Ingrid-Maria Gregor (University Wuppertal) for the ATLAS collaboration June 6th, 2000 Optical Links for the ATLAS SCT and Pixel Detector International.

Slides:



Advertisements
Similar presentations
Laser characterization and modelling for the development of the Super LHC versatile transceiver Sergio Rui Silva Marie Curie Fellow PH-ESE-BE CERN.
Advertisements

The ATLAS Pixel Detector
Token Bit Manager for the CMS Pixel Readout
The ATLAS Pixel Detector - Introduction -
IEEE10/NSS R. Kass N A. Adair, W. Fernando, K.K. Gan, H.P. Kagan, R.D. Kass, H. Merritt, J. Moore, A. Nagarkar, S. Smith, M. Strang The Ohio State.
May 14, 2015Pavel Řezníček, IPNP Charles University, Prague1 Tests of ATLAS strip detector modules: beam, source, G4 simulations.
Richard Kass IEEE NSS 11/14/ Richard Kass Radiation-Hard ASICs for Optical Data Transmission in the ATLAS Pixel Detector K.E. Arms, K.K. Gan, M.
Fast Detector Readout T. Flick University Wuppertal 3. Detector Workshop of the Helmholtz Alliance "Physics at the Terascale" Heidelberg 2010.
Detector lecturesT. Weidberg1 Opto-electronics Why use opto-electronics –General advantages –HEP experiments Elements of system –Emitters –Fibres –Receivers.
Opto Harness FDR 19/10/01 T. Weidberg1 Opto Harness FDR Scope and aims of review, system overview Available documentation Status of Project & Schedule.
Module Production for The ATLAS Silicon Tracker (SCT) The SCT requirements: Hermetic lightweight tracker. 4 space-points detection up to pseudo rapidity.
The LHCb Inner Tracker LHCb: is a single-arm forward spectrometer dedicated to B-physics acceptance: (250)mrad: The Outer Tracker: covers the large.
HL-LHC Standards and Best Practices Workshop (11-13 June 2014)
Performance of the DZero Layer 0 Detector Marvin Johnson For the DZero Silicon Group.
Stephanie Majewski Stanford University
LECC03, 9/30/2003 Richard Kass/OSU 1 Richard Kass Radiation-Hard ASICs for Optical Data Transmission in the ATLAS Pixel Detector K.E. Arms, K.K. Gan, M.
IEEE06/San Diego R. Kass N Bandwidth of Micro Twisted-Pair Cables and Spliced SIMM/GRIN Fibers and Radiation Hardness of PIN/VCSEL Arrays W. Fernando,
SVX4 chip 4 SVX4 chips hybrid 4 chips hybridSilicon sensors Front side Back side Hybrid data with calibration charge injection for some channels IEEE Nuclear.
DPF 2013 R. Kass 1 P. Buchholz, M. Ziolkowski Universität Siegen OUTLINE Lessons learned… IBL/nSQP opto-board overview assembly experience radiation hardness.
R. KassIEEE05/Puerto Rico N Radiation-Hard Optical Link for the ATLAS Pixel Detector Richard Kass The Ohio State University W. Fernando, K.K. Gan,
R. KassIEEE04/Rome 1 Radiation-Hard ASICs for Optical Data Transmission in the ATLAS Pixel Detector Richard Kass The Ohio State University K.E. Arms, K.K.
Si Pixel Tracking Detectors Introduction Sensor Readout Chip Mechanical Issues Performance -Diamond.
IEEE08/NSS R. Kass N Radiation-Hard/High-Speed Data Transmission Using Optical Links W. Fernando, K.K. Gan, A. Law, H.P. Kagan, R.D. Kass, J. Moore,
K.K. GanUS ATLAS Review1 Optical Hybrids K.K. Gan The Ohio State University WBS
Experience with the MVD Living around the beam pipe Components, connections, signals, systems Hubert van Hecke - Los Alamos.
K.K. GanUS ATLAS Pixel Meeting1 Opto-Board K.K. Gan The Ohio State University WBS
STATUS OF VCSEL BASED OPTO-LINKS JOSHUA MOSS, JENS DOPKE AUGUST 19, 2010 On-going analysis for the on-detector Pixel VCSELs TEMPERATURE MEASUREMENTS OPTICAL.
Semi-conductor Detectors HEP and Accelerators Geoffrey Taylor ARC Centre for Particle Physics at the Terascale (CoEPP) The University of Melbourne.
M. Lo Vetere 1,2, S. Minutoli 1, E. Robutti 1 1 I.N.F.N Genova, via Dodecaneso, GENOVA (Italy); 2 University of GENOVA (Italy) The TOTEM T1.
