IBM Foundry Oxide Thickness LithographyProcessOperatingOxide NameVoltageThickness nm 0.25 µm6SF2.55 3.37 0.13 µm8RF1.2 & 1.52.2 2.2 & 3.35.2 Satish Dhawan,

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IBM Foundry Oxide Thickness LithographyProcessOperatingOxide NameVoltageThickness nm 0.25 µm6SF µm8RF1.2 & & Satish Dhawan, Yale UniversitySeptember 21, 2009

CompanyDeviceProcessFoundryOxideTime inDose beforeObservation Name/ Number NameThickness SecondsDamage seenDamage Mode Countrynm IHPASIC customSG25V GODIHP, Germany5 53 Mrad slight damage XySemiFET 2 ampsHVMOS China7 52 Mrad minimal damage XySemiXP2201HVMOS China7 In Development XySemiXPxxxx HVMOS China7 In Development Synch Buck XySemi XP5062 China krad loss of V out regulation TI TPS54620LBC µm krad abrupt failure IRIR & Krads loss of Vout regulation EnpirionEN5365CMOS 0.25 µm Dongbu HiTek, Korea5 11, krad Increasing Input Current, EnpirionEN5382CMOS 0.25 µm Dongbu HiTek, Korea Krads loss of V out regulation EnpirionEN5360 #2SG25V (IHP)IHP, Germany522 Days 100 MradsMinimal Damage EnpirionEN5360 #3SG25V (IHP)IHP, Germany510 Days 48 MradsMinimal Damage Non IBM Foundry ICs Satish Dhawan, Yale UniversitySeptember 21, 2009Satish Dhawan, Yale UniversitySeptember 21, 2009

OxideSiGate Oxide Trap Region Tunneling Region Thickness ~ 5 nm Fig A: Physical Location of Defects from their Electrical response in CMOS devices; ref T.R> Oldham Fixed Charge States Switching Charge States GNDSwitching Charge States V

Source HEMT Pulse Generator 0.1 – 2 MHz 50 % Duty Cycle July FET Setup for Proton Radiation LANSCE. ~ Amps Power Supply V out = 20 Drain Gate to -5 V Powered FET DMM DC mV Watts 1 Ω GND 50 Ω Terminator 2 Shorted FETs G D S Pomona Box Reading = ~ % Duty Cycle No change in the average current for 200 Mega rads 30 meter Coax

Model 250 Yale University May 22, 2008 Relay Current Out Vout/ Load Current IN Voltage IN Input Power 0.5 Ohms 0.05 Ohms Output Power To Keithley Instruments 2701 Scanning Voltmeter with 7706 Card A Board: Channels B Board: Channels C Board: Channels D Board: Channels R Red Orange BK/O Black Blue Green Blue/Y or Black Yellow Power Cable Colors Molex 9 pin Female Molex 9 pin Male DC-DC Evaluation Board 8 Fly Wires Solder to Eval Board 5 ft Length Can Add Extender Cable DAC: 123, 124 DIO : 121, CHANNEL Numbers

Power Supply VInput 5.5 V max to prevent damage. GND Buck Regulator Eval Board Size = 3 inch x 3.5 inch Banana Jacks / Solder Wires Satish Dhawan, Yale University Load Resistor = 0.3 to 1.5 Ώ Line Drop ~ amps in each Leg ??? Twisted Pair Preferred V Input Monitor. 2 Wire Differential V Output Monitor 2 wire Differential Agilent 34970A & Multiplexer 33901A to Monitor I & V April DC-DC Regulator Setup for Radiation Exposure GND V Output = 1.5 V. 1 to 5 Amps. ~ 0.5 Amps. V out > 5 – 20 Volts 4 Wire Current shunt V Output Monitor 2 wire Differential 4 Wire Current shunt V Output Monitor 2 wire Differential DC-DC Converter Voltage ratio = 8/10 Load: Rated Current or maximum without cooling ~ 1 amp Setup for 4 EVAL Boards Measure Bias Current with Load disconnected Solder all wires ???? Switch on/off