Via Filling Machine DP-HF Model V1.0 Circuit Automation, Inc. Phone © CAI April 27, 2008
Why via filling? Allows the size of PCB to shrink Creates more space on the surface Allows via-in-pad technology Built up multilayer's with stacked vias
Commercially Available Materials Peters PP 2794 PP 2795 Sanei Kaguku (PHP-900 series) Taiyo THP-100DX1 VF DuPont CB100 Preferred Paste thickness is in the 450 centipoises range.
DP-HF Features No Viton Seals Single Chamber filling Self Aligning Print head Vacuum system for blind vias Unique application head reduces waste Waste collection system Fill entire panel
24” X 30” 610 X762mm Max Size Auto Loader Touch Screen Vacuum Chamber
Filled Via Holes
DP-HF Process Appropriate size Fill Head is installed. Panel is loaded into clamp Panel is transported into machine Start and Stop Fill positions are chosen for first panel or stored recipe is selected. Filling parameters are chosen. Panel is filled. Panel is transported to load section. Panel is removed
New Ink Pump
New Direct Inject Head
Head for 18’ (454mm) Panel Seal Adjusters Adjustment Feedback 17.6 filling area 447mm)
Non Viton fill head
Micro-Adjust Fill Head
Panel Load/Unload Door
Heavy Duty Strong Clamp
Waste Collection System
New Whisper Drive System 4 lead screw Belt driven, extra smooth transfer fill rate
Large Capacity Vacuum Pump 7.4 hp 177cfm pump
Manual Control Screen
MMI Screens
High Performance 2 nd Generation Contact Circuit Automation 5292 System Drive Huntington Beach, CA ph fax