Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 CHAPTER 5.

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Presentation transcript:

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 CHAPTER 5

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Master Figure

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.1 Smart Personal Assistant Smart Miniaturized Bio Implant Cell Phone TODAY Cell Phone NEAR FUTURE Fully Embedded FUTURE DISCRETE LIMITED COMPONENT INTEGRATION FULL INTEGRATION (Courtesy: Chosun) Camcorder Audio Game Digital Camera Cell Phone TV MP3 GPS Computer

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.2 Board IC Package Discrete Nanoscale % System 80-90% System Milli-scale Low functional density Bulky Costly Low reliability Connectors Board IC Package Discrete Nano-scale % System % System Milli-scale Low functional density Bulky Costly Low reliability Connectors

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.3 TRANS- CEIVER/ PHY TRANS- CEIVER/ PHY BASE- BAND/ MAC BASE- BAND/ MAC CMOS RF-CMOS or SiGe Simple RF Maybe SoC PA LNA Switch Active Passive RF Front End No Moore’s LawMoore’s Law Works

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.4 Package LNA Mixer VCO PA Antenna Filter Balun High-Q L/C Inductors Driver Amp Duplexer Switch Power Combiner Resistors Capacitors Duplexer Fluidics Duplexer MEMS MMIC CMOS

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig micron lithography PAST Ceramic thick film 200 microns Lithography CURRENT 100 components/cm 2 50 micron Lithography FUTURE (10X reduction in X, Y and Z) MEMSBAW GaAs RFCMOS 1000 components/cm 2

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.6 Modeling Simulation Miniaturized Multifunction RF Systems Substrate Technologies Reliability Antennas RFIDs Switches Passive/ Active Passive Components Passive Circuits  Ceramic  Glass  Organic  Silicon  Capacitors  Resistors  Inductors  Filters  Duplexers  Baluns  Couplers  Combiners  Dividers

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.7 a, b (a) (b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs. 5.8 a, b, c

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.9

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.10

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.11

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b Shielding metal case Folded flexible LCP layer Thru holes Signal line on M1 (a)(b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b (a)(b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b (a)(b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b (a)(b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.16

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.17

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.18

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.19

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig Air Cavity Ground plane Inductor Dielectric

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig Ground plane via h d

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.22

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.23

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.24

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b Frequency (GHZ) Resistance (Ohm) (a)(b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.26

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b, c Freq (2.00 GHz to GHz) S(2,2) S(1,1) (a)(b)(c)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.29

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig Return loss Insertion loss Frequency (GHz) Magnitude (dB) Simulated Measured

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.31

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.32

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b, c (a) (b) (c)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b, c (a)(b) (c)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig Frequency (GHz) Magnitude (dB) S21 S11

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b (a) (b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b (a) (b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.38

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b (a) (b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.40

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b (a) (b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Fig. 5.42

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b (a) (b)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b, c (a) (b) (c)

Introduction to SYSTEM-ON-PACKAGE(SOP) Miniaturization of the Entire System © 2008 Figs a, b (a) (b)