January, 2007Vaclav Vrba, Prague FVTX Strip Sensor Design General features:  Strip pitch = 75 µm  # chip channels = 128;  chip width = 128 x 75 µm =

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Presentation transcript:

January, 2007Vaclav Vrba, Prague FVTX Strip Sensor Design General features:  Strip pitch = 75 µm  # chip channels = 128;  chip width = 128 x 75 µm = 9600 µm  Forward disk radial coverage (cca) = 17.0 – 4.5 cm = 12.5 cm  # of chips = 12.5 cm/0.960 cm = 13 chips  azimuthal coverage is by 24 wedges; each wedge covers angle of 7.5 º + 2 x 1 mm overlap  each wedge consists of two symmetric parts (each covering 3. 75º) + 1 mm overlap  to place on 4” wafer: 2 types of wedges are needed: narrow and wide (next page)  both type wedges we made of the same radial coverage (each 7 “chips”, with 1 chip overlap)

January, 2007Vaclav Vrba, Prague Narrow and wide wedges Two narrow wedges on a waferOne wide wedge on a wafer

January, 2007Vaclav Vrba, Prague Narrow and wide wedges Standard position Shifted – just to see the radial overlap The radial overlap is probably too big; may be the “wide” wedge can be (by one “chip”) shorter – please comment one chip

January, 2007Vaclav Vrba, Prague Wedge layout Zoom in … one chip testing pads (both staged) bonding pads

January, 2007Vaclav Vrba, Prague Wedge layout 7.5 deg. coverage 1 mm overlap Guard ring Cut line

January, 2007Vaclav Vrba, Prague Wedge layout

January, 2007Vaclav Vrba, Prague Conclusions See mail