New Developments in Large Area THGEMs & APV Exercise INFN – Sezione di Trieste Carlos Alexandre Fernandes dos Santos 11/December/2014.

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Presentation transcript:

New Developments in Large Area THGEMs & APV Exercise INFN – Sezione di Trieste Carlos Alexandre Fernandes dos Santos 11/December/2014

THGEM Hybrid Detector + APV Readout Contents Large Area THGEMs Motivation 2 Setup & Results obtained Conclusions Setup & Results obtained Conclusions and future work

THGEM Hybrid Detector + APV Readout 3

Motivation of the Exercise Hybrid Detector (2 x THGEM + Micromesh) tested at the 2014 T10 TestBeam THGEM with 6 Sectors Double THGEM: t = 0.4 mm; p = 0.8 mm; h = 0.4 mm 4 Bulk Micromesh

Motivation of the Exercise Hybrid Detector (2 x THGEM + Micromesh) tested at the 2014 T10 TestBeam 576 Anode Pads (12mm X 12mm) PCB 0.10 mm fiberglass Metallic pads HV to blue pad through the hole of red pad ◦Scheme (not to scale) ◦Only 1 single pad shown ◦Principle ◦Blue pad at HV via internal connection ◦Resistive (individual pad resistor at the PCB rear surface) ◦Red pad: signal induced by RC coupling 5

Motivation of the Exercise Analogue Readout: Charge Sensitive pre-amplifier Cremat (CR110/111) + Ortec Amplifier + Amptek MCA Readout through 16 pads connected together by the connector shown in the picture. Gain determination: ≈ DREISAM CARD ROOF Board CMAD Boards Protection Boards Readout chain: same as RICH-1 – MAPMT ◦C-MAD ◦Roof ◦DREISAM card Digital Readout: 6

Motivation of the Exercise What causes such high noise level?! Detector? Electronics?! Coupling of a hybrid detector to our digital electronics?? APV RD51 Lab (thanks for the help provided) 7 Differentiated noise threshold: [~7;~12] fC 320 pads of 576 switched off because of even higher noise. Digital Readout Data: Cherenkov Ring

Setup 8

Exercise Setup 4 (short) days in the RD51 Laboratory 300 x 300 mm 2 double THGEM Hybrid detector in Ar/C0 2 (70/30) atmosphere ◦It is the detector used at the test beam, no change of THGEM/MM New double Kapton and Quartz window equipped ◦Iron 55 source ◦UV led Sepia LED 245 nm + PLD 800 pulser max pulsing rate 10 MHz DAQ ◦Standard CR110 pre-amplifier + Ortec amplifier + MCA ◦DATE based with APV FE cards SRS system and AmoreSRS 9

Analogue Readout test Gain ≈ 27 k 3 fC Signal Amplitude Distribution Data acquisition for testing the system Gain Determination for comparison with APV Irradiation with the UV LED 10 Exponential fit for gain determination The conditions (Voltages and Gas) used to obtained this gain were kept unchanged during the whole APV exercise.

First Issue  Noise of the chip when free (intrinsic) When coupled to the detector Offset from the ideal ADC channel rms of the noise for each channel ADC Channel  Charge calibration 232 electrons per ADC channel Configuration 2 Apv chips 1 master, 1 Slave, Interface board for our 2x8 connector to the Panasonic; 1 chip 128 ch  16 connectors of 8 pads each APV-First tests Calibration of the gain and measurement of the noise for the apv25 electronics K. Gnanvo, N. Liyanage, C.Gu, K. Saenboonruang RD51 collaborators 11

APV-First tests: 1 chip connected to the detector; 1 free; HV OFF Free APV APV Connected to Detector Typical APV offset behavior: related to the chip implementation ok Channel id ADC counts Noise RMS Offset Free APV APV Connected to Detector Correlation between noise structure and length of the paths APV Connection board 12