A.A. Grillo SCIPP-UCSC ATLAS 10-Nov Thoughts on Data Transmission US-ATLAS Upgrade R&D Meeting UCSC 10-Nov-2005 A. A. Grillo SCIPP – UCSC.
Photodetection EDIT Internal photoelectric effect in Si Band gap (T=300K) = 1.12 eV (~1100 nm) More than 1 photoelectron can be created by light in silicon.
Leo Greiner IPHC DAQ Readout for the PIXEL detector for the Heavy Flavor Tracker upgrade at STAR.
Design studies of a low power serial data link for a possible upgrade of the CMS pixel detector Beat Meier, Paul Scherrer Institut PSI TWEPP 2008.
ICTPP09 R. Kass Radiation-Hardness of VCSELs & PINs Richard Kass The Ohio State University OUTLINE Introduction/ATLAS pixel detector Radiation Hardness.
S.Hou, Academia Sinica Taiwan. 2Outline Optical links for ATLAS Laser-driver  fiber  PIN-driver LHC modules in service Rad-hard requirement for LHC/SLHC.
5th July 00PSI SEU Studies1 Preliminary PSI SEU Studies Study SEU effects by measuring the BER of the link in  /p beams at PSI. Measure the SEU rate as.
Pixel 2000 Workshop Christian Grah University of Wuppertal June 2000, Genova O. Bäsken K.H.Becks.
BTeV Pixel Detector Optical link receiver chip Data In and Out project.
Etam Noah, CERN15 th September 2004Qualification of the CMS Digital Optohybrid Outline: CMS optical digital control links DOH components DOH history and.
ATLAS PIXEL SYSTEM OVERVIEW M. Gilchriese Lawrence Berkeley National Laboratory March 11, 1999.
Michał Dwużnik, for the SCT collaboration
1 Stephen SchultzFiber Optics Fall 2005 Semiconductor Optical Detectors.
Technology Overview or Challenges of Future High Energy Particle Detection Tomasz Hemperek
Opto Electronic Readout Systems of Inner Detectors at the LHC and SLHC Cigdem Issever University of Oxford.
DPF 2011 R. Kass 1 P. Buchholz, A. Wiese, M. Ziolkowski Universität Siegen OUTLINE Introduction Result on 4-channel Driver/Receiver with Redundancy Design.
J.Ye / SMU Sept.4, 2007 Joint ATLAS CMS Opto-electronics working group, subgroup C 1 Report from sub-group C, Optical Link Evaluation Criteria and Test.
K.K. GanUS ATLAS Pixel Meeting1 Opto-IC/Board K.K. Gan The Ohio State University WBS & 4 July 9, 2003.
BTeV Hybrid Pixels David Christian Fermilab July 10, 2006.
PIN current degradation Versus 3 MeV proton fluence 3 MeV proton (a)(b) (c)(d) Study of radiation damage in VCSELs and PINs for the optical links of the.
LHCb Vertex Detector and Beetle Chip
December Status of MRS photodiodes ND280 Convener’s Meeting, 9 June 2006 Yury Kudenko INR, Moscow.
Opto Working Group Meeting Summary Tuesday 8 March 2011 Tobias Flick and Francois Vasey.
Avalanche Photodiodes from the Start.
A New Inner-Layer Silicon Micro- Strip Detector for D0 Alice Bean for the D0 Collaboration University of Kansas CIPANP Puerto Rico.
1 Single event upset test of the voltage limiter for the ATLAS Semiconductor tracker TSL Experiment Number: F151 distance between power supplies and modules.
1 FANGS for BEAST J. Dingfelder, A. Eyring, Laura Mari, C. Marinas, D. Pohl University of Bonn
`` ATLAS inner detector JV Els KoffemanAtlas - Inner Detector1 Tracking in solenoid 2 Tesla field – 3 pixel layers with 50 um x 400 um cells – 4.
TCT measurements with strip detectors Igor Mandić 1, Vladimir Cindro 1, Andrej Gorišek 1, Gregor Kramberger 1, Marko Milovanović 1, Marko Mikuž 1,2, Marko.
PIXEL 2000 P.Netchaeva INFN Genova 0 Results on 0.7% X0 thick Pixel Modules for the ATLAS Detector. INFN Genova: R.Beccherle, G.Darbo, G.Gagliardi, C.Gemme,
Next generation rad-hard links
Position Sensitive TCT Measurements with 3D-stc detectors
Status report of the ATLAS SCT optical links
Strawman module design
TTC system for FP420 reference timing?
The Pixel Hybrid Photon Detectors of the LHCb RICH
UNIZH and EPFL at LHCb.
Beam Test Results for the CMS Forward Pixel Detector
SVT detector electronics
Presentation transcript:

