1 Physics of Compressed Baryonic Matter 12 th CBM Collaboration Meeting R&D ON MICRO-CABLES FOR BABY SENSOR RADIATION TEST MODULE October , 2008 JINR, Dubna, Russia Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine

2 DEMONSTRATOR 0-b BABY SENSOR RADIATION TEST MODULE Dubna, October, LEMO connectors – 4 pcs 5. Flexible sensor cables – 4 pcs 6. SMD resistors 1MΩ on flex mounts – 4 pcs on flex mounts – 4 pcs 7. Jumpers for bias line – 4 pcs Test module consist of: 1. Baby sensor CBM01B2 – 1 pcs 2. Flexible-rigid board – 1 pcs 3. ERNI connectors on flex mounts – 8 pcs on flex mounts – 8 pcs

3 CONNECTING CIRCUIT OF MODULE Schematic view of strip to connectors connection Front sideBack side October, 2008

4 FLEXIBLE BOARD Material: Material: foiled dielectric FDI-A-50 Sensor cable bonding area : Pitch= 300 um; Width of pads = 200 um. 200 um. ERNI-flex-mount onding area : ERNI-flex-mount bonding area : Pitch= 635 um; Width of pads = 500 um. 500 um. Polyimide layer Thickness  20 um Aluminum layer Thickness  30 um October, 2008

5 SENSOR CABLES Technologically zone Testing zone Work zone Material: Material: foiled dielectric FDI-A-24 Sensor bonding area: Pitch= 101,4 um; Width= 34 um. Board bonding area: Pitch= 300 um; Width= 80 um. Polyimide layer Thickness  10 um Aluminum layer Thickness  14 um October, 2008

6 TESTING OF CABLES October, 2008 The Sensor cable design provided 100% automatically test (shorts, traces breaks) before assembly with applying of a standard contact device for testing Contact device on the basis of Socket IC Sensor cables in the frame ТАВ-70

7 FLEX-MOUNTS FOR SMD & ERNI CONNECTORS Board bonding area: Pitch= 300/635 um; Width= 100 um. Polyimide layer Thickness  20 um Aluminum layer Thickness  30 um Ni + Sn-Bi layer Thickness  3+8 um October, 2008 Material: Material: foiled dielectric FDI-A-50 Dual row male connector: type B ERNI model ( 68 pins) Resistors (1MΩ)

8 ASSEMBLING SCHEME OF MODULE October, 2008

9 MODULE ASSEMBLING – PART 1 ASSEMBLING OF SENSOR WITH CABLES N - side P - side October, Ultrasonic bonding of Flexible cables to Sensor (N-side): (128 traces + 2 bias) x 2 = 260 bonds 2. Bonds protection (Glue EpoTec T7110) 3. Rotation of sensor 4. Ultrasonic bonding of Flexible cables to Sensor (P-side): (128 traces + 2 bias) x 2 = 260 bonds 5. Bonds protection (Glue EpoTec T7110)

10 MODULE ASSEMBLING – PART 2 ASSEMBLING OF FLEXIBLE-RIGID BOARD October, Gluing of “Balconies” to Rigid board (Glue Araldite2011) 2. Gluing of Flexible board to Rigid board (Glue UP ) 3. Mounting of SMD on flex-mounts to Flexible-rigid board. US-bonding: 6 x 4 = 24 bonds and bonds protection (Glue EpoTec T7110) 4. Mounting of ERNI on flex-mounts to Flexible-rigid board. Gluing, US-bonding: 64 x 8 = 512 bonds, soldering and bonds protection (Glue EpoTec T7110) “Balconies” Trough window for sensor mounting

11 MODULE ASSEMBLING – PART 3 MOUNTING OF SENSOR ASSEMBLY TO BOARD October, Soldering of LEMO connectors to Flexible-rigid board. 2. Mounting of Sensor assembly to Flexible-rigid board. Gluing (Glue Araldite2011), US-bonding: 130 x 4 = 520 bonds and bonds protection (Glue EpoTec T7110) As a result of activity were manufactured: 1 technological and 2 working modules. (Total of bonded connections at one module 1600)

12 TECHNOLOGICAL FEATURES OF ASSEMBLY October, 2008 Three types of wedges (Gaiser Tool ) for single-point TAB bonding: - Cables to sensor – GT B; - Cables to board – GT B; - Flex-mounts to board – GT B. Bonding of Cable to Sensor (N-side) Bonding of Cable to Sensor (P-side) Bonding of Cable to Flexible-rigid board Pool strength: - Cables to sensor (N-side): 6-7 gram ; - Cables to sensor (P-side): 7-8 gram ; - Cables to board: gram.

