MC are being loaded with components Test redundancy (2 nd DOH and CCU25s from CERN) AOHs will be modified (100 Ohms) We have started Xdaq migration. This mock-up will be upgraded, while a new one is under construction ready for the next MC type. New MC being designed (final version …) DOM (DOH carrier) design underway

System Test Status Report R. D’Alessandro 26 Interconnect Board (redundancy is implemented)