Ingrid-Maria Gregor (University Wuppertal) for the ATLAS collaboration June 6th, 2000 Optical Links for the ATLAS SCT and Pixel Detector International Workshop on Semiconductor Pixel Detectors for Particles and X-Rays Genova, Italy June 2000

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 2 Overview äATLAS Inner Detector äOptical Link Architecture äSystem Tests äConclusion

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 3 ATLAS Inner Detector

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 4 Data Transfer äControl and clock information must be transferred from acquisition system to the silicon detectors äHit data must be transferred from the modules to a remote acquisition system äuse of copper links unfeasible âlarge amount of dead material which would be introduced âproblems from cross-talk and ground loops äit is proposed to use custom optical links to transfer data to and from the detector modules (SCT and Pixel Detector)

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 5 Special Requirements (1) äradiation hardness âionizing radiation : 100kGy (SCT) to 550kGy (Pixel detector) â1 billion lung x-rays âneutron radiation : ãSi-devices: 1*10 15 n(1MeV)/cm 2 ãGaAs-devices: up to 6.4*10 15 n(1MeV)/cm 2 âexpected over the 10 year lifetime of ATLAS (1 st layer)

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 6 Special Requirements (2) änon-magnetic to avoid perturbing the inner detector magnetic field älow mass âadditional interactions in non-instrumented regions of the detector would compromise the quality of momentum measurements âparticle conversion äreasonably low cost

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 7 Read-Out Link Architecture Vertical Cavity Surface Emitting Laser

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 8 Timing Triggering and Control (TTC link) äVCSEL Driver BiPhase Mark Encoder ädriver chip for VCSEL on acquisition side (12 way) ä40MHz-Clock and Commands on one link

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 9 TTC Link äDigital Optical Receiver IC ädecodes the signals received by the PIN ärecovers commands and 40MHz-clock äLVDS output ä2 versions: bipolar (SCT) and CMOS (Pixel) äSCT redundancy system: TTC data can be taken from redundancy link from a neighbouring data

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 10 Data Link äVCSEL Driver Chip äLVDS input ä40Mbit/s (SCT), 80Mbit/s (Pixel 1st and 2nd layer) or 160Mbit/s (B-layer) äNRZ (20MHz = 40Mbit/s) ä2 versions: bipolar (SCT) and CMOS (Pixel) äSCT: in the event of failure, the data can be rerouted through the second link äPixel: one link for outer layers, two for B- layer (160MBit/sec)

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 11 Opto-Package Specs äCustom package made of material with low Z, non- magnetic, with 2 VCSELs and 1 PIN äFibres attached without standard connector änot larger than 5.5 mm x 5.5 mm x 1.6 mm äpackage and including devices have to stand radiation levels äoperation temperature during testing: -25 o C to 40 o C äoperation temperature during ATLAS: -25 o C to 15 o C äthree different designs under survey

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 12 Taiwan Opto-Package

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 13 Taiwan Opto-Package 5.5 mm

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 14 Taiwan Opto-Package

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 15 Opto-Elbow (Pixel) Module Pigtail Opto Elbow Bending Zone Solder Connection Single Side Glue Attachment & Wire Bonding DORICVDC Opto-Package

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 16 Opto Package Support (SCT) VDC (VCSEL Driver Chip) DORIC (Receiver Chip) VCSEL/PIN Package ZIF Connector Kapton Cable Opto Hybrid Module Connector

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 17 System Tests äCharacteristics of opto-link for this system under test: âRadiation and Annealing studies âLifetime studies âBit Error Rate âSingle Event Upsets

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 18 Annealing Studies of VCSEL 00:0024:0048:0072:0096:00 0,0 0,2 0,4 0,6 0,8 1,0 Average Relative Light Output (RLO) Annealing time [h] RLO of VCSEL (group A) annealed at 10mA RLO of VCSEL (group A) annealed at 20mA RLO of VCSEL (group B) annealed at 10mA RLO of VCSEL (group B) annealed at 20mA Light Output before Irradiation Light Output after Irradiation RLO = Radiation levels:

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 19 VCSEL tests äVCSELs were not powered during irradiation äradiation induced damages can be annealed up to 90% over a period of days/weeks äresults suggest brief 20 mA current annealing sessions äfollowing aging tests showed an expected lifetime of a few hundred years (irradiated) äfurther irradiation and lifetime tests are under way (up to Pixel level of 6.4*10 15 n(1MeV)/cm2)

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 20 Bit Error Rate (BER) äBER: good parameter to evaluate the performance of the optolink äGood results with SCT link äPixel test under way

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 21 Single Event Upsets äSingle Event Upsets caused by a very high energy deposition in a small volume of electronics chips ämost sensitive region: reverse-biased p/n junction where high electric field is very effective in collecting the charge by drift äPIN = reverse biased p/n junction  100m x 50m x 50m ! äFirst SEU appearance : NPL neutron beam ätest with pions at PSI

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 22 SEU at PSI  Sensitive power around 100W  for P>350W, BER < s -1 ädiscrepancy between counter and Al foil ärepeat next week

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 23 Conclusion ädata transfer using optical links äcustom packaging developments for the 40 Mb/s optical link show good physical results ädesign of complete Pixel opto-link under way äradiation induced damages can be annealed up to 90% over a period of days äresults suggest brief 20 mA current annealing sessions äSEU problems can be fixed by sending more light

Pixel2000 Genova, Italy Ingrid-Maria Gregor University of Wuppertal 24 Conclusion ä Optolink/Pix_Optolink.html