APV-First tests: 1 chip connected to the detector; 1 free; HV OFF Channel id ADC channel ADC counts Noise RMS RMS Distribution Free APV APV Connected to Detector RMS max (connected)= 5 ADC In the worse case a threshold cut on the amplitude at 5 times the RMS of the channel, corresponds to a cut of only 1 fC. 13

APV-First tests: Timing issue Events with peak time before or after the acquired time buffer all the events recorded in the 27 x 25 ns memory buffer (675 ns). 10 MHz Led pulsing with a photon detection efficiency of 2-3%  expected rate 15% Flat time distribution in the time buffer Time / ns Time Distribution of Events Photo of one the first visualised signals, acquired in the thrill of the moment. 14

APV-First tests: events Event Over Threshold, that enters the histogram (AmoreSRS) From pedestal file: -remove the baseline offset -compute the RMS after common mode subtraction -cut on the amplitude at 5 times the RMS of the channel Signal Amplitude Distribution Signal Amplitude Distribution per channel Position Distribution of Events Time Distribution of Events 15 Exponential distribution as expected for Single Photon Detection Photon detection in different pads as expected Flat time distribution as expected due to the random trigger

APV-First tests: N1471A vs N471A This exercise shows similar results between the two power supplies N1471A Chip 0 Chip 1 ADC channel N1471A N471A RMS Distribution Entries In the analogue readout, the N1471A unit introduces a modular noise! N1471A connected to Drift and to HV pads all the other layers to our standard N471A 16

APV-First tests: different shaping time Standard APV setting (100 ns ???) 200 ns shaping time 25ns shaping time RMS Distribution Signal Amplitude Distribution ADC channel Entries Gain ≈ 37 k Gain ≈ 30 k Gain ≈ 40 k 17 No significant effect of the shaping time in the noise RMS

APV Exercise Conclusions 18 The short studies point to low noise (possible to cut at 5 x RMS = 1fC) when coupling the APV chips to the capacitive hybrid detector. The HV units N471A and N1471A seem to behave similarly when using the APVs as readout. Gain Determination through the APV readout matches the gain determined through the analogue readout (although it depends on the shaping time). Shaping time does not influence the RMS Distribution.

Large Area THGEMs (300 mm x 600 mm) 19

Motivation Goal: RICH Detector with an active area of 600 x 600 mm x 30 mm x 300 mm x 600 mm x 600 mm 2 Thickness PCB variance as big as 15% Gain Variance > 40% example THGEM: t = 0.8 mm; p = 0.8 mm; h = 0.4 mm Gain variance: 14% Measure thickness of raw PCB (< 5%) Polish Ultrasonic Cleaning Distilled Water cleaning 160 ºC Higher Max ΔV More uniform gain example THGEM: t = 0.4 mm; p = 0.8 mm; h = 0.4 mm 20

Motivation Goal: RICH Detector with an active area of 600 x 600 mm x 30 mm x 300 mm x 600 mm x 600 mm 2 Measure thickness of raw PCB (< 5%) Polish Ultrasonic Cleaning Distilled Water cleaning 160 ºC Gain Characterization (4 THGEMs for Characterization) 21

22

Due to mechanical constrains, upper line (A) was not used! Despite 12 THGEM sectors, the characterization is done by grouping these sectors in groups of two, due to the design of the readout boards 23

Thickness #01 & #02 Respectively (units: um) 24

Setup Anode THGEM Kapton + Mylar/Al Window ≈ 2 cm 3 mm Gas mixture: Ar/CO 2 (70:30) Analogue readout chain: Cremat pre-amplifier (CR110) + Ortec Amplifier + Amptek MCA E drift = 1 kV/cm E induction ≈ 1.5 kV/cm Irradiation with 55 Fe (Gain determination through the 55 Fe main peak) 4 THGEM available! (#01 - #04) Each THGEM tested: ≈ 180 spectra!! #01#02#03#04 Max ΔV1310 V1300 V 1330 V THGEM Max ΔV Summary Results are comparable to the ones obtained for 300 x 300 mm 2 pieces under the same circumstances! 25 (Maximum ΔV that the THGEM can stand, in the referred gas mixture, with recoverable discharges.)