13 TEST MODULE FOR CBM01B2 BABY- SENSOR RADIATION TEST Front side Back side October, 2008 We hope, that the experience, acquired by us, at development of a design, improvement of assembling technique and manufacture of test module on the basis of flexible-rigid boards will be useful for collaboration in the future for next investigations of baby sensors for CBM and NICA.

14 ACTIVITY ON THE DEMONSTRATOR Nr.1 SELECTION OF VARIANT October, 2008 Conceptional design of the mechanics of the CBM STS ladder (for Demonstrator Nr.1) offered by S.Igolkin Option 1: “Old” Option 2: “Angle tiling” Option 3: “Flat tiling”

15 OPTION 3: ADVANTAGES AND LIMITATION October, 2008 In our opinion, from the point of view of usage the flexible aluminium – polyimide cables and manufacturability of Modules & Ladders assemblies, most reasonable looks Option 3 “Flat Tiling”- with flat arrangement of sensors with overlapping, but without a bend of a cable. Limitations for Option 3: - The gap between sensors for the safe passing of a cables: The gap offered on the drawing 0,5 mm is reasonable. - The gap between sensors and frame: The gap offered on the drawing also is reasonable (minimum gap 2mm at placing one cable; maximum gaps of 5,2 mm and 4,4 mm at placing seven cables). -The gap between sensors for in Module : The gap offered on the drawing 0,5 mm. For determination of gap between sensors in Module (the connection of sensors by daisy-chain cables) it is necessary to select variant of strip arrangement in a sensor (for both sides).

16 SENSOR TOPOLOGY PROPOSAL October, 2008 From the point of view of further assembly of sensors in modules, the optimal variant would be changing of strip rotation: from 15  on Р-side and 0  on N-side to 7,5  on both sides. Thus width of bonding contact pads is necessary to reduce from 80um up to 60um, that will allow to arrange bonding contact pads in parallel to sides of a sensor. It considerably will simplify further assembly, and also will allow to utilize identical cables for N- and P-sides with straight lines. In case of arrangement of contact pads with angles 0  and 15  will be necessary to use one cable with straight lines and second - with rotated lines 15  (that not manufacturability at pitch of lines 50-60um. Besides the adjustment of cables with a sensor on rotated pads is more difficult than on pads which are placed parallel to sensor side.

17 Kind of connections of Daisy-chain cables to sensor (Demonstrator Nr.1) October, 2008 Variant of commutation for sensors with 7.5 and 7.5 degrees strip rotation. TAB-bonding (Pitch  60um) Sensor bonding area

18 Kind of connections of Analog cables to FEB (Demonstrator Nr.1) October, 2008 Analog cable bottom layer Analog cable top layer Output: Pitch 50.7 um (two rows at 101.4um) Kind of connection with using of pitch-adapter will ensure fan-in of Analog cable traces pitch from 120 microns to chip pads pitch 50 microns. In this case the Analog cable can be TAB-bonded to pitch- adapter pads; and the chips can be wire-bonded to pitch-adapter pads. TAB-bonding (Pitch  120um) Wire-bonding (Pitch 50.7um) Input: Pitch  60 um (two rows at  120um) Pitch-adapter Sensor Double-deck analog cable Front-End Board

19 TYPES OF FLEXIBLE CABLES FOR DEMONSTRATOR NR.1 October, 2008  um Width of trace  um  60 um Pitch of trace  60 um 1024 (+bias?) Quantity of traces 1024 (+bias?) Demonstrator Nr.1 will need development of following flexible cables: 1. Daisy-chain cable: 2 types; 2. Analog cable: min 16 types (or 32 types). Daisy-chain cable Material: foiled dielectric FDI-A-24 thickness: of Al layer  um of polyimide layer  10 um Sensor bonding area Hybrid bonding area (adapter?) Analog cable  40 um Width of trace  40 um  120 um Pitch of trace  120 um 512 (+bias?) Quantity of traces 512 (+bias?) Material: foiled dielectric FDI-A-20 thickness: of Al layer  10 um of polyimide layer  10 um

20 PROBLEMS AND TASKS October, Select and agree of sensor topology. 2. Select and agree of ladder arrangement. 3. Select and agree of connection to FEB. 4. Development and investigation of technological processes for Module & Ladder assembling. 5. Development of flexible cables design. 6. Status of assembling sites for Demonstrator Nr.1? 7. Status of test equipment for testing of module components?

21 October, 2008 Thank you for your attention