THGEM #01 Fixed ΔV=1300V 55 Fe main peak GAIN Escape Peak The deformation of the main peak is due to different gains of the two sectors that are measured together Due to HV offsets Gain equalization at 1 average sector 26

Gain equalization for #01 ΔV 1E = 1297 V ΔV 2E = 1285 V ΔV 3E = 1296 V ΔV 4E = 1297 V ΔV 5E = 1282 V ΔV 6E = 1272 V ΔV 7E = 1296 V ΔV 8E = 1295 V ΔV 9E = 1297 V ΔV 10E = 1290 V ΔV 11E = 1320 V ΔV 12E = 1332 V ΔV max – Δv min = 60 V Equalized GAIN To eliminate the effect of the HV offset, the HV of each unit is tuned so that the gain along sector E is equalized at 200. Why sector E?? It corresponds to a sector with an average gain for all vertical sectors By equalizing the gain, the second component of the main peak disappeared 27

THGEM #01 & #02 Comparison ΔV 1E = 1297 V ΔV 2E = 1285 V ΔV 3E = 1296 V ΔV 4E = 1297 V ΔV 5E = 1282 V ΔV 6E = 1272 V ΔV 7E = 1296 V ΔV 8E = 1295 V ΔV 9E = 1297 V ΔV 10E = 1290 V ΔV 11E = 1320 V ΔV 12E = 1332 V ΔV max – Δv min = 60 V ΔV 1G = 1307 V ΔV 2G = 1303 V ΔV 3G = 1307 V ΔV 4G = 1310 V ΔV 5G = 1291 V ΔV 6G = 1280 V ΔV 7G = 1307 V ΔV 8G = 1305 V ΔV 9G = 1302 V ΔV 10G = 1306 V ΔV 11G = 1341 V ΔV 12G = 1337 V ΔV max – Δv min = 61 V Equalized GAIN THGEM #01 Equalized GAIN THGEM #02 Gain variation: 22% Gain variation: 23% 28

THGEM #03 & #04 Comparison ΔV 1G = 1301 V ΔV 2G = 1293 V ΔV 3G = 1303 V ΔV 4G = 1308 V ΔV 5G = 1291 V ΔV 6G = 1275 V ΔV 7G = 1303 V ΔV 8G = 1301 V ΔV 9G = 1298 V ΔV 10G = 1302 V ΔV 11G = 1338 V ΔV 12G = 1336 V ΔV max – Δv min = 63 V ΔV 1H = 1308 V ΔV 2H = 1302 V ΔV 3H = 1309 V ΔV 4H = 1310 V ΔV 5H = 1296 V ΔV 6H = 1283 V ΔV 7H = 1306 V ΔV 8H = 1306 V ΔV 9H = 1305 V ΔV 10H = 1306 V ΔV 11H = 1339 V ΔV 12H = 1336 V ΔV max – Δv min = 56 V Equalized GAIN THGEM #03 Equalized GAIN THGEM #04 Gain variation: 23% Gain variation: 20% 29

Large Area THGEMs Conclusions 300 x 600 mm 2 THGEMs present an approximately equal behaviour to its predecessor (300 x 300 mm 2 ). All pieces have maximum gain in the same point  Anode problem?!  gain variance, not taking these points into account, for THGEM #01, #02 and #03 is respectively: 17%; 11%; 16%. These Studies show that we are in the right track and further studies can be performed. 30

Conclusion and next steps 30 x 30 mm x 300 mm x 600 mm x 600 mm 2 Measure thickness of raw PCB (< 5%) Polish Ultrasonic Cleaning Distilled Water cleaning 160 ºC Gain Characterization Operation in Hybrid mode with single THGEM Operation in Hybrid mode with double THGEM 31

Future Work 30 x 30 mm x 300 mm x 600 mm x 600 mm 2 example THGEM: t = 0.8 mm; p = 0.8 mm; h = 0.4 mm 32

End Thanks for your attention 33